Patent JPH0878095A successfully refreshed from Google Patents.
EP0400324A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor package
Assignee: International Business Machines Corp
•
Filing: 1990-04-24
•
Granted: —
•
Expires: 2010-04-24
Abstract
Abstract In an encapsulated semiconductor module (12) in which a semiconductor chip (14), having a major surface with terminals thereon, is deposed within the encapsulating material (19), a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors (18) formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires (16) can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.
Inventors
- 👤 William Carroll Ward
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 08:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
95 words
An encapsulated module comprising; a semiconductor chip (14) having a major surface with terminals (17) thereon disposed within an encapsulating material (19), a plurality of discrete, and continuous lead frame conductors (18) at spaced locations around said chip and cantilevered out of the encapsulating material, discrete wires (16) bonded to and connecting selected ones of said conductors to selected ones of said terminals, at least one of said lead frame conductors being connected to another one of said lead frame conductors by a discrete wire bonded to and connecting said one conductor and said conductor.
Claim 2
Dependent Claim
95 words
An encapsulated module comprising; a semiconductor chip (14) having a major surface with terminals (17) thereon disposed within an encapsulating material (19), a plurality of discrete, and continuous lead frame conductors (18) at spaced locations around said chip and cantilevered out of the encapsulating material, discrete wires (16) bonded to and connecting selected ones of said conductors to selected ones of said terminals, at least one of said lead frame conductors being connected to another one of said lead frame conductors by a discrete wire bonded to and connecting said one conductor and said conductor.
Claim 3
Dependent Claim
23 words
The module of claim 1, wherein said discrete wires, bonded between the lead frame conductors and the chip terminals, are formed of gold.
Claim 4
Dependent Claim
17 words
The module of claim 2 where said lead frame conductors are insulatively disposed upon said major surface.
Claim 5
Dependent Claim
28 words
The module of claim 1 wherein at least two of said lead frame conductors are provided with areas disposed to support wire bonding between said lead frame members.
Claim 6
Dependent Claim
18 words
The module of claim 4 wherein said areas are spaced from the ends of said lead frame conductors.
Claim 7
Dependent Claim
23 words
The module of claim 1, wherein said discrete wires, bonded between the lead frame conductors and the chip terminals, are formed of copper.
Claim 8
Dependent Claim
111 words
An encapsulated module comprising: a semiconductor chip having a major surface with terminals thereon disposed within an encapsulating material, a plurality of discrete and continuous lead frame conductors at spaced locations insulatively disposed on said major surface of said chip and cantilevered out of the encapsulating material, discrete wires bonded to and connecting selected ones of said lead frame conductors to selected ones of said terminals, at least one of said lead frame conductors being connected to another non-adjacent one of said lead frame conductors by a discrete wire bonded to and connecting said one conductor and said other conductor and passing over a third lead frame conductor without connection thereto.
Claim 9
Dependent Claim
111 words
An encapsulated module comprising: a semiconductor chip having a major surface with terminals thereon disposed within an encapsulating material, a plurality of discrete and continuous lead frame conductors at spaced locations insulatively disposed on said major surface of said chip and cantilevered out of the encapsulating material, discrete wires bonded to and connecting selected ones of said lead frame conductors to selected ones of said terminals, at least one of said lead frame conductors being connected to another non-adjacent one of said lead frame conductors by a discrete wire bonded to and connecting said one conductor and said other conductor and passing over a third lead frame conductor without connection thereto.
Claim 10
Dependent Claim
32 words
The module of claim 7 wherein at least two of said lead frame members, non-adjacent to one another, are provided with areas disposed to support wire bonding between said lead frame members.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.