EP0402520A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Automatic wafer adhering device
Assignee: Enya Manufacturing Co Ltd
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Filing: 1989-08-08
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Granted: —
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Expires: 2009-08-08
Abstract
Abstract A wafer adhering device for automatically adhering wafers on a polishing plate for polishing the surface of the wafers. The wafers are taken out from a wafer cassette one by one, and transferred to an adhesive coating section by a carrying means. The surface of the wafers are coated by the adhesive wax in the coating section. After the adhesive coated wafers are carried out from the coating section by the carrying means, the wafers are taken out from the carrying means and are reversed the surfaces thereof by a reverse chuck means. The polishing plate is waited on the position where the reversed wafers are arrived, and the wafers are adhered onto the surface of the polishing plate.
Inventors
- 👤 Shizuo Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 07:35
CPC Classifications
B; B05; B05C; B05C9/00; B24; B24B; B24B37/00; B24B37/34; B24B37/345; H; H10; H10P; H10P52/00
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
146 words
A device automatically adhering wafers on the polishing plate comprising: a carrying means which transfers wafers and puts thereon one by one, a spin chuck means which is provided to permit up or down movement, receiving wafers from the carrying means during the upward movement, turning wafers at the top position, and replacing wafers to said carrying means during the downward movement, an adhesive agent coating means which is provided at the upper portion of said spin chuck means and drips said adhesive agent thereupon to said wafers, a reverse chuck means which inverts the side of wafers on which adhesive agent is coated and removed outwardly said waters from the carrying means, and a means for holding the polishing plate at the predetermined place so as to adhere the wafer ejected from said carrying means in reversed position onto the surface of said polishing plate.
Claim 2
Independent Claim
146 words
A device automatically adhering wafers on the polishing plate comprising: a carrying means which transfers wafers and puts thereon one by one, a spin chuck means which is provided to permit up or down movement, receiving wafers from the carrying means during the upward movement, turning wafers at the top position, and replacing wafers to said carrying means during the downward movement, an adhesive agent coating means which is provided at the upper portion of said spin chuck means and drips said adhesive agent thereupon to said wafers, a reverse chuck means which inverts the side of wafers on which adhesive agent is coated and removed outwardly said waters from the carrying means, and a means for holding the polishing plate at the predetermined place so as to adhere the wafer ejected from said carrying means in reversed position onto the surface of said polishing plate.
Claim 3
Dependent Claim
41 words
A wafer adhering device in accordance with claim 1, wherein said carrying means is movable alternatively between the position for receiving the wafers, the position provided with said adhesive agent coating means, and the position provided with said reverse chuck means.
Claim 4
Dependent Claim
50 words
A wafer adhering device in accordance with claim 2, wherein spaces between each of positions for receiving the wafers and the position provided with the adhesive agent coating means, and spaces between the latter position and the position provided with the reverse chuck means are provided nearly equal distance apart.
Claim 5
Dependent Claim
20 words
A wafer adhering device in accordance with claim 1, wherein said reverse chuck means reverses the wafer during its transference.
Claim 6
Dependent Claim
24 words
A wafer adhering device in accordance with claim 1, wherein the wafer holding part of said reverse chuck means is made of heat-proof material.
Claim 7
Dependent Claim
27 words
A wafer adhering device in accordance with claim 1, wherein said wafer is placed on the carrying means under aligning the situation of orientation-flat of the wafer.
Claim 8
Dependent Claim
23 words
A wafer adhering device in accordance with claim 1, wherein said polishing plate is held to the holding means under the heated condition.
Claim 9
Dependent Claim
16 words
A wafer adhering device in accordance with claim 7, wherein said polishing plate is gradually heated.
Claim 10
Dependent Claim
35 words
A wafer adhering device in accordance with claim 1, wherein said polishing plate is transferred onto the holding means by the robot, and after mounting the wafer, said plate is transferred by the robot therefrom.
Claim 11
Dependent Claim
26 words
A wafer adhering device in accordance with claim 1, wherein said holding means includes a stamp means to press the wafer mounted on the polishing plate.
Claim 12
Dependent Claim
23 words
A wafer adhering device in accordance with claim 1, wherein said polishing plate has narrow grooves or small holes on the surface thereof.
Claim 13
Dependent Claim
55 words
A wafer adhering device comprises a holding means for holding wafers with facing upwardly the adhesive coated surface of the wafer , rotatable arms having said holding means at their free end, said arms being characterized to adhere the wafers to the polishing plate, turning over said holding part upon the rotation of said arms.
Claim 14
Dependent Claim
55 words
A wafer adhering device comprises a holding means for holding wafers with facing upwardly the adhesive coated surface of the wafer , rotatable arms having said holding means at their free end, said arms being characterized to adhere the wafers to the polishing plate, turning over said holding part upon the rotation of said arms.
Claim 15
Dependent Claim
18 words
A wafer adhering device in accordance with claim 12, wherein said holding means are made of heat-proof material.
References Cited (Backward Citations)
No citation records indexed.
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