EP0397073A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Circuit pattern forming apparatus using mu-STM
Assignee: Olympus Corp
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Filing: 1990-05-07
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Granted: —
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Expires: 2010-05-07
Abstract
Abstract An apparatus for forming a predetermined circuit pattern on a circuit substrate (1) by using a µ-STM write head, the µ-STM write head comprising a write head substrate (31) having a flat surface, a plurality of micro chip electrodes (6) formed upright on the flat surface of the write head substrate (31) and constituting a µ-STM, a level of a distal end of each of the chip electrodes (6) being set to be constant, and scanning means for scanning the micro chip electrodes on the circuit substrate by moving the micro chip electrodes and the circuit substrate relative to each other in two-dimensional directions.
Inventors
- 👤 Hiroko Ohta
- 👤 Ryouhei Shimizu
- 👤 Toshihito Kouchi
- 👤 Akitoshi Toda
- 👤 Yasuo Isono
- 👤 Yoshiyuki Mimura
- 👤 Hiroshi Kajimura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 19:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0082; H05K3/10; H05K3/14; H05K3/146; B; B82; B82Y; B82Y10/00; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0121; H05K2203/13; H05K2203/1333; H05K2203/1338; H05K3/02; H05K3/06; H05K3/061; Y; Y10; Y10S; Y10S977/00; Y10S977/84; Y10S977/849; Y10S977/855; Y10S977/86; Y10S977/861; Y10S977/872; Y10S977/874; Y10S977/887
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
112 words
An apparatus for forming a predetermined circuit pattern on a circuit substrate (1) by using a µ-STM write head, said µ-STM write head comprising: a write head substrate having a flat surface (31); a plurality of micro chip electrodes (6) formed upright on the flat surface of said write head substrate (31) and constituting a µ-STM, a level of a distal end of each of said chip electrodes (6) being set to be constant; and scanning means (5X, 5Y, 34X, 34Y, 41) for scanning said micro chip electrodes (6) on the circuit substrate by moving said micro chip electrodes (6) and the circuit substrate (1) relative to each other in two-dimensional directions.
Claim 2
Independent Claim
112 words
An apparatus for forming a predetermined circuit pattern on a circuit substrate (1) by using a µ-STM write head, said µ-STM write head comprising: a write head substrate having a flat surface (31); a plurality of micro chip electrodes (6) formed upright on the flat surface of said write head substrate (31) and constituting a µ-STM, a level of a distal end of each of said chip electrodes (6) being set to be constant; and scanning means (5X, 5Y, 34X, 34Y, 41) for scanning said micro chip electrodes (6) on the circuit substrate by moving said micro chip electrodes (6) and the circuit substrate (1) relative to each other in two-dimensional directions.
Claim 3
Dependent Claim
57 words
An apparatus according to claim 1, characterized in that said scanning means includes two- or three-dimensional actuators (5X, 5Y) of the same number as that of said micro chip electrode (6), which are formed on the flat surface of said write head substrate 931), said micro chip electrodes (6) being respectively supported on said actuators (5X, 5Y).
Claim 4
Dependent Claim
42 words
An apparatus according to claim 2, characterized in that said actuators (5X, 5Y) and said micro chip electrodes (6) are arranged on the flat surface of said write head substrate (31) at a rate of not less than one to 9 mm².
Claim 5
Dependent Claim
37 words
An apparatus according to claim 2, characterized in that said plurality of micro chip electrodes (6) are connected in parallel with bias power sources, and said plurality of actuators are connected in parallel with scanning power sources.
Claim 6
Dependent Claim
43 words
An apparatus according to claim 2, characterized in that said scanning means includes, in addition to said actuators (5X, 5Y), an X-Y stage (41) for moving the circuit substrate (1) and said write head substrate (31) relative to each other in two-dimensional directions.
Claim 7
Dependent Claim
55 words
An apparatus according to claim 1, characterized in that said plurality of micro chip electrodes (6) are directly formed on the flat surface of said write head substrate (31), and are grouped into a plurality of micro chip electrode units each having the same number of micro chip electrodes (6) arranged in the same pattern.
Claim 8
Dependent Claim
36 words
An apparatus according to claim 6, characterized in that each of said micro chip electrode units comprises 100 small electrodes (6) arranged in a 100 µm × 100 µm region in the form of a matrix.
Claim 9
Dependent Claim
24 words
An apparatus according to claim 6, characterized in that said plurality of micro chip electrode units are connected in parallel with bias power sources.
Claim 10
Dependent Claim
30 words
An apparatus according to claim 6, characterized in that a bias voltage is independently applied to each of said micro chip electrodes (6) arranged in one micro chip electrode unit.
Claim 11
Dependent Claim
28 words
An apparatus according to claim 6, characterized in that said write head substrate (31) is fixed on a support member (33) including X- and Y-direction actuators (34X, 34Y).
Claim 12
Dependent Claim
104 words
A method of forming a plurality of circuit patterns on a circuit substrate (1) by direct writing, comprising the steps of: positioning a write head defined in claim 1 or 6 and the circuit substrate (1) to be close to each other; and applying a bias voltage to micro chip electrodes (6) of said write head in an atmosphere of a gaseous organometallic compound while moving said micro chip electrodes (6) and the circuit substrate (1) relative to each other in two-dimensional directions so as to dissociate the organometallic compound and liberate metal particles, and depositing the metal particles on the circuit substrate (1).
Claim 13
Dependent Claim
166 words
A method of forming a plurality of circuit patterns on a circuit substrate (1) by lithography, comprising the steps of: positioning a write head defined in claim 1 or 6 and the circuit substrate (1) having a resist film formed on a surface thereof to be close to each other; writing a pattern on the resist film by applying a bias voltage to micro chip electrodes (6) of said write head while moving said micro chip electrodes (6) and the circuit substrate (1) relative to each other in two-dimensional directions; forming a desired mask pattern on the circuit substrate (1) by developing the resist film on which the pattern is written; depositing a desired circuit material film by CVD, on the circuit substrate (1) having the mask pattern; and removing the mask pattern and the circuit material film deposited thereon so as to leave the circuit material film on portions of the surface of the circuit substrate (1) which are not covered with the mask pattern.
Claim 14
Dependent Claim
134 words
A method of forming a plurality of circuit patterns on a circuit substrate (1) by lithography, comprising the steps of: positioning a write head defined in claim 1 or 6 and the circuit substrate (1) having a circuit material film and a resist film sequentially stacked on a surface thereof to be close to each other; writing a pattern on the resist film by applying a bias voltage on micro chip electrodes (6) of said write head while moving said micro chip electrodes (6) and the circuit substrate (1) relative to each other; forming a desired mask pattern on the circuit substrate (1) by developing the resist film on which the pattern is written; and forming a desired circuit by etching the circuit material film by using said mask pattern as an etching mask.
References Cited (Backward Citations)
No citation records indexed.
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