EP0411639A2
Expired / Lapsed
EP
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Electronic circuit substrate
Assignee: Ibiden Co Ltd
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Filing: 1990-08-02
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Granted: —
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Expires: 2010-08-02
Abstract
Abstract An electronic circuit substrate excellent in reliability, which comprises: a porous ceramic sintered body (1) with film devices such as a conductive circuit (12), a resistor (13) and a capacitor directly formed on the surface thereof; and a resin (4) filled in the pores of the porous ceramic sintered body; the bottom surface of the film devices being fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate, which comprises the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state.
Inventors
- 👤 Kiyotaka C/O Ibiden Co. Ltd. Tsukada
- 👤 Yukihiro C/O Ibiden Co. Ltd. Noda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 23:39
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/02; H05K1/03; H05K1/0306; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
80 words
An electronic circuit substrate comprising: a porous ceramic sintered body (1) with film devices such as a conductive circuit (12), a resistor (13) and a capacitor directly formed on the surface thereof; and a resin (4) filled in the pores of said porous ceramic sintered body (1); the bottom surface of said film devices (12, 13) being fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state.
Claim 2
Dependent Claim
80 words
An electronic circuit substrate comprising: a porous ceramic sintered body (1) with film devices such as a conductive circuit (12), a resistor (13) and a capacitor directly formed on the surface thereof; and a resin (4) filled in the pores of said porous ceramic sintered body (1); the bottom surface of said film devices (12, 13) being fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state.
Claim 3
Dependent Claim
34 words
An electronic circuit substrate according to claim 1, wherein said porous ceramic sintered body (1) has an average pore diameter of 0.2 to 15 µm and a porosity of not less than 10 vol%.
Claim 4
Dependent Claim
25 words
An electronic circuit substrate according to claim 1 or 2, wherein a plurality of said electronic circuit substrates (1) are laminated through insulating layers (3).
Claim 5
Dependent Claim
36 words
An electronic circuit substrate according to claim 3, wherein an insulating layer (3) is formed on the surface of the outermost electronic circuit substrate and a conductive layer (40) is formed on said insulating layer (3).
Claim 6
Dependent Claim
31 words
An electronic circuit substrate according to claim 3 or 4, wherein said insulating layer (3) is composed of a resin or a composite material of a resin and an inorganic material.
Claim 7
Dependent Claim
48 words
An electronic circuit substrate according to any of claims 1 to 5, wherein a plurality of said electronic circuit substrates (1) are bonded with each other into a laminate through a porous intermediate layer (2) and the pores of said porous intermediate layer are filled with a resin.
Claim 8
Dependent Claim
25 words
An electronic circuit substrate according to any of claims 1 to 6, wherein a radiator adheres to the surface of said porous ceramic sintered body.
Claim 9
Independent Claim
71 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and filling the pores of said porous ceramic sintered body with a resin so as to fit the under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state.
Claim 10
Independent Claim
71 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and filling the pores of said porous ceramic sintered body with a resin so as to fit the under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state.
Claim 11
Dependent Claim
64 words
A method of producing an electronic circuit substrate according to claim 8, wherein said film devices are formed on the surface of said porous ceramic sintered body by first applying a paste for constituting film devices to a surface of a green shaped body of a ceramic material and then firing said green ceramic shaped body at a temperature for forming a sintered body.
Claim 12
Dependent Claim
55 words
A method of producing an electronic circuit substrate according to claim 8 or 9, wherein said film devices are formed on the surface of said porous ceramic sintered body by first applying a paste for constituting film devices to a surface of a porous ceramic sintered body and then heating said porous ceramic sintered body.
Claim 13
Independent Claim
59 words
A method of producing an electronic circuit substrate according to any of claims 8 to 10, wherein said film devices are formed on the surface of said porous cera mic sintered body by masking a surface of said porous ceramic sintered body except portions which constitute a circuit, forming film devices by deposition or sputtering, and removing the mask.
Claim 14
Independent Claim
47 words
A method of producing an electronic circuit substrate according to any of claims 8 to 11, wherein the pores of said porous ceramic sintered body are filled with a resin by dipping a porous ceramic sintered body having said film devices provided thereon in a hot-molten resin.
Claim 15
Independent Claim
48 words
A method of producing an electronic circuit substrate according to any of claims 8 to 11, wherein the pores of said porous ceramic sintered body are filled with a resin by impregnating a porous ceramic sintered body with a monomer state resin and polymerizing said monomer state resin.
Claim 16
Independent Claim
41 words
A method of producing an electronic circuit substrate according to any of claims 8 to 13, wherein said porous ceramic sintered body has an average pore diameter of 0.2 to 15 um and a porosity of not less than 10 vol%.
Claim 17
Independent Claim
55 words
A method of producing an electronic circuit substrate according to any of claims 8 to 14, further comprising the steps of preparing a plurality of said electronic circuit substrates; and bonding a plurality of said electronic circuit substrates with each other into a laminate through an insulating layer, thereby producing a multi-layer electronic circuit substrate.
Claim 18
Dependent Claim
38 words
A method of producing an electronic circuit substrate according to claim 15, wherein an insulating layer is formed on the surface of the outermost electronic cir cuit substrate and a conductive layer is formed on said insulating layer.
Claim 19
Independent Claim
60 words
A method of producing an electronic circuit substrate according to any of claims 8 to 16, wherein said film devices are first formed directly on the surface of said porous ceramic sintered body, a plurality of said porous ceramic sintered bodies are laminated, and the pores of a plurality of said porous ceramic sintered bodies are filled with a resin.
Claim 20
Dependent Claim
33 words
A method of producing an electronic circuit substrate according to claim 17, wherein a plurality of said porous ceramic sintered bodies are bonded with each other into a laminate through an insulating layer.
Claim 21
Dependent Claim
47 words
A method of producing an electronic circuit substrate according to claim 17, wherein a plurality of said porous ceramic sintered bodies are bonded with each other into a laminate through a porous intermediate layer and the pores of said porous intermediate layer are filled with a resin.
Claim 22
Independent Claim
29 words
A method of producing an electronic circuit substrate according to any of claims 8 to 19, wherein a radiator adheres to the surface of said porous ceramic sintered body.
References Cited (Backward Citations)
No citation records indexed.
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