EP0429340A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Modified high density backplane connector
Assignee: Augat Inc
•
Filing: 1990-11-13
•
Granted: —
•
Expires: 2010-11-13
Abstract
Abstract The connector (10) is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules (30), a connector housing (60), a pcb biasing mechanism, connector end caps, a flexible film, two interactive biasing modules for each contact module and a camming member (130) secured to the pcb to be mated. The contact module holds the arrays of interconnect contact rivets (52 d b), provides connector to pcb alignment and provides the capability to readily reconfigure the MHDB connector for different applications. The interactive biasing modules coact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector.
Inventors
- 👤 Steven P. Marian
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 08:59
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/70; H01R12/77; H01R12/79; H01R13/00; H01R13/648; H01R13/658; H01R12/50; H01R12/59; H01R12/62; H01R12/7005; H01R12/7011; H01R12/7047; H01R12/71; H01R12/712; H01R12/714; H01R4/00; H01R4/06
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
432 words
A modified high density backplane connector for mating and electrically interconnecting first and second printed circuit boards having predetermined geometric arrays of signal, ground and power contact pads, comprising: contact module means for aligning said modified high density backplane connector with the second printed circuit board, said contact module means including first and second arrays of contacts corresponding to the predetermined geometric arrays of signal and ground contact pads of the first and second printed circuit boards, respectively, said second array of contacts being electrically interconnected to the predetermined geometric array of ground and signal contact pads of the second printed circuit board; flexible film means for providing a conductive matrix including first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means and means for electrically interconnecting said first and second arrays of contact pads of said conductive matrix, said flexible film means interacting with said contact module means to provide electrical interconnection between said first and second arrays of contacts of said contact module means by means of said conductive matrix; interactive biasing module means interacting with said flexible film means for providing uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means; and means for providing sequenced movement of the first printed circuit board during mating thereof with said modified high density backplane connector to electrically interconnect said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board, said sequenced movement providing means including biasing means mechanically interacting with the first printed circuit board for displacing the first printed circuit board away from said modified high density backplane connector to initially mate the first printed circuit board to said modified high density backplane connector without mechanical contact between said first array of contacts of said contact module means and the predetermined geometric array of ground and signal contact pads of the first printed circuit board, said biasing means further providing early ground electrical interconnection between discrete ground pads of the first and second printed circuit boards, and camming means for displacing the first printed circuit board into said modified high density backplane connector to finally mate the first printed circuit board to said modified high density backplane connector with wiping action and final electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board.
Claim 2
Dependent Claim
432 words
A modified high density backplane connector for mating and electrically interconnecting first and second printed circuit boards having predetermined geometric arrays of signal, ground and power contact pads, comprising: contact module means for aligning said modified high density backplane connector with the second printed circuit board, said contact module means including first and second arrays of contacts corresponding to the predetermined geometric arrays of signal and ground contact pads of the first and second printed circuit boards, respectively, said second array of contacts being electrically interconnected to the predetermined geometric array of ground and signal contact pads of the second printed circuit board; flexible film means for providing a conductive matrix including first and second arrays of contact pads corresponding to said first and second arrays of contacts, respectively, of said contact module means and means for electrically interconnecting said first and second arrays of contact pads of said conductive matrix, said flexible film means interacting with said contact module means to provide electrical interconnection between said first and second arrays of contacts of said contact module means by means of said conductive matrix; interactive biasing module means interacting with said flexible film means for providing uniform contact force distribution and displacement tolerance relief for said first and second arrays of contacts of said contact module means; and means for providing sequenced movement of the first printed circuit board during mating thereof with said modified high density backplane connector to electrically interconnect said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board, said sequenced movement providing means including biasing means mechanically interacting with the first printed circuit board for displacing the first printed circuit board away from said modified high density backplane connector to initially mate the first printed circuit board to said modified high density backplane connector without mechanical contact between said first array of contacts of said contact module means and the predetermined geometric array of ground and signal contact pads of the first printed circuit board, said biasing means further providing early ground electrical interconnection between discrete ground pads of the first and second printed circuit boards, and camming means for displacing the first printed circuit board into said modified high density backplane connector to finally mate the first printed circuit board to said modified high density backplane connector with wiping action and final electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board.
Claim 3
Dependent Claim
110 words
The modified high density connector of claim 1 wherein said camming means comprises connector housing means configured for mating with said contact module means, said connector housing means including a complementary camming structure, and means for coacting with said complementary camming structure of said connector housing means to displace the first printed circuit board into said modified high density backplane connector to finally mate the first printed circuit board to said modified high density backplane connector with wiping action and final electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board.
Claim 4
Dependent Claim
110 words
The modified high density connector of claim 2 wherein said coacting means comprises a camming member secured to the first printed circuit board, said camming member including tapered camming surfaces and planar engaging surfaces for coacting with said connector housing means and said complementary camming structure thereof to displace the first printed circuit board into said modified high density backplane connector to finally mate the first printed circuit board to said modified high density backplane connector with wiping action and final electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board.
Claim 5
Dependent Claim
23 words
The modified high density backplane connector of claim 1 further comprising a connector housing means configured for mating with said contact module means.
Claim 6
Dependent Claim
115 words
The modified high density backplane connector of claim 1 further comprising connector housing means conf igured for mating with said contact module means, and connector end cap means configured for mating with said connector housing means to seal said modified high density backplane connector means, said connector end cap means including said biasing means for displacing the first printed circuit board away from said modified high density backplane connector to initially mate the first printed circuit board to said modified high density backplane connector without mechanical contact between said first array of contacts of said contact module means and the predetermined geometric array of ground and signal contact pads of the first printed circuit board.
Claim 7
Dependent Claim
42 words
The modified high density backplane connector of claim 5 further comprising mounting block means configured for mating with said connector housing means, said mounting block means being interposed in abutting relation between said connector housing means and said connector end cap means.
Claim 8
Dependent Claim
31 words
The modified high density backplane connector of claim 6 wherein said mounting block means further comprises means for securing said modified high density backplane connector to the second printed circuit board.
Claim 9
Dependent Claim
32 words
The modified high density backplane connector of claim 5 wherein said connector end cap means further comprises means for securing said modified high density backplane connector to the second printed circuit board.
Claim 10
Dependent Claim
90 words
The modified high density backplane connector of claim 5 wherein said connector end cap means includes camming linkage means for coacting with the first printed circuit board to displace the first printed circuit board into said modified high density backplane connector to finally mate the first printed circuit, board to said modified high density backplane connector with wiping action and final electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact, pads of the first printed circuit board.
Claim 11
Dependent Claim
34 words
The modified high density backplane connector of claim 1 further comprising power contact module means for providing power circuit paths between the discrete power contact pads of the first and second printed circuit boards.
Claim 12
Dependent Claim
88 words
The modified high density backplane connector of claim 10 wherein said power contact contact module means includes biasing means interacting with the first printed circuit board for displacing the first printed circuit board away from said modified high density backplane connector to initially mate of the first printed circuit board to said modified high density backplane connector without mechanical contact between said first array of contacts of said contact module means and the predetermined geometric array of ground and signal contact pads of the first printed circuit board.
Claim 13
Dependent Claim
73 words
The modified high density backplane connector of claim 1 further comprising biasing wedge means configured for mating with said contact module means and for mechanically engaging the first printed circuit board mated with said modified high density backplane connector to ensure and maintain positive electrical interconnection between said first array of contacts of said contact module means and respective ones of the ground and signal contact pads of the first printed circuit board.
Claim 14
Dependent Claim
125 words
The modified high density backplane connector of claim 1 wherein said interactive biasing module means comprises resilient means abutting said flexible film opposite said first and second arrays of contact pads, respectively, of said conductive matrix for providing displacement tolerance relief for said first and second arrays of contacts of said contact module means; plate means abutting said resilient means for providing uniform distribution of contact forces over said first and second arrays of contacts of said contact module means; force generating spring means secured to said plate means for providing said contact forces to bias said lirst and second arrays of contact pads of said conductive matrix into electrical engagement with said first and second arrays of contact pads of said contact module means.
Claim 15
Dependent Claim
64 words
The modified high density backplane connector of claim 4 wherein said contact module means comprises at least first and second contact modules and further comprising intermediate mounting block means configured for mating with said connector housing means for providing spacing between said at least first and second contact modules and for securing said modified high density backplane connector to the second printed circuit board.
Claim 16
Dependent Claim
87 words
The modified high density backplane connector of claim 14 wherein said intermediate mounting block means includes spring biasing means interacting with the first printed circuit board for displacing the first printed circuit board away from said modified high density backplane connector to initially mate the first printed circuit board to said modified high density backplane connector without mechanical contact between said second array of contacts of said contact module means and the predetermined geometric array of ground and signal contact pads of the first printed circuit board.
Claim 17
Dependent Claim
89 words
The modified high density backplane connector of claim 1 wherein said flexible film means comprises: a thin film having first and second longitudinal edges formed from a resilient dielectric material; said first array of contact pads being formed on one major surface of said thin film adjacent said first longitudinal edge thereof; said second array of contact pads being formed on said one major surface of said thin film adjacent said second longitudinal edge thereof; and a ground plane formed on said other major surface of said thin film.
Claim 18
Dependent Claim
79 words
The modified high density backplane connector of claim 16 wherein said flexible film means further comprises first and second metallic ground strips formed along said first and second edges of said thin film on said one major surface thereof, each said first and second metallic ground strips including a plurality of plated-through holes to provide electrical interconnection between said first and second metallic ground strips and said ground plane formed on said other major surface of said thin film.
References Cited (Backward Citations)
FR2154363A1
Cited
US4869676A
Cited
US4552420A
Cited
US4693530A
Cited
US4795977A
Cited
US4838798A
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.