EP0457593A2
Expired / Lapsed
EP
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Lead frame and assembly process
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1991-05-16
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Granted: —
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Expires: 2011-05-16
Abstract
Abstract A multi-layer lead frame (10) for a semiconductor device comprises a lead frame body (12) made from metal strip, a power supply plane (14) and a ground plane (16). The planes (14,16) are independent of the lead frame body (12), but laminated to the lead frame body (12) by means of adhesive films (18a,18b) which are coated directly on the planes (14,16) or the lead frame body (12), without using any insulative tape pieces. An insulative film (19) may also be provided between the lead frame body (12) and adjacent planes (14,16). <IMAGE>
Inventors
- 👤 Matsuharu Shimizu
- 👤 Yoshiki Takeda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 12:34
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/451; H10W70/01; H10W70/04; H10W70/464; H10W70/467; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
82 words
A multi-layer lead frame for a semiconductor device comprising: a lead frame body (12) made from metal strip; and, at least one metal plane (14,16), which is independent from the lead frame body (12), the metal plane being adhered to the lead frame body (12) by means of an adhesive film (18a,18b), characterised in that the adhesive film (18a,18b) is coated directly onto the lead frame body (12) or the at least one metal plane (14,16) without using any insulative tape piece.
Claim 2
Dependent Claim
29 words
A multi-layer lead frame according to claim 1, wherein the lead frame body (12) or the at least one metal plane (14,16), is coated with an insulative resin film.
Claim 3
Dependent Claim
32 words
A multi-layer lead frame according to claim 1 or 2, wherein the at least one metal plane comprises two layers consisting of a power supply plane (14) and a ground plane (16).
Claim 4
Dependent Claim
46 words
A multi-layer lead frame according to claim 3, wherein the power supply plane (14) is adhered to the lead frame body (12) and the ground plane (16) is adhered to the power supply plane (14) by means of first and second coated adhesive films (18a,18b), respectively.
Claim 5
Dependent Claim
162 words
A process for manufacturing a multi-layer lead frame for a semiconductor device comprising a lead frame body and at least one metal plane being adhered to said lead frame body by means of an adhesive material, said process comprising the following steps of: forming a lead frame strip and at least one metal plane strip, said lead frame strip comprising a plurality of said lead frame bases longitudinally arranged and continuously connected to each other, and said metal plane strip comprising a plurality of said metal planes longitudinally arranged and continuously connected to each other; coating at least one of said lead frame strip and said metal plane strip with an adhesive material in accordance with a predetermined adhesion pattern; positioning said metal plane strip with respect to said lead frame strip; and, adhering said at least one metal plane of said metal plane strip to said at least one lead frame body of said lead frame strip via said adhesive material.
Claim 6
Dependent Claim
40 words
A process according to claim 5, wherein said lead frame strip and said metal plane strip have respective positioning means, such as guide holes, which are used for positioning said metal plane strip with respect to said lead frame strip.
Claim 7
Dependent Claim
36 words
A process according to claim 5 or 6, wherein said metal plane strip is punched to cut into an individual metal plane, which is then adhered to said lead frame body of said lead frame strip.
Claim 8
Dependent Claim
72 words
A process according to claim 5, 6 or 7, including the additional steps of: coating the other of said lead frame strip and said metal plane strip with an insulative resin in accordance with a second predetermined pattern; and, adhering said at least one metal plane of said metal plane strip to said at least one lead frame body of said lead frame strip via said adhesive material and said insulative resin.
Claim 9
Dependent Claim
30 words
A process according to claim 8, wherein said insulative resin is gel-like and is dried to become a resin film before adhering said metal plane to said lead frame body.
References Cited (Backward Citations)
No citation records indexed.
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