EP0399161A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multi-level circuit card structure
Assignee: International Business Machines Corp
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Filing: 1990-03-21
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Granted: —
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Expires: 2010-03-21
Abstract
Abstract Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.
Inventors
- 👤 Mark Fielding Bregman
- 👤 Stephen Leslie Buchwalter
- 👤 Karl Hermann
- 👤 Caroline Ann Kovac
- 👤 Paige Adams Poore
- 👤 Alfred Viehbeck
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 05:40
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K3/44; H05K3/445; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W72/00; H10W90/00; H10W90/401; H05K1/0272; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/09554; H05K2201/09581; H05K2201/096; H05K2203/00; H05K2203/03; H05K2203/0323; H05K2203/04; H05K2203/041; H05K2203/11; H05K2203/1184; H05K2203/14; H05K2203/1438; H05K3/30; H05K3/32; H05K3/321; H05K3/325; H05K3/40; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
127 words
A structure comprising: a plurality of substrates (4, 6, 8, 10), each having a first (18, 22, 26, 30) and second (20, 24, 28, 32) major surface; each of said substrates having at least one conductive core (12), at least part of said at least one core is coated with a dielectric material (13); a conductor pattern (34) on at least one of said major surfaces of each of said substrates; a major surface of one of said plurality of substrates facing a major surface of an adjacent substrate; a plurality of connectors (42) disposed between and spacing apart adjacent substrates; and at least a part of said plurality of connectors electrically connecting a part of said conductor pattern on said major surface of said adjacent substrates.
Claim 2
Dependent Claim
127 words
A structure comprising: a plurality of substrates (4, 6, 8, 10), each having a first (18, 22, 26, 30) and second (20, 24, 28, 32) major surface; each of said substrates having at least one conductive core (12), at least part of said at least one core is coated with a dielectric material (13); a conductor pattern (34) on at least one of said major surfaces of each of said substrates; a major surface of one of said plurality of substrates facing a major surface of an adjacent substrate; a plurality of connectors (42) disposed between and spacing apart adjacent substrates; and at least a part of said plurality of connectors electrically connecting a part of said conductor pattern on said major surface of said adjacent substrates.
Claim 3
Dependent Claim
21 words
The structure of claim 1, wherein the conductor pattern of said substrate is electrically connected to the core of said substrate.
Claim 4
Dependent Claim
95 words
A structure comprising: a plurality of substrates (140, 142), each having a first and second major (146, 148) surface; each of said substrates having at least one conductive core (144, 150), at least part of said at least one core is coated with a dielectric material (156, 158); a major surface, having said dielectric coating thereon, of one of said plurality of substrates facing and adhering to a major surface, having said dielectric coating thereon, of an adjacent substrate; and a conductor pattern on at least one of the outside major surfaces of said structure.
Claim 5
Dependent Claim
95 words
A structure comprising: a plurality of substrates (140, 142), each having a first and second major (146, 148) surface; each of said substrates having at least one conductive core (144, 150), at least part of said at least one core is coated with a dielectric material (156, 158); a major surface, having said dielectric coating thereon, of one of said plurality of substrates facing and adhering to a major surface, having said dielectric coating thereon, of an adjacent substrate; and a conductor pattern on at least one of the outside major surfaces of said structure.
Claim 6
Dependent Claim
17 words
The structure of claim 3, further including an adhesive between the dielectric surfaces of the adjacent substrates.
Claim 7
Dependent Claim
26 words
The structure of any one of the preceding claims, wherein at least one core (12) is thermally conductive and/or at least one core is electrically conductive.
Claim 8
Dependent Claim
24 words
The structure of claim 5, wherein said core is a material selected from one or more of Cu, Al, Cu-Invar-Cu, Mo and alloys thereof.
Claim 9
Dependent Claim
27 words
The structure of any one of the preceding claims, wherein said core has a thickness from about 25.4 µm (1 mil) to about 1.016 mm (40 mils).
Claim 10
Dependent Claim
27 words
The structure of any one of the preceding claims, further including an electronic device electrically mounted onto said structure, preferably mounted in thermal contact to said structure.
Claim 11
Dependent Claim
37 words
The structure of any one of the preceding claims, wherein at least one of said substrates has at least one electrically conductive via (40, 162) therein to provide electrical connection between said first and second major surface.
Claim 12
Dependent Claim
54 words
The structure of claim 9, wherein at least one of said electrically conductive vias is electrically insulated from said at least one core, preferably formed from a through-hole in at least one of said substrates having an electrically insulating material disposed about the periphery of said through-hole and an electrically conductive material disposed thereover.
Claim 13
Dependent Claim
43 words
The structure of claim 9 or 10, wherein at least one of said electrically conductive vias is electrically connected to said at least one core, preferably formed from a through hole in said substrate having an electrically conductive material disposed about the periphery.
Claim 14
Dependent Claim
25 words
The structure of claim 11, wherein said dielectric material has a thickness of from about 2.54 µm (0.1 mil) to about 254 µm (10 mils).
Claim 15
Dependent Claim
35 words
The structure of any one of the preceding claims, wherein said dielectric material is a polymeric material, preferably selected from the group of a polyimide and a fluoropolymer, and most preferably a filled polymeric material.
Claim 16
Dependent Claim
28 words
The structure of any one of the preceding claims, wherein at least one of said plurality of connectors (42) is electrically connected to said at least one core.
Claim 17
Dependent Claim
53 words
The structure of any one of the preceding claims, wherein said connector is selected from the group consisting of a solder mound, a mound of conductive epoxy and a metal embedded in an elastomer, preferably said solder mound has a diameter from about 50.8 µm (2 mil) to about 508 µm (20 mils).
Claim 18
Dependent Claim
17 words
The structure of claim 9, wherein said electrically conductive material about said through-hole is a polymeric material.
Claim 19
Dependent Claim
20 words
The structure any one of the preceding claims, wherein said electrically insulating material about said through-hole is a polymeric material.
Claim 20
Dependent Claim
36 words
The structure of any one of the preceding claims 1, 2, and 5 to 17 1, wherein at least one of said substrates is the structure of any one of the preceding claims 3 to 17.
References Cited (Backward Citations)
No citation records indexed.
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