EP0421086A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Epoxy acrylate resins and photosensitive resin compositions therefrom
Assignee: Nippon Steel Chemical and Materials Co Ltd
•
Filing: 1990-08-07
•
Granted: —
•
Expires: 2010-08-07
Abstract
Abstract Epoxy acrylate resins of this invention having a structure of the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an interger from 0 to 20 are heat-resistant, solventsoluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.
Inventors
- 👤 Kazuhiro C/O R&D Laboratories-I Watanabe
- 👤 Takero C/O R&D Laboratories-I Teramoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 13:08
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; C; C08; C08F; C08F20/00; C08F20/02; C08F20/10; C08F20/26; C08F20/30; C08F299/00; C08F299/02; C08F299/026; C08G; C08G59/00; C08G59/14; C08G59/1433; C08G59/1438; C08G59/1455; C08G59/1461; C08G59/1466; C08L; C08L63/00; C08L63/10; G03F7/0005; G03F7/0007; G03F7/027; Y; Y10; Y10S; Y10S525/00; Y10S525/922
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
34 words
Epoxy acrylate resins represented by the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20.
Claim 2
Dependent Claim
34 words
Epoxy acrylate resins represented by the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20.
Claim 3
Dependent Claim
94 words
Photosensitive resin compositions characterized by containing 15 to 90% by weight of epoxy acrylate resins of the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20 and 10 to 85% by weight of unsaturated polyesters having a structural unit of the general formula (II) in which Z is -CO-CH=CH-CO-, R is hydrogen or a lower alkyl group, and m is the number of repeating units and showing an inherent viscosity of 0.2 to 2.5 dl/g.
Claim 4
Dependent Claim
94 words
Photosensitive resin compositions characterized by containing 15 to 90% by weight of epoxy acrylate resins of the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20 and 10 to 85% by weight of unsaturated polyesters having a structural unit of the general formula (II) in which Z is -CO-CH=CH-CO-, R is hydrogen or a lower alkyl group, and m is the number of repeating units and showing an inherent viscosity of 0.2 to 2.5 dl/g.
Claim 5
Dependent Claim
65 words
Photosensitive resin compositions characterized by containing 15 to 90% by weight of epoxy acrylate resins of the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20 and 10 to 85% by weight of at least one compound selected from trifunctional and higher acrylates and epoxy acrylates.
Claim 6
Dependent Claim
65 words
Photosensitive resin compositions characterized by containing 15 to 90% by weight of epoxy acrylate resins of the general formula (I) in which R is hydrogen or a lower alkyl group, R′ is hydrogen or methyl group, and n is an integer from 0 to 20 and 10 to 85% by weight of at least one compound selected from trifunctional and higher acrylates and epoxy acrylates.
Claim 7
Dependent Claim
39 words
The use of a photosensitive resin composition according to claim 2 or claim 3 for the production of insulation films for multilayer devices, protective films for image sensors or protective films for solder resists, plating resists or color filters.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.