EP0424106A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A method for connecting circuit boards
Assignee: Sharp Corp
•
Filing: 1990-10-17
•
Granted: —
•
Expires: 2010-10-17
Abstract
Abstract A method for connecting circuit boards in which a first circuit board having first electrodes is superposed on a second circuit board of which second electrodes are formed in positions corresponding to the first electrodes so that the first and second electrodes are electrically connected with each other, the method comprising a first step of applying a photocuring adhesive on the first electrodes and the residual regions of the first circuit board on which the first electrodes are not formed, a second step of irradiating light from a surface opposite to the surface of the first circuit board on which the first electrodes are formed to cure the photocuring adhesive on the residual regions of the first circuit board on which the first electrodes are not formed, a third step of adhering particles which are conductive at least on outer peripheral surfaces to the first electrodes by means of the uncured photocuring adhesive, and a fourth step of superposing the first circuit board to which the particles are adhered on the second circuit board to electrically connect the first and second electrodes with each other through the particles, provided that the first electrodes are opaque and the first circuit board is light-transmissive.
Inventors
- 👤 Hiroshi Matsubara
- 👤 Takashi Nukii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 18:21
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0108; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0525; H05K3/10; H05K3/102; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/321; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
203 words
In a method for connecting circuit boards in which a first circuit board having first electrodes is superposed on a second circuit board of which second electrodes are formed in positions corresponding to the first electrodes so that the first and second electrodes are electrically connected with each other, the method comprising: a first step of applying a photocuring adhesive on the first electrodes and the residual regions of the first circuit board on which the first electrodes are not formed; a second step of irradiating light from a surface opposite to the surface of the first circuit board on which the first electrodes are formed to cure the photocuring adhesive on the residual regions of the first circuit board on which the first electrodes are not formed; a third step of adhering particles which are conductive at least on outer peripheral surfaces to the first electrodes by means of the uncured photocuring adhesive; and a fourth step of superposing the first circuit board to which the particles are adhered on the second circuit board to electrically connect the first and second electrodes with each other through the particles, provided that the first electrodes are opaque and the first circuit board is light-transmissive.
Claim 2
Dependent Claim
203 words
In a method for connecting circuit boards in which a first circuit board having first electrodes is superposed on a second circuit board of which second electrodes are formed in positions corresponding to the first electrodes so that the first and second electrodes are electrically connected with each other, the method comprising: a first step of applying a photocuring adhesive on the first electrodes and the residual regions of the first circuit board on which the first electrodes are not formed; a second step of irradiating light from a surface opposite to the surface of the first circuit board on which the first electrodes are formed to cure the photocuring adhesive on the residual regions of the first circuit board on which the first electrodes are not formed; a third step of adhering particles which are conductive at least on outer peripheral surfaces to the first electrodes by means of the uncured photocuring adhesive; and a fourth step of superposing the first circuit board to which the particles are adhered on the second circuit board to electrically connect the first and second electrodes with each other through the particles, provided that the first electrodes are opaque and the first circuit board is light-transmissive.
Claim 3
Dependent Claim
43 words
A method according to Claim 1, wherein the adhesive is injected between the residual regions on which the first and second electrodes are not formed so that the first circuit board is superposed on the second circuit board in a fourth step .
Claim 4
Dependent Claim
31 words
A method according to Claim 1, wherein the first circuit board is superposed on the second circuit board by external force of a clip or the like in a fourth step.
Claim 5
Dependent Claim
38 words
A method according to Claim 1, further comprising a fifth step of irradiating the light from the surface of the first circuit board to cure the uncured photocuring adhesive on the first electrodes between third and fourth steps.
Claim 6
Dependent Claim
48 words
A method according to Claim 1, wherein the photocuring adhesive is formed of oligomers and/or monomers which keep adhesive when the light has not been irradiated yet and which are photopolymerized and cured to become non-adhesive in the presence of a photopolymerization initiator when the light is irradiated.
Claim 7
Dependent Claim
24 words
A method according to Claim 5, wherein the oligomer is an acrylate oligomer such as polyester acrylate, epoxy acrylate, urethane acrylate or the like.
Claim 8
Dependent Claim
21 words
A method according to Claim 5, wherein the monomer is a monofunctional acrylate derivative, a multifunctional acrylate derivative or N-vinyl pyrrolidone.
Claim 9
Dependent Claim
28 words
A method according to claim 1, wherein the photocuring adhesive is applied with a thickness of one tenth to one half of a diameter of the conductive particle.
Claim 10
Independent Claim
115 words
A method for connecting circuit boards for providing electrical contact between a set of electrodes on a first circuit board with a corresponding set of electrodes on a second circuit board, characterised in that the method includes the steps of: applying a curable adhesive to a set of electrodes on the first circuit board and residual regions between the electrodes; curing the adhesive applied to the residual regions while leaving the adhesive covering the electrodes uncured; adhering particles conductive on at least their peripheral surfaces to the uncured regions of the adhesive; and bringing the first and second circuit boards into mutual contact so as to effect electrical contact between said respective sets of electrodes.
Claim 11
Independent Claim
115 words
A method for connecting circuit boards for providing electrical contact between a set of electrodes on a first circuit board with a corresponding set of electrodes on a second circuit board, characterised in that the method includes the steps of: applying a curable adhesive to a set of electrodes on the first circuit board and residual regions between the electrodes; curing the adhesive applied to the residual regions while leaving the adhesive covering the electrodes uncured; adhering particles conductive on at least their peripheral surfaces to the uncured regions of the adhesive; and bringing the first and second circuit boards into mutual contact so as to effect electrical contact between said respective sets of electrodes.
Claim 12
Dependent Claim
22 words
A connector for electrically connecting circuit boards comprising a light-transmissive board having a plurality of opaque electrodes disposed on a first surface.
Claim 13
Dependent Claim
22 words
A connector for electrically connecting circuit boards comprising a light-transmissive board having a plurality of opaque electrodes disposed on a first surface.
Claim 14
Independent Claim
63 words
A method for applying particles conductive on at least their peripheral surfaces to a set of opaque electrodes disposed on a light-transmissive board comprising the steps of: applying a photocurable adhesive to the electrodes and residual regions between the electrodes; and irradiating the photocurable adhesive using the opaque electrodes as a mask to prevent photocuring of regions of the adhesive covering the electrodes.
Claim 15
Independent Claim
63 words
A method for applying particles conductive on at least their peripheral surfaces to a set of opaque electrodes disposed on a light-transmissive board comprising the steps of: applying a photocurable adhesive to the electrodes and residual regions between the electrodes; and irradiating the photocurable adhesive using the opaque electrodes as a mask to prevent photocuring of regions of the adhesive covering the electrodes.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.