Compact high density interconnect structure

Claim 2

The improvement recited in claim 1 further comprising: a plurality of feedthrough conductors extending through said substrate, each of said feedthrough conductors having first and second ends; said pattern of conductors including conductors electrically connected to said first ends of selected ones of said feedthrough conductors.

Claim 3

The improvement recited in claim 2 wherein: said second pattern of conductors includes conductors ohmically connected to second selected ones of said feedthrough conductors.

Claim 4

The improvement recited in claim 2 wherein: said first major surface includes a cavity in which one of said electronic components is disposed; and one of said feedthrough conductors is disposed under said cavity in electrical contact with the back surface of that electronic component.

Claim 5

The improvement recited in claim 1 wherein: said system contains more surface area of chips on that one substrate than the surface area of one side of said substrate

Claim 6

The improvement recited in claim 2 wherein: said feedthrough conductors comprise metal-filled holes in said substrate.

Claim 7

The improvement recited in claim 6 wherein: said substrate is ceramic; and said holes contain a conductive metal composition which would not survive the firing temperature of said ceramic.

Claim 8

In an electronic system of the type including a substrate having first and second major surfaces, a plurality of electronic components disposed on said first major surface thereof, a high density interconnect structure including a layer of dielectric material bonded to said components and said first major surface of said substrate and a pattern of conductors disposed on or in said dielectric material, said pattern of conductors including conductors electrically connected to said contact pads of said electronic components, the improvement comprising: a plurality of feedthrough conductors extending through said substrate, each of said feedthrough conductors having first and second ends, one of said feedthrough conductors being disposed under one of said electronic components and in electrical contact with the back surface of that electronic component; and said pattern of conductors including conductors electrically connected to said first ends of selected ones of said feedthrough conductors.

Claim 9

An electronic system comprising: a plurality of segments, each of said segments comprising: a substrate having a perimeter and first and second sides having first and second major surfaces, respectively, and a plurality of feedthrough conductors extending through said substrate, each of said feedthrough conductors having first and second ends associated respectively with said first and second sides of said substrate, an electronic component having contact pads on a contact surface thereof, said electronic component being disposed with its contact surface in substantially the plane of said first major substrate surface, and a high density interconnect structure bonded to said electronic component and said first major surface of said substrate, said high density interconnect structure including dielectric material and a pattern of conductors disposed on or in said dielectric material, said pattern of conductors including conductors electrically connected to said contact pads of said electronic component and conductors electrically connected to said feedthrough conductors; and said segments being arranged in a stack, said stack including means for electrically connecting conductors of different, adjacent ones of said serpents to each other at adjacent surfaces of said adjacent segments, said means for electrically connecting being disposed within the perimeters of both of said adjacent substrates.

Claim 10

The system recited in claim 9 wherein: said first ends of said feedthrough conductors are disposed substantially flush with said first major surface of said substrate and said pattern of conductors connects to said feedthrough conductors in substantially the same manner in which it connects to said contact pads.

Claim 11

The system recited in claim 9 wherein: at adjacent surfaces of adjacent segments, the ends of said feedthrough conductors are disposed substantially flush with their associated major substrate surfaces.

Claim 12

The system recited in claim 9 wherein: said stack comprises a base segment having a given substrate size and a stack segment having a smaller substrate; said base segment has a seal ring on said first major surface thereof; and said system further comprises a sidewall sealed to said seal ring for enclosing said stack substrate in an enclosure comprising said substrate of said base segment and said sidewall.

Claim 13

The system recited in claim 12 wherein: said base segment includes a second seal ring disposed on the second major surface of said base substrate; a second sidewall sealed to said second seal ring for enclosing a second stack substrate in an enclosure comprised of said base substrate and said second sidewall.

Claim 14

The system recited in claim 9 wherein: a first one of said substrates has a second electronic component disposed on its second major surface.

Claim 15

The system recited in claim 14 wherein: said first substrate has a second high density interconnect structure bonded to said second major surface thereof and to said second electronic component.

Claim 16

The system recited in claim 9 wherein: said means for directly connecting comprises fuss buttons.

Claim 17

The system recited in claim 9 wherein: said means for directly connecting comprises solder.

Claim 18

The system recited in claim 9 wherein: said means for directly connecting comprises a polymer loaded with conductive material.

Claim 19

The system recited in claim 9 wherein: a portion of said system is enclosed in a hermetic enclosure; and said substrate of a first one of said segments comprises a portion of said hermetic enclosure.

Claim 20

The system recited in claim 19 wherein: the substrate of said first segment is larger than some others of said substrates; said substrate of said first segment is sealed to the remainder of an enclosure in which those other substrates are disposed to complete said hermetic enclosure.

Claim 21

The system recited in claim 19 wherein: said enclosure comprises bottom, top and side walls; and said bottom comprises a substrate of said stack.

Claim 22

The system recited in claim 21 wherein: said side wall comprises a member bonded to the edges of said substrates in said stack.

Claim 23

An electronic system comprising: a substrate having a perimeter and first and second major surfaces and an aperture therein; a plurality of electronic components each having a contact surface and a back surface and contact pads on said contact surface, each of said electronic components being disposed in an aperture in said substrate with its contact surface in substantially the plane of said first major substrate surface; and a high density interconnect structure bonded to said contact surfaces of said electronic components and said first major surface of said substrate, said high density interconnect structure including dielectric material and a pattern of conductors disposed on or in said dielectric material, said pattern of conductors including conductors electrically connected to said contact pads of said electronic components for interconnecting said electronic components into said system.

Claim 24

The system recited in claim 23 wherein: some of said electronic components have their back surfaces disposed in substantially the plane of said second substrate surface.

Claim 25

The system recited in claim 23 wherein: said substrate includes a plurality of feedthrough conductors extending between said first and second major surfaces; and said pattern of conductors including conductors electrically connected to said feedthrough conductors.

Claim 26

An electronic system comprising: a plurality of serpents, each of said segments comprising: a substrate having a perimeter and first and second major surfaces and an aperture therein, and a plurality of feedthrough conductors extending through said substrate, each of said feedthrough conductors having first and second ends, a plurality of electronic components each having a contact surface and a back surface and contact pads on said contact surface, each of said electronic components being disposed in an aperture in said substrate with its contact surface in substantially the plane of said first major substrate surface, and a high density interconnect structure bonded to said contact surfaces of said electronic components and said first major surface of said substrate, said high density interconnect structure including dielectric material and a pattern of conductors disposed on or in said dielectric material, said pattern of conductors including conductors electrically connected to said contact pads of said electronic components for interconnecting said electronic components into said system; and said segments being arranged in a stack, said stack including means for electrically connecting conductors of different, adjacent ones of said segments to each other at adjacent surfaces of said adjacent segments, said means for electrically connecting being disposed within the perimeters of both of said adjacent substrates.