EP0464751A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device with protection circuit
Assignee: Toshiba Corp
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Filing: 1991-07-01
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Granted: —
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Expires: 2011-07-01
Abstract
Abstract In a semiconductor device having a plurality of circuits (22,23), a power pad (27,29) and a ground pad (28,30) are provided to each of said circuits. Each power pad (27,29) in different circuits is connected to each other through a resistor element (31) or a protection circuit, and each ground pad (28,30) in different circuits is connected to each other through another resistor element (31) or a protection circuit. Because of these connections, said circuits have a high resistivity against electrostatic destruction. Also, said circuits are not affected detrimentally by noise transmitted through said connections, because of the noise reduction caused by RC-coupled delay occured in said resistor elements, or because of the work of said protection circuit.
Inventors
- 👤 Kazutaka Nogami
- 👤 Tetsuya Iizuka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 10:32
CPC Classifications
H; H10; H10D; H10D89/00; H10D89/60; H10D89/601; H10W; H10W72/00; H10W72/90; H10W72/931; H10W72/932
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
53 words
A semiconductor device, comprising: a plurality of circuits, each circuit having an input protection circuit; a plurality of pads provided to each of said circuit in order to supply a first voltage to each circuit; and resistor elements provided to connect one pad in said circuits and another pad in said different circuits.
Claim 2
Dependent Claim
24 words
The semiconductor device as claimed in Claim 1, wherein said first voltage is a power voltage and said plurality of pads are power pads.
Claim 3
Dependent Claim
22 words
The semiconductor device as claimed in Claim 1, wherein said resistor elemnts are provided between any commbination of said plurality of pads.
Claim 4
Dependent Claim
79 words
A semiconductor device, comprising: a plurality of circuits, each circuit having an input proteciton circuit; a plurality of power pads provided to each of said circuits in order to supply a power voltage to each circuit; a plurality of ground pads provided to each of said circuit in order to earth each circuit; resister elements provided to connect said power pads in said different circuits; and other resister elements provided to connect said ground pads in said different circuits.
Claim 5
Dependent Claim
24 words
The semiconductor device as claimed in Claim 1 or 4, wherein said resistor elements have the magnitude over 1 Ω and under 100Ω .
Claim 6
Dependent Claim
39 words
The semiconductor device as claimed in Claim 5, wherein said resistor elements are provided between any commbination of said power pads in said different circuits and also provided between any commbination of said ground pads in said different circuits.
Claim 7
Dependent Claim
97 words
A semiconductor device, comprising: a plurality of circuits, each circuit having an input protection circuit; a plurality of power pads provided to each of said circuits in order to supply a power voltage to each circuit; a plurality of ground pads provided to each of said circuits in order to earth each circuit; first protection circuits provided to connect said power pads in said different circuits, and to connect said ground pads in said different circuits; and second protection circuits provided to connect said power pad and ground pad, both pads being provided in a same circuit.
Claim 8
Dependent Claim
114 words
A semiconductor device, comprising: a plurality of circuits, each circuit having an input protection circuit; a plurality of power pads provided to each of said circuit in order to supply a power voltage to each circuit; a plurality of ground pads provided to each of said circuits in order to earth each circuit; first protection circuits provided to connect said power pads in said different circuits and to connect said ground pads in said different circuits; second protection circuits provided to connect said power pad and said ground pad in a same circuit; and third protection circuits provided to connect said power pad in one circuit and a ground pad in a different circuit.
Claim 9
Dependent Claim
30 words
The semiconductor device as claimed in Claim 7 or 8, wherein said first protection circuits are comprised of resistor elements having the magnitude over 1 Ω and under 100Ω .
Claim 10
Dependent Claim
31 words
The semiconductor device as claimed in Claim 8, wherein each of said protection circuits is provided to connect any commbination of power pads and ground pads in said plurality of circuits.
References Cited (Backward Citations)
No citation records indexed.
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