Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
161 words
A surface acoustic wave device comprising: (a) a surface acoustic wave element having an input electrode, an output electrode and an earth electrode, formed on one of the surfaces; when a signal of a designated frequency range is applied between the input electrode and the earth electrode, surface acoustic wave is generated; the surface acoustic wave is received by the output electrode and an electric signal is generated between the output electrode and the earth electrode; (b) a surface mount package having an input pad, an output pad and an earth pad, formed on the surface; the input pad, the output pad and the earth pad are placed on the surface of the surface mount package so that they face the input electrode, the output electrode and the earth electrode, respectively; and (c) a connection means that electrically connects the input pad, the output pad and the earth pad with the input electrode, the output electrode, and the earth electrode, respectively.
Claim 2
Dependent Claim
43 words
A surface acoustic wave device according to claim 1, wherein the connection means is a metal bump; the metal bump contains metal and electrically connects between the pads and electrodes when at least one of heat, pressure and a supersonic wave is applied.
Claim 3
Dependent Claim
17 words
A surface acoustic wave device according to claim 2, metal contained in the metal bump is gold.
Claim 4
Dependent Claim
40 words
A surface acoustic wave device according to claim 1, wherein the earth pad is formed on predetermined area of the surface of the surface mount package except gap areas, along the border of the input pad and the output pad.
Claim 5
Dependent Claim
48 words
A surface acoustic wave device according to claim 1, wherein the surface acoustic wave device includes a high resistance pattern that is formed on the surface of the surface mount package, and connects, with high resistance, the earth pad with either the input pad or the output pad.
Claim 6
Dependent Claim
38 words
A surface acoustic wave device according to claim 5, wherein the electrical conductivity of a material forming the high resistance pattern is lower than the electrical conductivity of materials that form the input pad or the output pad.
Claim 7
Dependent Claim
48 words
A surface acoustic wave device according to claim 4, wherein the surface acoustic wave device includes a high resistance pattern that is formed on the surface of the surface mount package, and connects, with high resistance, the earth pad with either the input pad or the output pad.
Claim 8
Dependent Claim
38 words
A surface acoustic wave device according to claim 7, wherein the electrical conductivity of a material forming the high resistance pattern is lower than the electrical conductivity of materials that form the input pad or the output pad.
Claim 9
Dependent Claim
41 words
A surface acoustic wave device according to claim 1, wherein the surface acoustic wave device includes a designated number of reactance patterns that connects, with a designated reactance value, the earth pad with either the input pad or the output pad.
Claim 10
Dependent Claim
38 words
A surface acoustic wave device according to claim 9, wherein one of the reactance patterns is an inductance pattern that connects, with a designated inductance value, the earth pad with either the input pad or the output pad.
Claim 11
Dependent Claim
38 words
A surface acoustic wave device according to claim 9, wherein one of the reactance patterns is a capacitance pattern that connects, with a designated capacitance value, the earth pad with either the input pad or the output pad.
Claim 12
Dependent Claim
69 words
A surface acoustic wave device according to claim 9, wherein one of the reactance patterns is an inductance pattern that connects, with a designated inductance value, the earth pad with either the input pad or the output pad; and the other one of the reactance patterns is a capacitance pattern that connects, with a designated capacitance value, the earth pad with either the input pad or the output pad.
Claim 13
Dependent Claim
57 words
A surface acoustic wave device according to claim 1, wherein the surface mount package includes: (a) a part having a pad forming surface where an input pad, an output pad and an earth pad are formed on; (b) a part which forms, combined with the first part, a storage area for the surface acoustic wave element inside.
Claim 14
Dependent Claim
59 words
A surface acoustic wave device according to claim 13, wherein: (a) the first part have a blindness hole that can store a surface acoustic wave element; and (b) the second part is plane, and the surface acoustic wave element is placed inside the first part and the second part seals the opening of the hole of the first part.
Claim 15
Dependent Claim
51 words
A surface acoustic wave device according to claim 14, wherein the second part has a pressing means that presses the surface acoustic wave element toward a pad forming surface and fixes the position of the surface acoustic wave element along the depth direction of the concave part of the first part.
Claim 16
Dependent Claim
29 words
A surface acoustic wave device according to claim 15, wherein a pressing means includes a projection with a designated height along the direction of the depth of the hole.
Claim 17
Dependent Claim
86 words
A surface acoustic wave device according to claim 13, wherein the first part is a plane where a surface acoustic wave element can be placed on; the second part has a blindness hole that can store the surface acoustic wave element; and the surface acoustic wave element is placed on the first part, and the second part is placed on the first part so that the surface acoustic wave element stays inside the hole ; and the first part seals the opening of the second part.
Claim 18
Dependent Claim
123 words
A manufacturing method of surface acoustic wave device comprising: (a)a process where predetermined numbers of metal bumps are attached to electrodes of a surface acoustic wave element; (b) a process where the surface acoustic element is placed on a pad forming surface of a base so that each of the metal bumps faces a pad on the pad forming surface; (c) a process where the metal bumps are fixed to the pads so that electrical connection between the electrodes and pads is realized, by application at least one of heat, pressure and a supersonic wave to the metal bumps; and (d) a process where a cover is sealed on the pad forming surface so that the surface acoustic wave element resides in between.