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EP0438165A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor device parts

Assignee: Toshiba Corp
•
Filing: 1991-01-18
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Granted: —
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Expires: 2011-01-18
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Abstract

Abstract External electrode terminal parts (12) and a plastic terminal supporting body (11) are individually formed, and the terminal parts (12) are inserted into through holes (11a) of the terminal supporting body (11), thereby completing a terminal holder (10). Each of the terminal parts (12) has a stopper portion (12a) at a predetermined position in its longitudinal direction, such that the stopper portion (12a) is wider than the width of the hole (11a) in the terminal supporting body (11). Hence, the distance between the terminal supporting body (11) and the end of the terminal parts (12) is defined when the terminal parts (12) are inserted into holes (11a) of the terminal supporting body (11). In addition, since the terminal parts (12) includes a spring portion (12b) which abuts against the inner wall of the hole (11a) in the terminal supporting body (11) when inserted therein, the terminal parts (12) cannot be slipped out of the terminal supporting body (11). Since the terminal holder (10) is formed by only inserting the terminal parts (12) into the holes (11a) of the plastic terminal supporting body (11), the terminal parts (12) cannot be deformed, and the terminal holder (10) can be manufactured easily even if the number of terminal parts (12) is large or the configuration thereof is complicated.

Inventors

  • 👤 Toshikazu C/O Intellectual Prop. Div. Deie

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 23:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H01; H01R; H01R13/00; H01R13/40; H01R13/405; H01R13/41; H10W70/60; H10W70/62; H10W70/63; H10W70/635

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 91 words
A semiconductor device parts (10) comprising: plastic terminal supporting means (11) having through holes (11a) which serves as a portion of a package of a plastic packaged semiconductor device; and external electrode terminal means (12), inserted in said through holes (11a) for connecting internal electrodes of said semiconductor device to an external device, each of said external electrode terminal means (12) having a stopper portion (12a) which engages with one of said through holes (11a) and a spring portion (12b) which abuts against an inner wall of said through hole (11a).
Claim 2
Dependent Claim 37 words
The semiconductor device parts (10) according to claim 1, characterized in that said through holes (11a) are stepped holes, and said stopper portion (12a) is a stepped shoulder portion which fit in with said stepped hole (11a).
Claim 3
Dependent Claim 35 words
The semiconductor device parts (10) according to claim 1, characterized in that said spring portion (12b) of each terminal means (12) is formed by bending a portion of said terminal means (12) in one direction.
Claim 4
Dependent Claim 40 words
The semiconductor device parts (10) according to claim 1, characterized in that said stopper portion (12a) and said spring portion (12b) are formed at substantially the same predetermined positions of every external electrode terminal means (12) in its longitudinal direction.

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