EP0450483A2
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EP
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Conductive resin composition
Assignee: Mitsui Toatsu Chemicals Inc
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Filing: 1991-03-27
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Granted: —
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Expires: 2011-03-27
Abstract
Abstract A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises: (A) from 50 to 95% by weight of a polyphenylene ether resin, (B) from 50 to 5% by weight of a copolymer of a styrenic compound and an α,β-unsaturated dicarboxylic acid imide compound, (C) from 5 to 30 parts by weight of a condcutive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
Inventors
- 👤 Toru Ueki
- 👤 Kenji Sakata
- 👤 Masaji Yoshimura
- 👤 Kazuharu Kanezaki
- 👤 Ineo Iwata
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 12:38
CPC Classifications
C; C08; C08L; C08L71/00; C08L71/08; C08L71/10; C08L71/12; H; H01; H01B; H01B1/00; H01B1/20; H01B1/24; C08K; C08K3/00; C08K3/02; C08K3/04; C08L25/00; C08L25/02; C08L71/123
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
97 words
A conductive resin composition comprising (A) from 50 to 95% by weight of a polyphenylene ether resin, (B) from 50 to 5% by weight of a copolymer of a styrenic compound and an α,β-unsaturated dicarboxylic acid imide, compound, (C) from 5 to 30 parts by weight of a conductive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
Claim 2
Dependent Claim
69 words
The conductive resin composition of claim 1 wherein the polyphenylene ether resin (A) is a homopolymer or a copolymer comprising one or more of structural units represented by the formula (I): wherein each of R₁, R₂, R₃ and R₄ is individually selected from the group consisting of a hydrogen atom, halogen atom, hydrocarbon, halogenated hydrocarbon, hydrocarbonoxy and halogenated hydrocarbonoxy group and n is an integer of 20 or more.
Claim 3
Dependent Claim
44 words
The conductive resin composition of claim 2 wherein the homopolymer or the copolymer is obtained by reaction of one or more of phenols selected from the group consisting of 2,6-dimethylphenol, 2,6-diethylphenol, 2,6-dibutylphenol, 2,6-didodecylphenol, 2,6-dipropylphenol, 2,6-diphenylphenol, 2-methyl-6-ethylphenol, 2-methyl-6-cyclohexylphenol, 2-methyl-6-methoxyphenol, 2-methyl-6-butylphenol, 2,6-dimethoxyphenol, 2,3,6-trimethylphenol, 2,3,5,6-tetramethylphenol and 2,6-diethoxyphenol.
Claim 4
Dependent Claim
30 words
The conductive resin composition of claim 1 wherein the polyphenylene ether resin (A) has an inherent viscosity of from 0.25 to 0.70 dl/g measured at 25°C in a chloroform solution.
Claim 5
Dependent Claim
33 words
The conductive resin composition of claim 1 wherein the styrenic compound used for the copolymer (B) is one or more of compounds selected from the group consisting of styrene, α-methylstyrene, o-methylstyrene and p-methylstyrene.
Claim 6
Dependent Claim
52 words
The conductive resin composition of claim 1 wherein the α,β-unsaturated dicarboxylic acid imide compound used for the copolymer (B) is represented by the formula (II): wherein each of R₅, R₆ and R₇ is individually selected from a hydrogen atom, alkyl, substituted alkyl, alkenyl, substituted alkenyl, cycloalkyl, substituted cycloalkyl, phenyl or substituted phenyl.
Claim 7
Dependent Claim
34 words
The conductive resin composition of claim 5 wherein the compound represented by the formula (II) is one or more of compounds selected from the group consisting of maleimide, N-methylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, N-(p-hydroxyphenyl)-maleimide and N-benzylmaleimide.
Claim 8
Dependent Claim
54 words
The conductive resin composition of claim 1 wherein, in the copolymer (B), the proportion of the styrenic compound to the α,β-unsaturated dicarboxylic acid imide compound is in the range of from 30 to 95% by weight of the styrenic compound and from 70 to 5% by weight of the α,β-unsaturated dicarboxylic acid imide compound.
Claim 9
Dependent Claim
29 words
The conductive resin composition of claim 1 wherein the copolymer (B) has a number average molecular weight of 30,000 or less based on standard polystyrene by gel permeation chromatography.
Claim 10
Dependent Claim
18 words
The conductive resin composition of claim 1 wherein the conductive carbon (C) is acetylene black or furnace black.
Claim 11
Dependent Claim
32 words
The conductive resin composition of claim 1 wherein the low molecular weight polystyrene (D) has a number average molecular weight of 30,000 or less based on standard polystyrene by gel permeation chromatography.
Claim 12
Dependent Claim
37 words
The conductive resin composition of claim 1 wherein the content of the polyphenylene ether resin (A) is from 80 to 95% by weight and the content of the copolymer (B) is from 20 to 5% by weight.
Claim 13
Dependent Claim
39 words
The conductive resin composition of claim 1 wherein the content of the conductive carbon (C) is from 6 to 20 parts by weight per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
Claim 14
Dependent Claim
41 words
The conductive resin composition of claim 1 wherein the content of the low molecular weight polystyrene (D) is from 2 to 15 parts by weight per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
References Cited (Backward Citations)
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