EP0417887A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
IC card
Assignee: Mitsubishi Electric Corp
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Filing: 1990-07-02
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Granted: —
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Expires: 2010-07-02
Abstract
Abstract An IC card (21) includes a substrate (13), semiconductor devices (1a-1h) mounted on at least one of majors surfaces of the substrate, and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame (5) and panels (7, 8) bonded to the frame on the opposite sides of the frame by means of adhesive layers (9a, 9b). Means for preventing the semiconductor devices from being bonded to the panel via the adhesive layers are disposed at locations on the adhesive layers facing the semiconductor devices.
Inventors
- 👤 Takeshi Uenaka
- 👤 Jun Onbuchi
- 👤 Shigeo Onoda
- 👤 Makoto Omori
- 👤 Hajime Maeda
- 👤 Toru Tachikawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 10:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W90/00; H10W70/40; H10W90/20
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
89 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein adhesion preventing means for preventing said semiconductor devices from adhering to said panels via said adhesive layers is disposed at locations on said adhesive layers which face said semiconductor devices.
Claim 2
Dependent Claim
89 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein adhesion preventing means for preventing said semiconductor devices from adhering to said panels via said adhesive layers is disposed at locations on said adhesive layers which face said semiconductor devices.
Claim 3
Dependent Claim
21 words
An IC card according to Claim 1 wherein semiconductor devices are mounted on both of the major surfaces of said substrate.
Claim 4
Dependent Claim
48 words
An IC card according to Claim 1 wherein said adhesion preventing means is disposed at only those locations on said adhesive layers which face the semiconductor devices mounted on the rear portion of said substrate opposite to the forward portion which is first inserted into an external device.
Claim 5
Dependent Claim
89 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein adhesion preventing sheets for preventing said semiconductor devices from adhering to said panels via said adhesive layers are bonded to said adhesive layers at locations which face said semiconductor devices.
Claim 6
Dependent Claim
89 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein adhesion preventing sheets for preventing said semiconductor devices from adhering to said panels via said adhesive layers are bonded to said adhesive layers at locations which face said semiconductor devices.
Claim 7
Dependent Claim
21 words
An IC card according to Claim 4 wherein semiconductor devices are mounted on both of the major surfaces of said substrate.
Claim 8
Dependent Claim
48 words
An IC card according to Claim 4 wherein said adhesion preventing sheets are bonded to said adhesive layers at only those locations which face the semiconductor devices mounted on the rear portion of said substrate opposite to the forward portion which is first inserted into an external device.
Claim 9
Dependent Claim
87 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein openings for preventing said semiconductor devices from adhering to said panels via said adhesive layers are formed in said adhesive layers at locations which face said semiconductor devices.
Claim 10
Dependent Claim
87 words
An IC card comprising a substrate having two opposing major surfaces, semiconductor devices mounted on at least one of said major surfaces of said substrate, and a casing for housing said substrate with said semiconductor devices, said casing comprising a frame and panels bonded to said frame on opposite sides of said frame by means of adhesive layers; wherein openings for preventing said semiconductor devices from adhering to said panels via said adhesive layers are formed in said adhesive layers at locations which face said semiconductor devices.
Claim 11
Dependent Claim
21 words
An IC card according to Claim 7 wherein semiconductor devices are mounted on both of the major surfaces of said substrate.
Claim 12
Dependent Claim
46 words
An IC card according to Claim 7 wherein said openings are formed in said adhesive layers at only those locations which face the semiconductor devices mounted on the rear portion of said substrate opposite to the forward portion which is first inserted into an external device.
References Cited (Backward Citations)
No citation records indexed.
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