EP0427020A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method and device for processing soldering joint partners
Assignee: Herbert Streckfuss Maschinenbau- und Verwaltungs-K
•
Filing: 1990-10-17
•
Granted: —
•
Expires: 2010-10-17
Abstract
Abstract A method of processing members to be joined by soldering, preferably of printed circuit boards equipped with electrical components, and a device for carrying out this method are disclosed, the members to be joined being subjected to a plasma treatment before the soldering operation. The members to be joined can alternatively be subjected to the plasma treatment separately or in the relative position required for the soldering operation. <IMAGE>
Inventors
- 👤 Volker Dipl.-Ing. Liedke
- 👤 Hans-Jürgen Albrecht
- 👤 Wilfred John
- 👤 Karl Heinz Grasmann
- 👤 Harald Wittrich
- 👤 Wolfgang Scheel
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:43
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3489; B; B23; B23K; B23K1/00; B23K1/008; B23K1/20; B23K1/206; B23K35/00; B23K35/22; B23K35/38; C; C23; C23G; C23G5/00; B23K2101/00; B23K2101/36; B23K2101/40
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.