A composition having sensitivity to light or radiation

Claim 2

A composition having sensitivity to light or radiation, comprising: a base polymer consisting essentially of a polymer having a siloxane-bond structure; and a sensitizing agent.

Claim 3

A composition having sensitivity to light or radiation according to claim 1, wherein said polymer having a siloxane-bond structure undergoes polymerization reaction when irradiated with light or radiation.

Claim 4

A composition having sensitivity to light or radiation according to claim 1, wherein said polymer having a siloxane-bond structure is a single chain-form polysiloxane, a ladder-form polysiloxane, or said polymer has a three-dimensional structure of polysiloxane.

Claim 5

A composition having sensitivity to light or radiation according to claim 1, wherein said polymer having a siloxane-bond structure has at least one end group or side chain group, which undergoes condensation polymerization by an anion or a cation produced from the sensitizing agent by exposure of the composition to light or radiation.

Claim 6

A composition having sensitivity to light or radiation according to claim 1, wherein said polymer having a siloxane-bond structure undergoes condensation polymerization by catalysis of an acid or a radical.

Claim 7

A composition having sensitivity to light or radiation according to claim 4, wherein at least one of the end groups or the side chains groups of said polymer is a hydroxyl group, an alkoxyl group, or a phenoxy group.

Claim 8

A composition having sensitivity to light or radiation according to claim 6, wherein said polymer having a siloxane-bond structure is polysilsesquioxane which contains a hydroxyl groups and alkoxyl groups as said end groups in a ratio of 1 to 1.

Claim 9

A composition having sensitivity to light or radiation according to claim 3, wherein said polymer having a siloxane-bond structure is polysilsesquioxane which contains an alkyl group or a phenyl group as said side chain group.

Claim 10

A composition having sensitivity to light or radiation according to claim 1, wherein said polymer having a siloxane-bond structure is contained in an amount of 10 percent by weight or more.

Claim 11

A composition having sensitivity to light or radiation according to claim 1, wherein said sensitizing agent produces an acid when irradiated with light or radiation.

Claim 12

A composition having sensitivity to light or radiation according to claim 10, wherein said sensitizing agent is an onium salt, a diazonium salt, or a sulfonate.

Claim 13

A composition having sensitivity to light or radiation according to claim 1, wherein said sensitizing agent produces a radical when irradiated with light or radiation.

Claim 14

A composition having sensitivity to light or radiation according to claim 12, wherein said sensitizing agent is an aromatic ketone, a polyhalogenated hydrocarbon, or a triazine compound.

Claim 15

A composition having sensitivity to light or radiation according to claim 1, wherein said sensitizing agent is contained in an amount of 40 percent by weight or less based on the weight of said base polymer.

Claim 16

A composition having sensitivity to light or radiation according to claim 1, wherein said sensitizing agent is contained in an amount of 10 percent by weight or less based on the weight of said base polymer when irradiated with an electron beam, and in an amount in the range of 0.2 to 10 percent by weight based on the weight of said base polymer when irradiated with ultraviolet rays.

Claim 17

A composition having sensitivity to light or radiation, comprising: a base polymer consisting essentially of a polymer having a siloxane-bond structure, a sensitizing agent, and dyes having high solubility in a polar solvent.

Claim 18

A composition having sensitivity to light or radiation, comprising: a base polymer consisting essentially of a polymer having a siloxane-bond structure, a sensitizing agent, and dyes having high solubility in a polar solvent.

Claim 19

A composition having sensitivity to light or radiation according to claim 16, wherein said dyes having high solubility in a polar solvent is phenothiazine.

Claim 20

A process for forming a pattern, comprising the step of: forming a smoothing layer on a substrate; applying a composition having sensitivity to light or radiation of claim 1 to said smoothing layer to form a resist film; exposing of a predetermined portions of the resist film to light or radiation; and developing said resist film by the use of an alkali developer.

Claim 21

A method for preparing photomasks, comprising the steps of: applying a light non-transmissive pattern on a surface of a substrate, applying a composition of claim 1 over the surface of said substrate with said shading pattern to form a resist film, exposing a predetermined portion of said resist film to light or radiation, developing said resist film by the use of a developer, resulting in phase shifter.

Claim 22

A method of claim 19, which further comprises the step of subjecting the phase shifter to a heating treatment to complete a polymerization reaction of the polymer contained in the composition of claim 1.

Claim 23

A method for preparing semiconductor devices comprising the steps of: forming a semiconductor element on a substrate, forming a plurality of bonding pads on part of the substrate, forming a protective film to cover the entire surface of the substrate, subjecting the protective film to an etching treatment to form windows on the portions of the protective film facing the individual bonding pads, applying the composition of claim 1 to the entire surface of the protective film including the bonding pads, resulting a resist film, exposing the resist film to light or radiation, developing said resist film by the use of a developer, and connecting the individual bonding pads to wires.