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EP0419663A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Nonvolatile semiconductor memory and method of producing the same

Assignee: Toshiba Corp
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Filing: 1989-09-14
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Granted: —
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Expires: 2009-09-14
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Abstract

Abstract A nonvolatile semiconductor memory having nonvolatile memory cells that electrically erase and write data. Each memory cell has a floating gate and a control gate formed on the channel region on the surface of a semiconductor substrate. The floating gate covers only part of the channel region. In the memory cell, therefore, a floating gate transistor and an enhancement transistor are connected in parallel. The floating gate transistor is deviated toward one side in the direction of width of the channel region or covers only the central portion of the channel region in the direction of width. Further, a plurality of memory cells are connected in series to constitute a basic block. The neighboring basic blocks are separated by the enhancement MOS transistor. In this memory, the memory cell (floating gate) and the enhancement MOS transistor (gate) are formed using the same mask in a self-aligned manner. In this memory, furthermore, the control gate and the floating gate are formed using the same mask in the self-aligned manner.

Inventors

  • 👤 Masamichi Asano
  • 👤 Hiroshi 63-10 Shikimidai Iwahashi
  • 👤 Ryouhei Isogo-Dai-6-Ryo Kirisawa
  • 👤 Ryozo Isogo-Maruyamadai-Heights 4-404 Nakayama
  • 👤 Satoshi Sano-So 2F Inoue
  • 👤 Riichiro Toshiba-Furukawa Apartment 242 Shirota
  • 👤 Kikuna Endoh Tetsuro 6-13-31-106
  • 👤 Fujio 1-14-6 Takeyama Masuoka

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 05:13
CPC Classifications
H; H10; H10B; H10B41/00; H10B41/10; H10D; H10D30/00; H10D30/60; G; G11; G11C; G11C16/00; G11C16/02; G11C16/04; G11C16/0483; H10B41/30; H10B41/35; H10B69/00; H10D30/68; H10D30/681; H10D30/683; H10D30/684; H10D30/685

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 179 words
A non-volatile semiconductor memory comprising: a plurality of basic blocks each having a plurality of non-volatile memory cells connected in series; said memory cell having a pair of source and drain regions formed on the surface area of a semiconductor substrate and sandwiching a channel region therebetween, a floating gate formed above said channel region and being capable of charging electric charges, and a control gate formed above said floating gate; said floating gate covering a portion of said channel region such that a floating gate transistor is formed with said floating gate and said control gate being positioned above said channel region, and an enhancement type transistor is formed with said control gate only being positioned above said channel region, said floating gate transistor and said enhancement type transistor being electrically connected in parallel with each other; and a data operationor read operation being performed by selecting one of said memory cells in said basic block, and a data erase operation is performed at the same time for all said plurality of memory cells in said basic block.
Claim 2
Dependent Claim 37 words
A memory according to claim 1, wherein the width of said floating gate is narrower than that of said channel region, and said floating gate partially covers the inside of opposite side lines of said channel region.
Claim 3
Dependent Claim 42 words
A memory according to claim 1, wherein said floating gate is displaced in the widthwise direction of said channel region to partially cover from substantially the center of said channel region to one of the side lines thereof in one widthwise direction.
Claim 4
Dependent Claim 96 words
A memory according to claim 3, wherein for one of said memory cells, said floating gate is displaced in one widthwise direction of said channel region to partially cover from substantially the center of said channel region to one of the side lines thereof in one of the widthwise directions, and for the other of said memory cells, said floating gate is displaced in the other widthwise direction of said channel region to partially cover from substantially the center of said channel region to the other of the side lines thereof in the other widthwise direction.
Claim 5
Dependent Claim 82 words
A memory according to claim 4, wherein said plurality of memory cells in said basic block are divided into a plurality of cell groups each comprising an optional number of memory cells, the floating gates of memory cells belonging to the same cell group are displaced in the same direction, and ones of the cell groups of said plurality of cell groups are displaced in the direction opposite to that of the other the cell groups of said plurality of cell groups.
Claim 6
Dependent Claim 27 words
A memory according to claim 1, wherein said write and erase operations are performed by causing a current to flow between said floating gate and said substrate.
Claim 7
Dependent Claim 47 words
A memory according to claim 6, wherein the gap between the lower surface of said floating gate and the upper surface of said source and drain regions is smaller than that between the lower surface of said floating gate and the upper surface of said channel region.
Claim 8
Dependent Claim 35 words
A memory according to claim 1, wherein said erase operation is performed by causing a current to flow between said floating gate and an erase gate formed between said floating gate and said control gate.
Claim 9
Dependent Claim 25 words
A memory according to claim 1, wherein said plurality of basic blocks are connected in parallel in units of an optional number of basic blocks.
Claim 10
Dependent Claim 21 words
A memory according to claim 1, wherein a silicon nitride film is formed between said floating gate and said control gate.
Claim 11
Dependent Claim 19 words
A memory according to claim 1, wherein those basic blocks disposed laterally are separated by a field oxide film.
Claim 12
Dependent Claim 20 words
A memory according to claim 1, wherein those basic blocks disposed laterally are separated by an enhancement type MOS transistor.
Claim 13
Dependent Claim 15 words
A memory according to claim 1, wherein said basic block is a NAND basic block.
Claim 14
Dependent Claim 20 words
A memory according to claim 2, wherein those basic blocks disposed laterally are separated by an enhancement type MOS transistor.
Claim 15
Dependent Claim 40 words
A memory according to claim 13, wherein said transistor has its gate formed between said laterally disposed two basic blocks in the longitudinal direction of the basic block, said gate facing said substrate with a gate oxide film interposed therebetween.
Claim 16
Independent Claim 185 words
A method of manufacturing a non-volatile semiconductor memory comprising: a first step of alternately forming stripe-shaped and linear thin insulating films and stripe-shaped and linear thick insulating films on a semiconductor substrate, and depositing a first polysilicon on said thin and thick insulating films; a second step of patterning said first polysilicon to form a plurality of floating gates lines each of which with a plurality of floating gates disposed at a predetermined pitch and to form stripe-shaped and linear separation transistor gates; a third step of depositing a second polysilicon on said floating gates and said separation transistor gates with an insulating film interposed therebetween; a fourth step of etching said second polysilicon to form stripe-shaped and linear floating gates being perpendicular to said separation transistor gates and covered said floating gates; a fifth step of forming source and drain regions of floating gate transistors using said separation transistor gates and said control gates as a mask; and a sixth step of forming source and drain regions of said floating gate transistors using as a mask said separation transistor gates and said control gates.
Claim 17
Independent Claim 215 words
A method of manufacturing a non-volatile semiconductor memory comprising: a first step of alternately forming stripe-shaped and linear thin insulating films and stripe-shaped and linear thick insulating films on a semiconductor substrate, and depositing a first polysilicon on said thin and thick insulating films; a second step of patterning said first polysilicon to alternately form a first stripe-shaped and linear polysilicons and a stripe-shaped and linear separation transistor gates on said thick insulating film; a third step of depositing a second polysilicon on said linear first polysilicons and said linear separation transistor gates with an insulating film a fourth step of etching said second polysilicon by using a stripe-shaped first mask being disposed at a predetermined pitch and perpendicular to said separation transistor gate, to thereby form stripe-shaped control gates; a fifth step of etching said linear first polysilicons by using a stripe-shaped second mask disposed along said control gates and a stripe-shaped third mask disposed along said separation transistor gates, to thereby form a plurality of floating gates disposed at a predetermined pitch between said separation transistor gates along the longitudinal direction of said separation transistor gates; and a sixth step of forming source and drain regions of said floating gate transistors using as a mask said separation transistor gates and said control gates.
Claim 18
Dependent Claim 63 words
A method according to claim 17, wherein in said fourth step, an oxide film is formed on said second polysilicon, and an insulating film on said oxide film, said second polysilicon and said first polysilicon is etched by using said first mask, and in said fifth step, said second mask is said oxide film remaining on said control gates at said fourth step.
Claim 19
Dependent Claim 20 words
A method according to claim 16, wherein said fifth step is a process of impurity ion injection and heat treatment.
Claim 20
Dependent Claim 20 words
A method according to claim 18, wherein said sixth step is a process of impurity ion injection and heat treatment.

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