EP0403086A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method for improving deposit of photoresist on wafers
Assignee: HP Inc
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Filing: 1990-05-18
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Granted: —
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Expires: 2010-05-18
Abstract
Abstract A method for applying photoresist to a top surface (22, 24) of a semiconductor wafer (10) for defining an electronic circuit pattern. The wafer is placed on a horizontal turntable and a liquid solvent is dispensed onto the wafer's top surface. Spinning the wafer distributes a film (30) of the solvent to a substantially uniform thickness over the entire top surface. Liquid photoresist is dispensed onto the top surface of the wafer over the solvent film, preferably while the wafer is spinning, to distribute the photoresist in a layer (36) over the entire top surface of the water. Discharge of photoresist is controlled so that the top surface of the wafer remains entirely wetted by the solvent film during distribution of the liquid photoresist. The solvent has a lower viscosity than that of the liquid photoresist and the solvent film thickness is sufficient to enable the photoresist to fully cover any bare silicon, high density or undercut circuit features, generally in a range of 500 to 10,000 Angstroms and preferably 1,000 to 5,000 Angstroms.
Inventors
- 👤 William G. Gordon
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 05:06
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/16; G03F7/162; B; B05; B05D; B05D1/00; B05D1/32; H; H10; H10P; H10P76/00
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
92 words
In an integrated circuit fabrication process, a method for uniformly applying photoresist to a top surface (22, 24) of a wafer (10), the method comprising: spreading a liquid solvent substantially uniformly over the wafer surface to form a liquid solvent film (30); applying a liquid photoresist to the wafer surface; and spreading the photoresist over the solvent film while a thickness of liquid solvent remains on the wafer surface sufficient to wet the wafer surface such that the photoresist is distributed in a layer (36) over the entire surface of the wafer.
Claim 2
Dependent Claim
92 words
In an integrated circuit fabrication process, a method for uniformly applying photoresist to a top surface (22, 24) of a wafer (10), the method comprising: spreading a liquid solvent substantially uniformly over the wafer surface to form a liquid solvent film (30); applying a liquid photoresist to the wafer surface; and spreading the photoresist over the solvent film while a thickness of liquid solvent remains on the wafer surface sufficient to wet the wafer surface such that the photoresist is distributed in a layer (36) over the entire surface of the wafer.
Claim 3
Dependent Claim
27 words
A method according to claim 1 including spinning the wafer to spread the liquid solvent thereon and continuing to spin the wafer during discharge of the photoresist.
Claim 4
Dependent Claim
29 words
A method according to claim 2 in which the liquid photoresist is applied while the liquid solvent film has a thickness sufficient to display interference colors under visible light.
Claim 5
Dependent Claim
85 words
A method according to claim 2 in which the liquid solvent is applied while the wafer is static and allowed to stand for a first time interval, the wafer is next spun at a first rate of rotation for a second time interval and then spun at a reduced, second rate of rotation for a third time interval, and the liquid photoresist discharge is commenced at the end of the third time interval while the wafer continues to rotate at said second rate of rotation.
Claim 6
Dependent Claim
40 words
A method according to claim 4 in which discharge of the liquid photoresist is stopped after a fourth time interval following commencement thereof and the wafer is spun at an increased, third rate of rotation for a fifth time interval.
Claim 7
Dependent Claim
47 words
A method according to claim 5 in which the first and second rates of rotation and the second and third time intervals are arranged so that the top surface of the wafer remains entirely wetted by the solvent film during discharge and spreading of the liquid photoresist.
Claim 8
Dependent Claim
14 words
A method according to claim 1 in which the solvent and photoresist are miscible.
Claim 9
Dependent Claim
18 words
A method according to claim 7 in which the liquid solvent and the liquid photoresist both include EGMEA.
Claim 10
Dependent Claim
14 words
A method according to claim 8 in which the liquid solvent further includes HMDS.
Claim 11
Dependent Claim
20 words
A method according to claim 1 in which the solvent has a viscosity less than a viscosity of the photoresist.
Claim 12
Dependent Claim
26 words
A method according to claim 1 in which the solvent film has a thickness of 500 Angstroms or more when application of the photoresist is commenced.
Claim 13
Dependent Claim
29 words
A method according to claim 1 in which the solvent film has a thickness in a range of 1,000 to 5,000 Angstroms when application of the photoresist is commenced.
Claim 14
Independent Claim
145 words
A method for applying photoresist to a top surface (22, 24) of a semiconductor wafer (10) for defining an electronic circuit pattern thereon, the method comprising: positioning the wafer (10) on a horizontal turntable with the top surface (22) facing upward; discharging a liquid solvent onto a central area of the top surface; spinning the wafer to distribute a film (30) of the solvent to a substantially uniform thickness over the entire top surface of the wafer; discharging a liquid photoresist onto the central area of the top surface of the wafer over the solvent film; spinning the wafer to distribute the photoresist in a layer (36) over the entire top surface of the wafer; and controlling the discharge of photoresist so that the top surface of the wafer remains entirely wetted by the solvent film (30) during discharge and distribution of the liquid photoresist.
Claim 15
Independent Claim
145 words
A method for applying photoresist to a top surface (22, 24) of a semiconductor wafer (10) for defining an electronic circuit pattern thereon, the method comprising: positioning the wafer (10) on a horizontal turntable with the top surface (22) facing upward; discharging a liquid solvent onto a central area of the top surface; spinning the wafer to distribute a film (30) of the solvent to a substantially uniform thickness over the entire top surface of the wafer; discharging a liquid photoresist onto the central area of the top surface of the wafer over the solvent film; spinning the wafer to distribute the photoresist in a layer (36) over the entire top surface of the wafer; and controlling the discharge of photoresist so that the top surface of the wafer remains entirely wetted by the solvent film (30) during discharge and distribution of the liquid photoresist.
Claim 16
Dependent Claim
75 words
A method according to claim 13 in which the wafer has an intermediate electronic circuit pattern formed thereon, the intermediate circuit pattern including at least one of bare silicon surfaces, high density circuit features and undercut circuit features; the solvent having a viscosity less than the viscosity of the liquid photoresist and the solvent film having sufficient fluid thickness to cause the photoresist to fully cover said bare silicon, high density and undercut circuit features.
Claim 17
Dependent Claim
28 words
A method according to claim 13 in which the solvent film has a thickness of at least 100 Angstroms or more when application of the photoresist is commenced.
Claim 18
Dependent Claim
29 words
A method according to claim 13 in which the solvent film has a thickness in a range of 500 to 10,000 Angstroms when application of the photoresist is commenced.
Claim 19
Dependent Claim
70 words
A method according to claim 13 in which the wafer is spun at a first rate of rotation for a first time interval to distribute the solvent film and then spun at a reduced, second rate of rotation for a second time interval, and the liquid photoresist discharge is commenced at the end of the second time interval while the wafer continues to rotate at said second rate of rotation.
Claim 20
Dependent Claim
40 words
A method according to claim 17 in which discharge of the liquid photoresist is stopped after a third time interval following commencement thereof and the wafer is spun at an increased, third rate of rotation for a fourth time interval.
Claim 21
Dependent Claim
47 words
A method according to claim 17 in which the first and second rates of rotation and the first and second time intervals are arranged so that the top surface of the wafer remains entirely wetted by the solvent film during discharge and distribution of the liquid photoresist.
References Cited (Backward Citations)
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