EP0440264A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Process and device for soldering under a protective gas
Assignee: Individual
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Filing: 1988-10-22
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Granted: —
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Expires: 2008-10-22
Abstract
Abstract To solder electronic components within a protective gas, and in an oxygen-free atmos. a protective gas is used which is lighter than air within angled tunnel sections. Any air entering the tunnel assembly (1) collects at the deepest point. The outlet tunnel section (4) points downwards in the direction of material travel. The pref. protective gas is nitrogen.
Inventors
- 👤 Ernst Hohnerlein
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 08:08
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; B23K1/008; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2203/00; H05K2203/08; H05K2203/086
Claims Analysis
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References Cited (Backward Citations)
JPS56144860A
Cited
DE8520254U1
Cited
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