EP0439134A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Substrate for packaging a semiconductor device, packaging structure and method
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-01-23
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Granted: —
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Expires: 2011-01-23
Abstract
Abstract A substrate (3) for packaging a semiconductor device having a bump (2) thereon according to the present invention is characterized in that the substrate (3) has an electrode terminal (5) to which the bump (2) is to be connected and a recess (4) for receiving at least a top of the bump (2) is formed in the electrode terminal (5).
Inventors
- 👤 Masanori C/O Yokohama Works Of Nishiguchi
- 👤 Atushi C/O Yokohama Works Of Miki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 10:27
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05; H05K; H05K1/00; H05K1/02; H05K1/0284; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/40; H05K3/4007; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/221; H10W72/227; H10W72/241; H10W72/29; H10W72/90; H10W72/921; H10W72/926; H10W80/00; H10W80/161; H10W80/168; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
50 words
A substrate for packaging a semiconductor device having a bump projecting therefrom, characterized in that said substrate has an electrode terminal to which said bump is to be connected, and a recess for receiving at least a top of said bump is formed on a surface of said electrode terminal.
Claim 2
Dependent Claim
29 words
A substrate for packaging a semiconductor device according to Claim 1 characterized in that a depth of said recess increases as it goes from a periphery to a center.
Claim 3
Dependent Claim
22 words
A substrate for packaging a semiconductor device according to Claim 2 characterized in that the depth of said recess gradually increases stepwise.
Claim 4
Dependent Claim
22 words
A substrate for packaging a semiconductor device according to Claim 2 characterized in that the depth of said recess gradually increases continuously.
Claim 5
Dependent Claim
38 words
A substrate for packaging a semiconductor device according to Claim 1 characterized in that a top of said bump is of substantially spherical shape and said recess has a larger radius of curvature than that of said top.
Claim 6
Dependent Claim
54 words
A substrate for packaging a semiconductor device having a bump projecting therefrom, characterized in that said substrate has a recess formed on a surface thereof to receive at least a top of said bump, and an electrode terminal to which said bump is to be connected is formed at a center of said recess.
Claim 7
Dependent Claim
22 words
A substrate for packaging a semiconductor device according to Claim 6 characterized in that said electrode terminal is formed by selective plating.
Claim 8
Dependent Claim
65 words
A packaging structure of a semiconductor device characterized in that: a semiconductor device having a bump formed thereon to project therefrom; and a packaging substrate which has a recess for receiving at least a top of said bump is formed on the surface of a substrate and electrode terminal to which said bump is to be connected is formed at a center of said recess.
Claim 9
Dependent Claim
22 words
A packaging structure of a semiconductor device according to Claim 8 characterized in that said electrode terminal is formed by selective plating.
Claim 10
Dependent Claim
63 words
A packaging structure of a semiconductor device characterized in that: A semiconductor device having a plurality of bump formed thereon to project therefrom, some of said bumps projecting more largely than the remaining bumps; and a packaging substrate which has an electrode terminals formed correspondingly to said some of said bumps and having recesses for receiving tops of said some of said bumps.
Claim 11
Dependent Claim
31 words
A packaging structure of a semiconductor device according to Claims 8 or 10 characterized in that a depth of said recesses increases as it goes from a periphery to a center.
Claim 12
Dependent Claim
22 words
A packaging structure of a semiconductor device according to Claim 11 characterized in that the depth of said recesses gradually increases stepwise.
Claim 13
Dependent Claim
22 words
A packaging structure of a semiconductor device according to Claim 11 characterized in that the depth of said recess gradually increases continuously.
Claim 14
Independent Claim
104 words
A method for packaging a semiconductor device on a packaging substrate by directly connecting a plurality of bumps projecting from a plurality of electrode terminals on said packaging substrate, comprising the steps of: forming some of said bumps on said semiconductor device higher than the remaining bumps and forming recesses for receiving tops of said bumps in some of said electrode terminals formed on said packaging substrate correspondingly to said some of said bumps; inserting the tops of said some of said bumps into said recesses to position said semiconductor device to said packaging substrate; and packaging said semiconductor device to said packaging substrate.
Claim 15
Dependent Claim
26 words
A method for packaging a semiconductor device according to Claim 14 characterized in that said some of said bumps are arranged on a low density area.
Claim 16
Dependent Claim
32 words
A method for packaging a semiconductor device according to Claim 14 characterized in that said some of said bumps and said some of said electrode terminals are ones for exclusively positioning use.
Claim 17
Dependent Claim
56 words
A method for packaging a semiconductor device according to Claim 14 characterized in that instead of forming said recesses in said some of said electrode terminals, recesses for receiving the tops of said some of said bumps to arrange said some of said electrode terminals at centers of the recesses are formed in said packaging substrate.
Claim 18
Dependent Claim
66 words
A packaging structure of a semiconductor device characterized in that: a packaging substrate having a bump formed thereon to project therefrom; and a semiconductor device which has a recess for receiving at least a top of said bump is formed on the surface of the semiconductor device and electrode terminal to which said bump is to be connected is formed at a center of said recess.
References Cited (Backward Citations)
No citation records indexed.
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