EP0419022A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Disk storage apparatus
Assignee: International Business Machines Corp
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Filing: 1990-08-03
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Granted: —
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Expires: 2010-08-03
Abstract
Abstract High density magnetic disk storage and semiconductor module technologies are combined to provide a disk drive using a standard multilayer ceramic substrate 10 as the disk drive base support member to support spindle 14 and actuator assemblies 25 including 1 inch diameter disks. The ceramic substrate has components and VLSI chips 40, 41 mounted directly thereon to avoid use of one level of packaging and presents standard pins 44 to mount the drive using standard sockets 45 to afford economy and reliability. <IMAGE>
Inventors
- 👤 Christopher Henry Bajorek
- 👤 Thomas William Glaser
- 👤 Richard Greenberg
- 👤 Jerry Lee Neubauer
- 👤 John Ralph Reidenbach
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 16:07
CPC Classifications
G; G11; G11B; G11B33/00; G11B33/12; G11B33/121; G11B25/00; G11B25/04; G11B25/043; G11B33/02
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
42 words
A disk storage apparatus comprising a disk spindle assembly (14) and a transducer carrying actuator assembly (25) characterised in that the disk spindle and actuator assemblies are supported on a semiconductor substrate (10) with signal transfer means (44) extending from the substrate.
Claim 2
Dependent Claim
42 words
A disk storage apparatus comprising a disk spindle assembly (14) and a transducer carrying actuator assembly (25) characterised in that the disk spindle and actuator assemblies are supported on a semiconductor substrate (10) with signal transfer means (44) extending from the substrate.
Claim 3
Dependent Claim
30 words
A magnetic disk storage apparatus as claimed in claim 1 further comprising a cover (35) mounted on the substrate which cooperates therewith to enclose the disk spindle and actuator assemblies.
Claim 4
Dependent Claim
26 words
A disk storage apparatus as claimed in claim 1 or claim 2 wherein the spindle assembly and the actuator assembly rotate about stationary shafts (15, 31).
Claim 5
Dependent Claim
33 words
A disk storage apparatus as claimed in claim 2 or claim 3 wherein the cover is secured to the distal ends of the shafts about which the spindle and actuator assembles are rotated.
Claim 6
Dependent Claim
26 words
A disk storage apparatus as claimed in any preceding claim wherein the semiconductor substrate carries electronic components (40, 41) for controlling the actuator and spindle assemblies.
Claim 7
Dependent Claim
29 words
A disk storage apparatus as claimed in any preceding claim wherein the semiconductor substrate is a multilayer ceramic substrate which has integrated therein, portions of disk drive control circuitry.
Claim 8
Dependent Claim
31 words
A disk storage apparatus as claimed in any preceding claim wherein the semiconductor substrate is a multilayer ceramic module substrate upon which very large scale integration (VLSI) chips are directly mounted.
Claim 9
Independent Claim
106 words
A method of making a disk drive comprising the steps of: forming a semiconductor substrate (10) having a size suitable for mounting on a circuit board (51); forming conductive pins (44) in the substrate for mating with a socket (45) on the circuit board; forming circuitry in or on the substrate coupled to the conductive pins; mounting a disk spindle assembly (14) on the substrate, the disk spindle assembly being controlled through the circuitry; mounting a transducer carrying actuator mechanism (25) on the substrate, the mechanism being controlled through the circuitry; and enclosing the disk spindle assembly and actuator mechanism between a cover and the substrate.
Claim 10
Independent Claim
106 words
A method of making a disk drive comprising the steps of: forming a semiconductor substrate (10) having a size suitable for mounting on a circuit board (51); forming conductive pins (44) in the substrate for mating with a socket (45) on the circuit board; forming circuitry in or on the substrate coupled to the conductive pins; mounting a disk spindle assembly (14) on the substrate, the disk spindle assembly being controlled through the circuitry; mounting a transducer carrying actuator mechanism (25) on the substrate, the mechanism being controlled through the circuitry; and enclosing the disk spindle assembly and actuator mechanism between a cover and the substrate.
Claim 11
Dependent Claim
17 words
A method as claimed in claim 8 wherein the circuitry comprises semiconductor devices formed in the substrate.
Claim 12
Dependent Claim
18 words
A method as claimed in claim 8 wherein the circuitry comprises discrete electronic components mounted on the substrate.
References Cited (Backward Citations)
No citation records indexed.
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