EP0450948A2
Expired / Lapsed
EP
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High density interconnect structure with top mounted components
Assignee: General Electric Co
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Filing: 1991-04-04
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Granted: —
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Expires: 2011-04-04
Abstract
Abstract The functionality, versatility and connection and packing density of a high density interconnect structure (210) is enhanced by mounting one or more components (222,250) on top of the structure for connection to conductors of the high density interconnect structure and to chips (220) embedded within the structure. Both active and passive components may be mounted in this manner, as may components which would be adversely affected by high density interconnect structure fabrication temperatures or by the presence of the high density interconnect structure dielectric thereon.
Inventors
- 👤 Robert John Wojnarowski
- 👤 Charles William Eichelberger
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 15:30
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H05; H05K; H05K1/00; H05K1/18; H05K1/181; H05K1/182; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
76 words
An electronic system comprising: a plurality of first electronic components; a high density interconnect structure comprising: a layer of dielectric material bonded to said first electronic components, and a pattern of high density interconnect conductors disposed on or in said dielectric material, said high density interconnect conductors interconnecting said first electronic components; at least one second electronic component disposed on said high density interconnect structure and electrically connected to conductors of said high density interconnect structure.
Claim 2
Dependent Claim
59 words
The electronic system recited in claim 1 wherein: at least some of said first electronic components include contact pads on a first surface thereof; said layer of dielectric material has via holes therein disposed in alignment with said contact pads; and said high density interconnect conductors extend into said via holes and into ohmic contact with said contact pads.
Claim 3
Dependent Claim
31 words
The electronic system recited in claim 2 wherein: said via holes are narrower at their ends adjacent said contact pads than they are at their ends remote from said contact pads.
Claim 4
Dependent Claim
32 words
The electronic system recited in claim 1 wherein: said at least one second electronic component is disposed on the opposite side of said high density interconnect structure from said first electronic components.
Claim 5
Dependent Claim
23 words
The electronic system recited in claim 1 wherein: said at least one second electronic component is bonded to said high density interconnect structure.
Claim 6
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said at least one second component comprises a passive component.
Claim 7
Dependent Claim
19 words
The electronic system recited in claim 6 wherein: said at least one second electronic component comprises a discrete capacitor.
Claim 8
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said at least one second component comprises an active device.
Claim 9
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said at least one second component comprises an integrated circuit.
Claim 10
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said at least one second component comprises an image sensor.
Claim 11
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said first electronic components are mounted on a support means.
Claim 12
Dependent Claim
32 words
The electronic system recited in claim 10 wherein: said support means comprises a substrate having a cavity therein; and at least one of said first electronic components is disposed in said cavity.
Claim 13
Dependent Claim
17 words
The electronic system recited in claim 1 wherein: said high density interconnect structure includes exposed contact pads.
Claim 14
Dependent Claim
26 words
The electronic system recited in claim 1 wherein: said at least one second electronic component comprises a chip having a plurality of contact pads disposed thereon.
Claim 15
Dependent Claim
23 words
The electronic system recited in claim 14 wherein: said chip is mounted with its contact pads facing away from said first electronic components.
Claim 16
Dependent Claim
24 words
The electronic system recited in claim 15 comprising: bridging conductors connecting said contact pads of said second component to said high density interconnect structure.
Claim 17
Dependent Claim
14 words
The electronic system recited in claim 15 wherein: said bridging conductors comprise wire bonds.
Claim 18
Dependent Claim
14 words
The electronic system recited in claim 15 wherein: said bridging conductors comprise flying leads.
Claim 19
Dependent Claim
27 words
The electronic system recited in claim 15 wherein: said high density interconnect structure comprises a flexible portion connected to said contact pads of said second electronic component.
Claim 20
Dependent Claim
28 words
The electronic system recited in claim 19 wherein: said flexible portion of said high density interconnect structure is bonded to said contact pads of said second electronic component.
Claim 21
Dependent Claim
27 words
The electronic system recited in claim 15 comprising: a flexible tape cable connected between said contact pads of said second component and said high density interconnect structure.
Claim 22
Dependent Claim
27 words
The electronic system recited in claim 14 wherein: said at least one second electronic component is mounted with its contact pads facing toward said first electronic components.
Claim 23
Dependent Claim
27 words
The electronic system recited in claim 22 wherein: said contact pads of said second electronic component are solder bonded to conductors of said high density interconnect structure.
Claim 24
Dependent Claim
26 words
The electronic system recited in claim 22 wherein: said contact pads of said second electronic component are welded to conductors of said high density interconnect structure.
Claim 25
Dependent Claim
38 words
The electronic system recited in claim 1 wherein: said plurality of first electronic components include spare components; said at least one second electronic component comprises means for rendering selected ones of said first components active in said system.
Claim 26
Dependent Claim
34 words
The electronic system recited in claim 1 wherein: said at least one second component exhibits electrical operating characteristics which would be changed if said layer of dielectric material were disposed on the surface thereof.
Claim 27
Dependent Claim
18 words
The electronic system recited in claim 26 wherein: said at least one second component comprises a radiation sensor.
Claim 28
Dependent Claim
15 words
The electronic system recited in claim 27 wherein: said radiation sensor is an image sensor.
Claim 29
Dependent Claim
18 words
The electronic system recited in claim 26 wherein: said at least one second component comprises a microwave component.
Claim 30
Dependent Claim
48 words
The electronic system recited in claim 1 wherein: said at least one second component comprises an electronically programmable read only memory; and said at least one second component is connected to selectively control the connection of said first components to external contacts of said high density interconnect structure.
Claim 31
Dependent Claim
19 words
The electronic system recited in claim 1 wherein: said at least one second electronic component comprises a thermoelectric cooler.
Claim 32
Dependent Claim
33 words
The electronic system recited in claim 1 wherein: said at least one second electronic component is subject to thermally induced deterioration at temperatures used in the fabrication of said high density interconnect structure.
Claim 33
Dependent Claim
32 words
The electronic system recited in claim 1 including: a plurality of said second electronic components, each of said plurality of said second electronic components being disposed on said high density interconnect structure.
Claim 34
Dependent Claim
111 words
An electronic system comprising: a multilayer stack of high density interconnect structures, each of said high density interconnect structures comprising: a plurality of first electronic components; a layer of dielectric material bonded to said first electronic components, and a pattern of high density interconnect conductors disposed on or in said dielectric material, said high density interconnect conductors interconnecting said first electronic components; a second high density interconnect structure disposed on a side surface of said multilayer stack and interconnecting the high density interconnect structure layers of said stack; and a second electronic component disposed on said second high density interconnect structure and electrically connected to said second high density interconnect structure.
Claim 35
Dependent Claim
104 words
An electronic system comprising: a first electronic component having contact pads on a first surface thereof; a high density interconnect structure comprising: a layer of dielectric material bonded to said first surface of said first electronic component, and a pattern of high density interconnect conductors disposed on or in said dielectric material, said high density interconnect conductors connecting said contact pads of said first electronic component to surface contact pads disposed on an exposed surface of said dielectric material; a second electronic component disposed on said high density interconnect structure and electrically connected to said surface contact pads of said high density interconnect structure.
Claim 36
Dependent Claim
34 words
The electronic system recited in claim 35 wherein: said first electronic component includes spare, redundant subsystems; and said second electronic component comprises means for rendering selected ones of said subsystems active in said system.
Claim 37
Dependent Claim
36 words
The electronic system recited in claim 35 wherein: said first electronic component includes a plurality of subsystems therein; and said second electronic component performs a decoding function for selecting among subsystems of said first electronic component.
Claim 38
Dependent Claim
31 words
The electronic system recited in claim 35 wherein: said second component exhibits electrical operating characteristics which would be changed if said layer of dielectric material were disposed on the surface thereof.
Claim 39
Dependent Claim
39 words
The electronic system recited in claim 35 wherein: said second component comprises an electronically programmable read only memory; and said second component is connected to selectively control the connection of subsystems within said first electronic component to external contacts.
Claim 40
Dependent Claim
16 words
The electronic system recited in claim 35 wherein: said first electronic component comprises a semiconductor chip.
Claim 41
Dependent Claim
106 words
In an electronic system of the type including a plurality of first electronic components, a high density interconnect structure including a layer of dielectric material bonded to said components and a pattern of conductors disposed on or in said dielectric material, the conductors of said high density interconnect structure electrically interconnecting said first electronic components, the improvement comprising: mounting a second electronic component on said high density interconnect structure; electrically connecting said second electronic component to said pattern of conductors; and applying control signals to said second component to cause it to connect selected ones of said first electronic components to external contacts of said system.
References Cited (Backward Citations)
No citation records indexed.
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