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EP0396098A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of manufacturing base of electromagnetic relay

Assignee: Omron Corp
•
Filing: 1990-04-30
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Granted: —
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Expires: 2010-04-30
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Abstract

Abstract A method of manufacturing a base (3) of an elec­tromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of the resinous molded item (4) such that the resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting the upper terminal portion (5a) and the lower terminal portion (5c); molding integrally with the resinous molded item (4), resin disabling platirlg thereon such that at least surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion (5a), the lower terminal portion (5c) and the side terminal portion (5b).

Inventors

  • 👤 Katsumi Kawashima

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 15:05
CPC Classifications
H; H01; H01H; H01H50/00; H01H50/02; H01H50/023; H01H49/00

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 138 words
A method of manufacturing a base (3) of an elec­tromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of said resinous molded item (4) such that said resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting said upper terminal portion (5a) and said lower terminal portion (5c); molding integrally with said resinous molded item (4), resin disabling plating thereon such that at least surfaces of said upper terminal portion (5a), said lower terminal portion (5c) and said side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of said upper terminal portion (5a), said lower terminal portion (5c) and said side terminal portion (5b).
Claim 2
Independent Claim 138 words
A method of manufacturing a base (3) of an elec­tromagnetic relay, comprising the steps of: treating a surface of a resinous molded item (4) to a state enabling plating on the surface of said resinous molded item (4) such that said resinous molded item (4) has an upper terminal portion (5a), a lower terminal portion (5c) and a side terminal portion (5b) connecting said upper terminal portion (5a) and said lower terminal portion (5c); molding integrally with said resinous molded item (4), resin disabling plating thereon such that at least surfaces of said upper terminal portion (5a), said lower terminal portion (5c) and said side terminal portion (5b) are exposed outwardly; and plating an electrically conductive film on only the surfaces of said upper terminal portion (5a), said lower terminal portion (5c) and said side terminal portion (5b).
Claim 3
Dependent Claim 22 words
A method as claimed in Claim 1, further comprising the step of forming a recess (17) on said upper terminal portion (15a).

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