Patent US6895124B1 successfully refreshed from Google Patents.
EP0465253A2
Expired / Lapsed
EP
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Integrated circuit and lead frame assembly
Assignee: HP Inc
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Filing: 1991-07-04
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Granted: —
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Expires: 2011-07-04
Abstract
Abstract An integrated circuit (IO) and lead frame assembly (53) comprises a first TAB segment (34) having a plurality of leads (39,45) having inner and outer ends. The inner ends are connected to bumps (18,20,24) formed in a square pattern adjacent the periphery of the IC. A second TAB segment (54) includes a plurality of leads (60,62,64) having inner and outer ends. The inner ends are connected to a second set of bumps (28,30,32) formed on the IC (10) inwardly from the first set. The outer ends of the leads on the second TAB segment (54) are connected to traces on the first TAB segment (34) which are interleaved between the leads thereon. The outer ends of the traces and lead on the first TAB segment (32) thus connect to all of the IC bumps thereby increasing the number of connections to the IC (10).
Inventors
- 👤 Melissa D. Boyd
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:05
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W70/00; H10W70/40; H10W70/453; H10W72/701
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
92 words
A method of creating a plurality of connections to an integrated circuit (IC) 10 comprising the steps of: forming a first set of sequential contact pads 16 on an IC 10 adjacent the perimeter of the IC 10; forming a second set of sequential contact pads 26 on the IC 10 spaced inwardly from said first set; connecting a first set of leads 39, 41, 45 to said first set of contact pads 16; and connecting a second set of leads 60, 62, 64 to said second set of contact pads 26.
Claim 2
Dependent Claim
70 words
The method of claim 1 wherein said method further includes the step of forming said first set of leads in a first lead frame 34 which includes inner lead ends and outer lead ends and wherein the step of connecting the first set of leads comprises the step of connecting the inner ends of a plurality of leads in said first set to said first set of contact pads 16.
Claim 3
Dependent Claim
69 words
The method of claim 2 wherein said method further includes the step of forming said second set of leads in a second lead frame 54 which includes inner lead ends and outer lead ends and wherein the step of connecting the second set of leads comprises the step of connecting the inner ends of a plurality of leads in said second set to said second set of contact pads.
Claim 4
Dependent Claim
35 words
The method of claim 3 wherein said method further includes the step of connecting an outer lead end 70 in said second lead frame to an inner lead end 40 in said first lead frame.
Claim 5
Dependent Claim
45 words
The method of claim 4 wherein the step of forming said first set of leads in a first lead frame comprises the step of forming some 40, 42 leads having inner ends which terminate beneath the outer ends of leads in said second lead set.
Claim 6
Dependent Claim
104 words
An integrated circuit assembly comprising: an integrated circuit 10; a first set of contact pads 16 mounted on said circuit; a second set of contact pads 26 mounted on said circuit; a first lead frame 34 comprising a substantially planar array of leads having the inner ends thereof connected to said first set of contact pads 16; an opening in the central portion of said array defined by the inner extremities of said leads; and a second lead frame 54 having a plurality of leads extending through said opening, said second lead frame leads being connected to said second set of contact pads 26.
Claim 7
Dependent Claim
46 words
The integrated circuit assembly of claim 6 wherein said first lead frame 34 includes traces 40, 42 interleaved between said leads and wherein the outer ends 68 of the leads in said second lead frame 54 are connected to the inner ends of said traces 40.
Claim 8
Dependent Claim
35 words
The integrated circuit assembly of claim 7 wherein said second lead frame leads include a substantially planar portion intermediate the inner and outer lead ends 66, 68 substantially parallel to said first lead frame 54.
Claim 9
Dependent Claim
42 words
The integrated circuit assembly of claim 8 wherein an inner lead end 60 in said second lead frame 54 includes a bend 66 disposed between its connection to one of said contacts 28 and the substantially planar portion of said lead frame.
Claim 10
Dependent Claim
41 words
The integrated circuit assembly of claim 9 wherein an outer lead end 68 in said second lead frame 54 includes a bend disposed between its connection to one of said traces 40 and the substantially planar portion of said lead frame.
Claim 11
Dependent Claim
57 words
The integrated circuit assembly of claim 6 wherein said first lead frame 34 is mounted on a substantially planar base 36 having a central opening 38 therethrough over which the inner ends of the leads in said first lead frame extend and through which the inner ends of the leads in said second lead frame 54 extend.
Claim 12
Dependent Claim
41 words
The integrated circuit assembly of claim 6 wherein said second lead frame 54 is mounted on a substantially planar base 56 having a central opening therethrough 58 through which the inner ends of the leads in said second lead frame extend.
Claim 13
Dependent Claim
51 words
The integrated circuit assembly of any of claims 6 to 12, wherein said first set of contact pads 16 are mounted on said circuit adjacent the perimeter thereof, and said second set of contact pads 26 are mounted on said circuit spaced inwardly from said first set of contact pads 16.
References Cited (Backward Citations)
No citation records indexed.
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