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EP0462552A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Electronic circuit module with power feed spring assembly

Assignee: NEC Corp
•
Filing: 1991-06-18
•
Granted: —
•
Expires: 2011-06-18
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Abstract

Abstract In an electronic circuit module, an array of male connectors (41, 46) are arranged on a ceramic substrate (40) to establish contact with external female connectors (20) and an array of LSI packages (5) is provided. Conductive layers (43) of power distribution pattern are embedded in the substrate and are coupled to the male connectors (41). Each LSI package includes a conductive housing (52), an LSI chip (50) secured thereto in a thermally conductive relationship and a base plate (51) which establishes source/ground current conduction paths between the chip and the housing and drain/source current conduction paths between the chip and appropriate layers of the ceramic substrate. An array of conductive springs (68) are supported by a lattice structure (60, 64) to establish a pressure contact with the housings of successive LSI packages to allow power currents to be supplied from an external source voltage terminal to all LSI packages. An array of cooling surfaces (73) are in thermal contact with the respective package housings through the apertures (62) of the lattice structure.

Inventors

  • 👤 Mitsuo C/O Nec Corporation Komoto

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 18:33
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H10; H10W; H10W40/00; H10W40/40; H10W40/47

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 171 words
An electronic circuit module comprising: an insulative substrate having an array of male connectors arranged thereon for engagement with external female connectors and an electrically conductive layer of power distribution pattern embedded therein and coupled to said male connectors; an array of integrated circuit packages, each including an electrically conductive housing, an integrated circuit chip secured thereto in a thermally conductive relationship and a base plate having means for establishing source/ground current conduction paths between said integrated circuit chip and said conductive housing and means for establishing drain/source current conduction paths between said integrated circuit chip and the layer of said insulative substrate; a spring assembly including an array of electrically conductive springs and means for supporting said springs in pressure contact relationship with the conductive housings of successive integrated circuit packages, said spring assembly being adapted to be coupled to an external power voltage terminal; and cooling means for defining an array of cooling surfaces respectively contacting said conductive housings of the integrated circuit packages in a thermally conductive relationship.
Claim 2
Dependent Claim 115 words
An electronic circuit module as claimed in claim 1, wherein said spring assembly comprises: a first lattice structure formed by crossed bars of electrically conductive material for defining an array of first apertures for allowing said integrated circuit packages to establish said thermally conductive relationship with said cooling means; a second lattice structure formed by crossed bars for defining an array of second apertures corresponding respectively to the first apertures for allowing said integrated circuit packages to establish said electrical contacts with the layer of said insulative substrate and for supporting the array of said springs between corresponding bars of the first and second lattice structures in said pressure contact relationship with said conductive housings.
Claim 3
Dependent Claim 31 words
An electronic circuit module as claimed in claim 1 or 2, wherein the crossed bars of the first lattice structure has outwardly extending portions for coupling to a power voltage source.
Claim 4
Dependent Claim 23 words
An electronic circuit module as claimed in 1 , 2 or 3 , wherein each of said springs is of paired bow-like configuration.
Claim 5
Dependent Claim 22 words
An electronic circuit module as claimed in any one of claims 1 to 4, wherein said insulative substrate is formed of ceramic.
Claim 6
Dependent Claim 29 words
An electronic circuit module as claimed in any one of claims 1 to 5, further comprising a frame structure for supporting said insulative substrate and said spring assembly therein.
Claim 7
Dependent Claim 33 words
An electronic circuit module as claimed in any one of claims 1 to 6, further comprising a thermally conductive layer interposed between each of said conductive housings and each of said cooling surfaces.
Claim 8
Dependent Claim 24 words
An electronic circuit module as claimed in any one of claims 2 to 7, wherein said second lattice structure is formed of insulative material.

References Cited (Backward Citations)

US3725843A Cited
US4652976A Cited
EP0293297A2 Cited
US5001548A Cited

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