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EP0451500A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards

Assignee: International Business Machines Corp
•
Filing: 1991-03-05
•
Granted: —
•
Expires: 2011-03-05
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Abstract

Abstract Disclosed is a multilayer circuit package (101) having a buried thin film capacitor (141). The circuit packages includes at least a power core (111a), a ground core (111b), a first signal core (121), a second signal core (131), and the integral, buried, thin film capacitor. The integral, buried, thin film capacitor (141) serves to capacitively couple the first and second signal cores. Structurally, the first signal core includes at least one first wire (123) that terminates in at least one first electrode (125), while the second signal core includes at least one second wire (133) that terminates in at least one second electrode (135). At least a portion of the first electrode overlays at least a portion of the second electrode and is separated therefrom by a thin film of a dielectric material (151). The first electrode, the second electrode, and the thin film of dielectric material define the integral buried capacitor. The thin film capacitor is prepared by thin film methods, with epitaxial deposition of the dielectric.

Inventors

  • 👤 John Matthew Lauffer
  • 👤 Richard Anthony Schumacher

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 22:51
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0175; H05K2201/0179; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K3/46; H05K3/4611; Y; Y10; Y10S; Y10S257/00; Y10S257/916; Y10T; Y10T29/00; Y10T29/43; Y10T29/435

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 32 words
A multilayer circuit package (101) comprising a first signal core (121), a second signal core (131), and integral buried thin film capacitor means (141) capacitively coupling said first and second signal cores.
Claim 2
Dependent Claim 94 words
The multilayer circuit package of claim 1 wherein said first signal core comprises at least one first wire (123) terminating in at least one first electrode (125), said second signal core comprises at least one second wire (133) terminating in at least one second electrode (135), at least a portion of said first electrode overlying at least a portion of said second electrode and being separated therefrom by a thin film of a dielectric material (151) therebetween; said first electrode, said second electrode, and said film of dielectric material defining the integral buried capacitor.
Claim 3
Dependent Claim 31 words
The multilayer circuit package of claim 1 or 2 wherein said first and second signal cores comprise a metallic conductor, preferably chosen from the group consisting of Cu, Al, and Ag.
Claim 4
Dependent Claim 21 words
The multilayer circuit package of claim 3 wherein the metallic conductor is from about 10 nm to about 100 µm thick.
Claim 5
Dependent Claim 39 words
The multilayer circuit package of claim 2, 3 or 4 wherein the thin film of dielectric material comprises a ceramic dielectric, preferably chosen from the group consisting of calcium titanate, barium titanate, aluminum oxide, berylium oxide, and aluminum nitride.
Claim 6
Dependent Claim 31 words
The multilayer circuit package of any one of the preceding claim 2 to 5 wherein the thin film of dielectric material is from about 10 nm to about 10 µm thick.
Claim 7
Independent Claim 53 words
A method of fabricating a multilayer circuit package as recited in any one of the preceding claims, comprising: (a). circuitizing said first signal core on a dielectric substrate; (b). depositing a thin film of dielectric atop said circuitized first signal core; (c). circuitizing said second signal core atop said thin film of dielectric.
Claim 8
Dependent Claim 27 words
The method of claim 7 comprising depositing conductor material on the dielectric substrate and thereafter removing areas of the conductor material to circuitize said first signal core.
Claim 9
Dependent Claim 24 words
The method of claim 7 comprising depositing conductor material on the dielectric substrate through mask means to form and circuitize said first signal core.

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