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EP0421343A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor element package and semiconductor element package mounting distributing circuit basic plate

Assignee: Panasonic Holdings Corp
•
Filing: 1990-10-02
•
Granted: —
•
Expires: 2010-10-02
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Abstract

Abstract A semiconductor element package (P) and a semiconductor element package mounting distributing circuit basic plate, wherein the shield metallic layer (60) is provided on the flexible insulating basic plate for constituting the package, so that the semiconductor element (30) mounted on the flexible insulating basic plate (10) may be kept electromagnetically shielded positively with the shield metallic layer, whereby troublesome operation such as mounting the bulk high box shaped electromagnetic shield member on the outside of the semiconductor element package mounted on the distributing circuit basic plate as in the conventional one is not required, and, also, since the shield metallic layer is provided on the face, which is not formed with the lead patterns, of the flexible insulating basic plate, no influences are applied at all upon the construction of the land pattern and the mounting construction of the semiconductor element.

Inventors

  • 👤 Yutaka Makino
  • 👤 Kazumi Ishimoto
  • 👤 Yasuo Izumi
  • 👤 Yoshifumi Kitayama
  • 👤 Koichi Kumagai

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 01:04
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/181; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H10; H10W; H10W42/00; H10W42/20; H10W70/00; H10W70/40; H10W70/451; H10W70/60; H10W70/67; H10W70/688; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10507; H05K2201/10522; H05K2201/1053; H05K2201/10613; H05K2201/10621; H05K2201/10681; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 70 words
(1) A semiconductor element package, wherein a semi­conductor element is mounted with lead patterns being formed on the single face of a flexible insulating basic plate, each electrode of the semiconductor element is electrically connected with the lead patterns, characterized in that the shield metallic layer for electromagnetic shield use is formed on the face, opposite to the lead pattern forming face, of the above described flexible insulating basic plate.
Claim 2
Dependent Claim 29 words
(2) A semiconductor element package described in accordance with the claim 1, wherein the lead patterns and the shield metallic layer are made of metallic materials different in type.
Claim 3
Dependent Claim 51 words
(3) A semiconductor element package described in accordance with the claim 1, wherein the shield metallic layer is electrically connected with the land portion formed on the face of the lead pattern forming side of the flexible insulating basic plate through a through hole extending through the flexible insulating basic plate.
Claim 4
Dependent Claim 60 words
(4) A semiconductor element package mounting distrib­uting circuit basic plate, which is a distributing circuit basic plate with the semiconductor element package described in accordance with the claim 1 being mounted on it, wherein the shield metallic layer is provided on the basic plate surface in the locations not covered with the shield metal­lic layer of the semiconductor element package.
Claim 5
Dependent Claim 56 words
(5) A semiconductor element package mounting distrib­uting circuit basic plate, which is a distributing circuit basic plate with the semiconductor element package described in accordance with the claim 1 being mounted on it, wherein the shield metallic layer of the semiconductor element package is connected with the earth circuit formed on the distributing circuit basic plate.
Claim 6
Dependent Claim 51 words
(6) A semiconductor element package mounting distrib­uting circuit basic plate described in accordance with the claim 5, wherein the earth circuit is an inner layer circuit provided within the basic plate interior of the distributing circuit basic plate, with the shield metallic layer being connected with it through the through hole.

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