EP0408101A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Strip carrier for integrated circuits
Assignee: LSI Corp
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Filing: 1990-06-26
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Granted: —
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Expires: 2010-06-26
Abstract
Abstract An improved method to assemble tape packaged integrated circuits includes spot welding a strip of TAB tape (20) to a thin strip of copper called a strip carrier (10). The strip carrier provides mechanical rigidity to the tape during later processing, including die attachment and lead bonding and solder plating, as well as providing ESD protection since each tape lead is shorted to the strip carrier. The packaged die (40A, 40B) and the surrounding tape are excised from the strip carrier prior to final testing and the strip carrier is capable of being reused. The strip carriers are of a size and shape to be readily handled by existing integrated circuit handling equipment.
Inventors
- 👤 Jon M. Long
- 👤 Michael J. Steidl
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 08:46
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0254; H05K1/0271; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/701; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
31 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a strip carrier; and bonding the die to the tape leads.
Claim 2
Dependent Claim
31 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a strip carrier; and bonding the die to the tape leads.
Claim 3
Dependent Claim
31 words
The process of Claim 1, wherein the step of attaching the tape comprises the step of affixing a metal area on the tape to a metal area on the strip carrier.
Claim 4
Dependent Claim
19 words
The process of Claim 1, wherein the step of attaching comprises spot welding the tape to the strip carrier.
Claim 5
Dependent Claim
23 words
The process of Claim 1, further comprising the step, after the step of attaching the tape, of attaching the die to the tape.
Claim 6
Dependent Claim
23 words
The process of Claim 1, further comprising the step, after the step of bonding the die, of encapsulating the die in a package.
Claim 7
Dependent Claim
20 words
The process of Claim 5, further comprising the step, after the step of assembling the package, of curing the package.
Claim 8
Dependent Claim
23 words
The process of Claim 6, further comprising the step, after the step of curing the package, of plating solder on the tape leads.
Claim 9
Dependent Claim
23 words
The process of Claim 7, further comprising the step, after the step of plating solder, of excising the die from the strip carrier.
Claim 10
Dependent Claim
12 words
The process of Claim 1, wherein the strip carrier comprises conductive material.
Claim 11
Dependent Claim
12 words
The process of Claim 1, wherein the strip carrier substantially comprises metal.
Claim 12
Dependent Claim
12 words
The process of Claim 1, wherein the strip carrier substantially comprises copper.
Claim 13
Dependent Claim
19 words
The process of Claim 1, wherein the strip carrier provides support to the tape during the step of bonding.
Claim 14
Dependent Claim
29 words
The process of Claim 2, wherein the strip carrier is rectangular in shape and the tape is affixed to the die at two opposing sides of the strip carrier.
Claim 15
Dependent Claim
34 words
The process of Claim 2, wherein the tape includes at least two attachment areas formed of conductive material on the tape, and the tape is affixed to the strip carrier at the attachment areas.
Claim 16
Dependent Claim
17 words
The process of Claim 1, wherein the strip carrier includes alignment holes along at least one side.
Claim 17
Dependent Claim
13 words
The process of Claim 1, wherein the bonding step comprises tape automated bonding.
Claim 18
Dependent Claim
12 words
The process of Claim 1, wherein the bonding step comprises wire bonding.
Claim 19
Dependent Claim
14 words
The process of Claim 1, wherein the bonding step comprises finger-to-bump tape automated bonding.
Claim 20
Dependent Claim
23 words
The process of Claim 1, wherein the step of bonding the die to the tape leads comprises attaching the die to the tape.
Claim 21
Dependent Claim
19 words
The process of Claim 1, further comprising the step of bonding a plurality of die to the tape leads.
Claim 22
Dependent Claim
23 words
The process of Claim 1, wherein the strip carrier means is of a size so as to fit into a semiconductor processing magazine.
Claim 23
Dependent Claim
16 words
The process of Claim 1, wherein the strip carrier means includes at last one cut-out section.
Claim 24
Dependent Claim
24 words
The process of Claim 1, wherein the strip carrier means has a width in the range of about 45 mm to about 115 mm.
Claim 25
Dependent Claim
21 words
The process of Claim 1, wherein the strip carrier means has a thickness of about 0.1 mm to about 0.4 mm.
Claim 26
Dependent Claim
20 words
The process of Claim 1, wherein the strip carrier has as small a thickness as possible while maintaining mechanical rigidity.
Claim 27
Dependent Claim
35 words
The process of Claim 7 further comprising the step, after the step of excising, of removing the solder plating and tape from the strip carrier means so as to render the strip carrier means reusable.
Claim 28
Dependent Claim
29 words
The process of Claim 7, further comprising the steps, before the step of solder plating, of: plating silver on the strip carrier; and plating nickel on the plated silver.
Claim 29
Dependent Claim
16 words
The process of Claim 1, wherein only the inner portions of the leads are gold plated.
Claim 30
Dependent Claim
43 words
A strip carrier for attachment of a tape capable of having at least one integrated circuit die fixed to the tape comprising a rigid sheet of conductive material defining at least one cut out area, the die fitting in the cut out area.
Claim 31
Dependent Claim
43 words
A strip carrier for attachment of a tape capable of having at least one integrated circuit die fixed to the tape comprising a rigid sheet of conductive material defining at least one cut out area, the die fitting in the cut out area.
Claim 32
Dependent Claim
28 words
The process of Claim 4, wherein a strip carrier having a particular width is capable of having tapes having a plurality of widths attached to the strip carrier.
Claim 33
Dependent Claim
91 words
Integrated circuit bonding tape having a conductive pattern formed on the tape, the conductive pattern capable of making electrical contact to the leads of an integrated circuit die, comprising: a tape substrate; a pattern of conductive traces for making the electrical contact to the integrated circuit die formed on a first surface of the tape substrate; and a conductive area formed on the first surface of the tape substrate and in electrical contact with the conductive traces, and extending through the tape substrate to a second surface of the tape substrate.
Claim 34
Dependent Claim
91 words
Integrated circuit bonding tape having a conductive pattern formed on the tape, the conductive pattern capable of making electrical contact to the leads of an integrated circuit die, comprising: a tape substrate; a pattern of conductive traces for making the electrical contact to the integrated circuit die formed on a first surface of the tape substrate; and a conductive area formed on the first surface of the tape substrate and in electrical contact with the conductive traces, and extending through the tape substrate to a second surface of the tape substrate.
References Cited (Backward Citations)
US4411719A
Cited
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