EP0405330A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Flagless leadframe, package and method
Assignee: Motorola Solutions Inc
•
Filing: 1990-06-21
•
Granted: —
•
Expires: 2010-06-21
Abstract
Abstract A flagless leadframe (10), package (12) and method is disclosed and a preferred embodiment includes a semiconductor die (16) bonded to the plurality of leads (14) of the flagless leadframe (10) by an electrically insulating film (18) that is disposed on the backside of the semiconductor die (16) while still in wafer form. The semiconductor die (16) is bonded to the flagless leadframe (10) so that at least 50 percent of the surface area of the backside of the semiconductor die (16) is thermally coupled to the plurality of leads (14) so that heat dissipates directly from the backside of the semiconductor die (16), through the electrically insulating film (18) and out of the package through the leads (14). The semiconductor die (16) is wirebonded directly to the plurality of leads (14) so that the same leads (14) are both thermally and electrically coupled to the semiconductor die (16).
Inventors
- 👤 Timothy Lee Olson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 13:05
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/417; H10W70/421; H10W72/00; H10W72/30; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/071; H10W72/073; H10W72/07351; H10W72/07353; H10W72/331; H10W72/334; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
77 words
A flagless leadframe (10) being characterized by a plurality of leads (14) wherein a semiconductor die (16) is to be attached to said plurality of leads (14) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14) and further, some or all of said plurality of leads (14) to be both thermally and electrically coupled to said semiconductor die (16).
Claim 2
Dependent Claim
77 words
A flagless leadframe (10) being characterized by a plurality of leads (14) wherein a semiconductor die (16) is to be attached to said plurality of leads (14) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14) and further, some or all of said plurality of leads (14) to be both thermally and electrically coupled to said semiconductor die (16).
Claim 3
Dependent Claim
35 words
The leadframe (10) of claim 1 wherein an electrically insulating material (18) is to be disposed between the plurality of leads (14) of said leadframe (10) and the semiconductor die (16) to be disposed thereon.
Claim 4
Dependent Claim
27 words
The leadframe (10) of claim 2 wherein the electrically insulating material (18) bonds the semiconductor die (16) to the plurality of leads (14) of said leadframe (10).
Claim 5
Dependent Claim
27 words
The leadframe (10) of claim 3 wherein the electrically insulating material (18) is disposed on the backside of the semiconductor die (16) while still in wafer form.
Claim 6
Dependent Claim
18 words
The leadframe (10) of claim 4 wherein the electrically insulating material (18) comprises a polyimide or an epoxy.
Claim 7
Dependent Claim
23 words
The leadframe (10) of claim 1 wherein a single leadframe size and configuration may be employed with semiconductor dice (16) of varying size.
Claim 8
Dependent Claim
105 words
A semiconductor device package (12) comprising: a flagless leadframe (10) having a plurality of leads (14); the invention being characterized by: a semiconductor die (16) bonded to said plurality of leads (14) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14) and further, some or all of said plurality of leads being both thermally and electrically coupled to said semiconductor die (16); and an encapsulation (22) disposed about said semiconductor die (16) and said leadframe (10) wherein a portion of said plurality of leads (14) extend therefrom.
Claim 9
Dependent Claim
105 words
A semiconductor device package (12) comprising: a flagless leadframe (10) having a plurality of leads (14); the invention being characterized by: a semiconductor die (16) bonded to said plurality of leads (14) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14) and further, some or all of said plurality of leads being both thermally and electrically coupled to said semiconductor die (16); and an encapsulation (22) disposed about said semiconductor die (16) and said leadframe (10) wherein a portion of said plurality of leads (14) extend therefrom.
Claim 10
Dependent Claim
31 words
The semiconductor device package (12) of claim 7 wherein the semiconductor die (16) is bonded to the plurality of leads (14) of the leadframe (10) with an electrically insulating material (18).
Claim 11
Dependent Claim
25 words
The semiconductor device package (12) of claim 7 wherein a single leadframe size and configuration may be employed with semiconductor dice (16) of varying size.
Claim 12
Independent Claim
112 words
A method of fabricating a semiconductor device package (12) comprising the steps of: providing a flagless leadframe (10) having a plurality of leads (14); the invention being characterized by: bonding a semiconductor die (16) to said plurality of leads (14) of said leadframe (10) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14); electrically connecting said semiconductor die (16) to said plurality of leads (14) of said leadframe (10); and encapsulating said semiconductor die (16) and said leadframe (10) so that a portion of said plurality of leads (14) extends from the encapsulation (22).
Claim 13
Independent Claim
112 words
A method of fabricating a semiconductor device package (12) comprising the steps of: providing a flagless leadframe (10) having a plurality of leads (14); the invention being characterized by: bonding a semiconductor die (16) to said plurality of leads (14) of said leadframe (10) so that at least fifty percent of the surface area of the backside of said semiconductor die (16) is thermally coupled to said plurality of leads (14); electrically connecting said semiconductor die (16) to said plurality of leads (14) of said leadframe (10); and encapsulating said semiconductor die (16) and said leadframe (10) so that a portion of said plurality of leads (14) extends from the encapsulation (22).
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.