EP0422906A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electrodes on a mounting substrate and a liquid crystal display apparatus including same
Assignee: Sharp Corp
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Filing: 1990-10-09
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Granted: —
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Expires: 2010-10-09
Abstract
Abstract An electrode wiring (4-5) on a mounting substrate (1) adapted for use in liquid crystal (3) display apparatus (20), the electrode wiring including portions of Mo or Mo alloy (10) to which bumps (7) of an integrated circuit (6) such as LSI is bonded with conductive paste (8).
Inventors
- 👤 Hirokazu Yoshida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 02:14
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
35 words
An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring comprising portions of Mo to which bumps of an integrated circuit such as an LSI are connected.
Claim 2
Dependent Claim
35 words
An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring comprising portions of Mo to which bumps of an integrated circuit such as an LSI are connected.
Claim 3
Dependent Claim
36 words
An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring comprising portions of Mo alloy to which bumps of an integrated circuit such as an LSI are connected.
Claim 4
Dependent Claim
36 words
An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring comprising portions of Mo alloy to which bumps of an integrated circuit such as an LSI are connected.
Claim 5
Dependent Claim
20 words
An electrode wiring according to claim 1, wherein the mounting substrate is a substrate of a liquid crystal display panel.
Claim 6
Dependent Claim
20 words
An electrode wiring according to claim 2, wherein the mounting substrate is a substrate of a liquid crystal display panel.
Claim 7
Dependent Claim
29 words
An electrode wiring according to claim 1 or 2, wherein the portions of Mo or Mo alloy are connected to the bumps of an integrated circuit through conductive paste.
Claim 8
Dependent Claim
46 words
An assembly of a substrate with a conductive wiring pattern formed on a surface thereof, and an integrated circuit mounted on said surface with electrodes overlying and electrically connected to respective portions of said wiring patter, wherein said portions comprise Mo or an alloy including Mo.
Claim 9
Dependent Claim
46 words
An assembly of a substrate with a conductive wiring pattern formed on a surface thereof, and an integrated circuit mounted on said surface with electrodes overlying and electrically connected to respective portions of said wiring patter, wherein said portions comprise Mo or an alloy including Mo.
Claim 10
Dependent Claim
35 words
An assembly of a liquid crystal cell substrate with a wiring pattern and an IC chip bonded face down on the substrate with electrodes (bumps) thereof electrically connected to pads of Mo or Mo alloy.
Claim 11
Dependent Claim
35 words
An assembly of a liquid crystal cell substrate with a wiring pattern and an IC chip bonded face down on the substrate with electrodes (bumps) thereof electrically connected to pads of Mo or Mo alloy.
References Cited (Backward Citations)
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