Patent US4307601A successfully refreshed from Google Patents.
EP0476971A2
Expired / Lapsed
EP
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Ceramic packages and ceramic wiring board
Assignee: NGK Insulators Ltd
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Filing: 1991-09-17
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Granted: —
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Expires: 2011-09-17
Abstract
Abstract A ceramic package for containing a semiconductor chip (3) including a heat radiating plate (1) and a base plate for wiring, and a ceramic package for containing a semi-conductor chip including a ceramic board (4), a ceramic cap (9) and a metal lead frame; in these packages the heat radiating plate and the ceramic board are made of silicon nitride sintering body. And, a ceramic wiring board, in which a ceramic used as a material of the ceramic base plate is made of polycrystal body of silicon nitride characterized in that the number of grain boundaries of silicon nitride per 10 µm of a straight line drawn in an arbitrary section of the polycrystal body is 20 or fewer.
Inventors
- 👤 Hiroaki Sakai
- 👤 Shinsuke Yano
- 👤 Takao Soma
- 👤 Manabu Ngk Yagoto-Ryo Isomura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 11:00
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H10W40/00; H10W40/20; H10W40/25; H10W40/259; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/692; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
40 words
Ceramic package for containing a semiconductor chip comprising: a heat radiating plate made of silicon nitride for mounting a semiconductor chip thereon; a wiring board comprising a wire distribution for transferring electric signals and a wire distribution for power supply.
Claim 2
Dependent Claim
47 words
Ceramic package for containing a semiconductor chip according to Claim 1, wherein: said heat radiating plate is made of silicon nitride characterized in that the number of grain boundaries contained therein is 20 or less per 10 µm of straight line drawn in an arbitrary section thereof.
Claim 3
Dependent Claim
41 words
Ceramic package for containing a semiconductor chip according to Claim 1 or 2, wherein: said heat radiating plate is made of silicon nitride characterized in that the silicon nitride contains 0.3 wt% or less of an aluminum when calculated as alumina.
Claim 4
Dependent Claim
30 words
Ceramic package for containing a semiconductor chip according to any one of Claim 1 or 3 wherein; an insulating material used in said wiring board is made of mullite ceramic.
Claim 5
Dependent Claim
58 words
Ceramic package for containing a semiconductor chip according to any one of Claim 1 or 3 wherein: an insulating material used in said wiring board is made of ceramic sintered at a temperature of 1100°C or less; wire distribution conductors formed in the base plate is made of Ag series metal, Cu series metal or Au series metal.
Claim 6
Dependent Claim
29 words
Ceramic package for containing a semiconductor chip according to any one of Claim 1 wherein: an insulating material used in said wiring board is made of polyimide series resin.
Claim 7
Dependent Claim
74 words
Ceramic package for containing a semiconductor chip comprising: a ceramic base for mounting a semiconductor chip thereon being made of silicon nitride sintering body; a ceramic cap for covering said ceramic base being connected to said ceramic base by means of glass or agent of resin in order to seal up the semiconductor chip in the package; and a lead frame made of metal being arranged between said ceramic base and said ceramic cap.
Claim 8
Dependent Claim
55 words
Ceramic package for mounting a semiconductor chip according to Claim 7, wherein; said ceramic base is made of silicon nitride body characterized in that the number of grain boundaries of silicon nitride contained in said silicon nitride body 20 or fewer per 10 µm of straight line drawn on an arbitrary section of said body.
Claim 9
Dependent Claim
41 words
Ceramic package for mounting a semiconductor chip according to Claim 7 or 8, wherein; said ceramic base is made of silicon nitride body characterized in that 0.3 wt% or less of aluminum when calculated as alumina is contained in the base.
Claim 10
Dependent Claim
53 words
Ceramic wiring board being characterized in that: ceramic used as a material of the board is made of polycrystal body of silicon nitride; and the number of grain boundaries of said polycrystal body is 20 or fewer per 10 µm of a straight line drawn in an arbitrary section of the crystal body.
Claim 11
Dependent Claim
38 words
Ceramic wiring board distribution according to Claim 10, wherein: said ceramic used as a material of the board is made of polycrystal body of silicon nitride which contains 0.3 wt% or less of aluminum when calculated as alumina.
Claim 12
Dependent Claim
47 words
Ceramic base plate for wiring according to Claim 10 or 11, wherein; the ceramic board has a composite structure that comprises a first board made of said polycrystal body and a second board made of a material whose composition is different from that of the polycrystal body.
References Cited (Backward Citations)
No citation records indexed.
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