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EP0456285A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor accelerometer

Assignee: Denso Corp
•
Filing: 1987-09-15
•
Granted: —
•
Expires: 2007-09-15
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Abstract

Abstract A semiconductor accelerometer includes a package containing damping liquid. A base is fixedly disposed within the package. A semiconductor plate is disposed within the package and is supported on the base. The semiconductor plate has a movable free end and a deformable diaphragm. A semiconductor strain gauge is associated with the diaphragm and deforms in accordance with deformation of the diaphragm. The base has a first surface opposing the semiconductor plate free end. The first surface of the base has a recess for limiting movement of the semiconductor plate free end. The recess extends to and opens at a second surface of the base which differs from the first surface.

Inventors

  • 👤 Masahito Imai
  • 👤 Toshitaka Yamada
  • 👤 Tiaki Mizuno
  • 👤 Hirohito Shioya

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 19:52
CPC Classifications
G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; G01P1/00; G01P1/003; G01P15/12; G01P15/123; G01P2015/0805; G01P2015/0822; G01P2015/0825; G01P2015/0828

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 60 words
A semiconductor type acceleration sensor comprising a semiconductor base plate (53) formed with a thin diaphragm portion and a thick portion, said diaphragm portion having a semiconductor strain gauge (85), and loads forming portions of said semiconductor base plate (53) and provided at vibrating portions, said loads being formed at a plurality of portions of said semiconductor base plate (53).
Claim 2
Dependent Claim 24 words
The semiconductor type acceleration sensor according to claim 1, wherein said loads are formed inward of an edge of said semiconductor base plate (53).
Claim 3
Dependent Claim 23 words
The semiconductor type acceleration sensor according to claim 1 or 2, wherein said loads comprise lower layers divided into a plurality of portions.
Claim 4
Dependent Claim 25 words
The semiconductor type acceleration sensor according to one of claims 1 to 3, wherein an additive load is bonded to said loads to increase inertia.

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