EP0431493A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of preparing an IC card, and the apparatus for preparing the same
Assignee: Konica Minolta Inc
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Filing: 1990-11-30
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Granted: —
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Expires: 2010-11-30
Abstract
Abstract A method and an apparatus for preparing an IC card (4) are disclosed. The method comprises the steps of; a) exposing imagewise a light-sensitive material (14) to form a latent image, b) superposing the exposed material on an image receiving material (1, 12, 33) comprising an image receiving layer, c) developing the superimposed material to form an image by applying heat, d) transferring the image formed in the light-sensitive material (14) to the image receiving layer by applying heat and pressure, e) seperating an image receiving material comprising an image receiving layer having the transferred image from the superimposed material, and f) adhering the image receiving material comprising the image receiving layer having the transferred image to a card comprising a built-in IC device (5).
Inventors
- 👤 Tawara Konica Corporation Komamura
- 👤 Takao Konica Corporation Nimura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 23:43
CPC Classifications
B; B42; B42D; B42D25/00; B42D25/40; B42D25/405; B42D25/415; B42D25/42; B42D25/45; B42D25/455; B42D25/46; G; G06; G06K; G06K19/00; G06K19/06; G06K19/06009; G06K19/06046; B42D25/30; B42D25/309; B42D25/465; B42D25/47
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
111 words
A method for preparing an IC card comprising the steps of; a) exposing imagewise a light-sensitive material to form a latent image, b) superposing the exposed material on an image receiving material comprising an image receiving layer, c) developing the superimposed material to form an image by applying heat, d) transferring the image formed in the light-sensitive material to the image receiving layer by applying heat and pressure, e) seperating an image receiving material comprising an image receiving layer having the transferred image from the superimposed material, and f) adhering the image receiving material comprising the image receiving layer having the transferred image to a card comprising a built-in IC device.
Claim 2
Dependent Claim
17 words
The method of claim 1, wherein said developing and said transferring are conducted at the same time.
Claim 3
Dependent Claim
19 words
The method of claim 1, wherein said adhering is conducted by fusing with heat or through an adhesive layer.
Claim 4
Dependent Claim
14 words
The method of claim 3, wherein said adhering is conducted by fusing with heat.
Claim 5
Dependent Claim
19 words
The method of claim 1, wherein said adhering is conducted through said image receiving layer having the transferred image.
Claim 6
Dependent Claim
40 words
The method of claim 1, wherein said heat and pressure are conducted at a temperature within the range of 120 to 150 °C and at a pressure within the range of 10 to 15 kg/cm² for 1 to 30 seconds.
Claim 7
Dependent Claim
17 words
The method of claim 1, wherein said image receiving layer is a layer of a thermoplastic resin.
Claim 8
Dependent Claim
15 words
The method of claim 7, wherein said thermoplastic resin includes polyvinylchlorides, polyesters, polycarbonates or polyethylenes.
Claim 9
Dependent Claim
11 words
The method of claim 7, wherein said thermoplastic resin includes polyvinylchlorides.
Claim 10
Dependent Claim
26 words
The method of claim 7, wherein said thermoplastic resin is substantially the same as a second thermoplastic resin of said card comprising a built-in IC device.
Claim 11
Dependent Claim
26 words
The method of claim 7, wherein a thickness of said layer of said thermoplastic resin is in a range of from 5 to 200 µ m.
Claim 12
Independent Claim
112 words
A method for preparing an IC card comprising the steps of; a) superposing an image transfer material comprising a colorant capable of being transferred by applying heat on an image receiving material comprising an image receiving layer, b) forming an image in the image transfer material by heating imagewise, c) transferring the image formed in the image transfer material to the image receiving layer by applying heat and pressure, d) seperating an image receiving material comprising an image receiving layer having the transferred image from the superimposed material, and e) adhering the image receiving material comprising the image receiving layer having the transferred image to a card comprising a built-in IC device.
Claim 13
Dependent Claim
17 words
The method of claim 12, wherein said forming and said transferring are conducted at the same time.
Claim 14
Dependent Claim
19 words
The method of claim 12, wherein said adhering is conducted by fusing with heat or through an adhesive layer.
Claim 15
Dependent Claim
14 words
The method of claim 14, wherein said adhering is conducted by fusing with heat.
Claim 16
Dependent Claim
19 words
The method of claim 12, wherein said adhering is conducted through said image receiving layer having the transferred image.
Claim 17
Dependent Claim
43 words
The method of claim 12, wherein said heat and pressure in step c) are conducted at a temperature within the range of 120 to 150 °C and at a pressure within the range of 10 to 15 kg/cm² for 1 to 30 seconds.
Claim 18
Dependent Claim
17 words
The method of claim 12, wherein said image receiving layer is a layer of a thermoplastic resin.
Claim 19
Dependent Claim
15 words
The method of claim 18, wherein said thermoplastic resin includes polyvinylchlorides, polyesters, polycarbonates or polyethylenes.
Claim 20
Dependent Claim
11 words
The method of claim 18, wherein said thermoplastic resin includes polyvinylchlorides.
Claim 21
Dependent Claim
26 words
The method of claim 18, wherein said thermoplastic resin is substantially the same as a second thermoplastic resin of said card comprising a built-in IC device.
Claim 22
Dependent Claim
26 words
The method of claim 12, wherein a thickness of said layer of said thermoplastic resin is in a range of from 5 to 200 µ m.
Claim 23
Independent Claim
47 words
An apparatus for preparing an IC card comprising; a) a means for forming an image in an image receiving material comprising an image receiving layer, and b) a means for adhering the image receiving material having the formed image to a card comprising a built-in IC device.
References Cited (Backward Citations)
No citation records indexed.
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