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EP0444347A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of assembling multigrooved silicon chip fiber optic terminations

Assignee: AT&T Inc
•
Filing: 1990-12-07
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Granted: —
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Expires: 2010-12-07
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Abstract

Abstract Described is a method for assembling multi-fiber array connectors. V-grooved silicon chips (11 and 12) are placed in a holder (10) which allows the chips to "float" with respect to each other and adjust to varying fiber diameters. Once the fibers (31) are inserted, the chips are clamped and cemented together with the fibers fixed in the grooves. The opposite opening of the holder, as also seen in the view in FIG. 2 comprises a cantilevered section including a pair of cantilevered arms, 16 and 17. Each arm includes seats, 18 and 19, for loosely holding the top and bottom chips, 11 and 12, respectively. The seats have essentially the same length and width as the chips so that the chips will be aligned in the x and y directions. The separation of the cantilevered members, 16 and 17, however, is such as to leave a small gap, typically less than the fiber diameter, between the two facing surfaces of the chips. Further, since the cantilevered arms are free to flex slightly and/or the chips are only loosely mounted in the vertical (z) direction, the gap between chips can vary as the fiber array is inserted therein. Thus, the chips "float" within the holder to allow the chips to be aligned by the fibers and to compensate for any variations in fiber diameter. The holder is typically plastic made by a standard molding process. Other materials could also be employed. The chips are inserted into the holder with the cantilevered section facing upward so that the chips fall into the seats, 18 and 19. The end of the cantilevered section is then deformed, in this example by heating, so that dimples, 24 and 25, are formed to keep the chips within the holder while maintaining the loose retention of the chips between the cantilevered members, 16 and 17.

Inventors

  • 👤 Rocco Bonanni
  • 👤 William Joseph Parzygnat
  • 👤 Roger Edward Weiss

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-01 11:27
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/36; G02B6/38; G02B6/3807; G02B6/3833; G02B6/3855; G02B6/3858; G02B6/3834; G02B6/3838; G02B6/3839; G02B6/3861; G02B6/3869

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 120 words
A method of fabricating optical connectors where an array of optical fibers is held within grooves formed in facing major surfaces of a pair of chips comprising the steps of: providing a holder (10) including said chips (11 and 12); inserting an array of optical fibers (31) in the grooves (13 and 14) in the facing surfaces of the chips; and bonding the facing surfaces of the chips together; CHARACTERIZED IN THAT the holder comprises a cantilevered section (16 and 17) which aligns the chips but permits a variable space between the facing major surfaces as the fibers are inserted; and subsequent to insertion of the fibers the chips are clamped so that the fibers are held within the grooves.
Claim 2
Dependent Claim 25 words
The method according to claim 1 wherein the holder includes said cantilevered section at one end and an enlarged opening (15) at an opposite end.
Claim 3
Dependent Claim 11 words
The method according to claim 1 wherein the chips comprise silicon.
Claim 4
Dependent Claim 23 words
The method according to claim 2 wherein between the cantilevered section and enlarged opening is a wall (20 and 21) which is chamfered
Claim 5
Dependent Claim 33 words
The method according to claim 1 further comprising the step of pulling on the array after lightly clamping the chips and prior to bonding the chips in order to test for broken fibers.
Claim 6
Dependent Claim 44 words
The method according to claim 1 further comprising the step of providing a housing (33) surrounding said holder subsequent to bonding said chips so that the resulting assembly can he mated with a similar assembly to couple light between the fibers of the assemblies.
Claim 7
Dependent Claim 37 words
The method according to claim 1 wherein the spacing between the major surfaces of the chips can vary within the range of 0 to 80 percent of the fiber diameter prior to insertion of the fibers therein.
Claim 8
Dependent Claim 35 words
The method according to claim 1 wherein the cantilevered section includes a pair of opposite cantilevered arms (16 and 17), each including a seat (18 and 19) within which one of said chips is mounted.
Claim 9
Dependent Claim 25 words
The method according to claim 1 wherein the entrance edges of the chips (22 and 23) comprise a chamfer and an enlarged fiber guidance groove.
Claim 10
Dependent Claim 31 words
The method according to claim 1 wherein the spacing between the major surfaces of the chips can vary within the range 12 to 100 µm during the insertion of the fibers.

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