Patent US3330097A successfully refreshed from Google Patents.
EP0409173A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor ic device having an improved interconnection structure
Assignee: NEC Corp
•
Filing: 1990-07-17
•
Granted: —
•
Expires: 2010-07-17
Abstract
Abstract A semiconductor IC device includes a semiconductor pellet, an insulating film, a conductive plate, and a lead frame. A plurality of electrodes and a plurality of active elements are formed on the semiconductor pellet. The insulating film is bonded to a surface of the semiconductor pellet on which the active elements are formed. The conductive plate is arranged on the insulating film. The lead frame includes a plurality of connecting terminals selectively arranged in predetermined regions on the conductive plate through another insulating film, and leads laterally extending from the connecting terminals.
Inventors
- 👤 Hiroshi C/O Nec Corporation Ishioka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 19:39
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/20; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
79 words
A semiconductor IC device comprising: a semiconductor pellet on which a plurality of electrodes and a plurality of active elements are formed; an insulating film bonded to a surface of said semiconductor pellet on which the active elements are formed; a conductive plate arranged on said insulating film; and a lead frame including a plurality of connecting terminals selectively arranged in predetermined regions on said conductive plate through another insulating film, and leads laterally extending from the connecting terminals.
Claim 2
Dependent Claim
79 words
A semiconductor IC device comprising: a semiconductor pellet on which a plurality of electrodes and a plurality of active elements are formed; an insulating film bonded to a surface of said semiconductor pellet on which the active elements are formed; a conductive plate arranged on said insulating film; and a lead frame including a plurality of connecting terminals selectively arranged in predetermined regions on said conductive plate through another insulating film, and leads laterally extending from the connecting terminals.
Claim 3
Dependent Claim
29 words
A device according to claim 1, further comprising at least a conductive wire for connecting one of the electrodes on said semiconductor pellet to one of the connecting terminals.
Claim 4
Dependent Claim
17 words
A device according to claim 1, wherein said conductive plate is connected to one of the electrodes.
Claim 5
Dependent Claim
18 words
A device according to claim 1, wherein said conductive plate is connected to one of the connecting terminals.
Claim 6
Dependent Claim
18 words
A device according to claim 4, wherein the connecting terminal is connected to a power source or ground.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.