EP0389951A2
Expired / Lapsed
EP
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Heat resistant adhesive composition and bonding method using the same
Assignee: Resonac Corp
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Filing: 1990-03-21
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Granted: —
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Expires: 2010-03-21
Abstract
Abstract A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.
Inventors
- 👤 Eikichi Satou
- 👤 Junichi Imaizumi
- 👤 Hiroshi Nomura
- 👤 Kouichi Nagao
- 👤 Masakatsu Suzuki
- 👤 Koushi Sakairi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 02:52
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B7/00; B32B7/04; B32B7/12; B32B27/00; B32B27/28; B32B27/281; B32B38/00; B32B38/0008; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08L; C08L79/00; C08L79/04; C08L79/08; C08L79/085; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H01B3/306; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/281; H05K3/38; H05K3/386; B32B2310/00; B32B2310/14; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0358; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0759; H05K2203/09; H05K2203/095; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4635; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
74 words
A heat resistant adhesive composition comprising (A) a polyamic acid solution comprising a polyamic acid and a solvent, the polyamic acid being able to be converted into a polyimide having a glass transition temperature not higher than 260 °C by heating the polyamic acid to dehydrate the polyamic acid and (B) a bis-maleimide compound in an amount of from 20 to 60 parts by weight per 100 parts by weight of the polyamic acid.
Claim 2
Dependent Claim
74 words
A heat resistant adhesive composition comprising (A) a polyamic acid solution comprising a polyamic acid and a solvent, the polyamic acid being able to be converted into a polyimide having a glass transition temperature not higher than 260 °C by heating the polyamic acid to dehydrate the polyamic acid and (B) a bis-maleimide compound in an amount of from 20 to 60 parts by weight per 100 parts by weight of the polyamic acid.
Claim 3
Dependent Claim
72 words
The heat resistant adhesive composition as claimed in claim 1, wherein the polyamic acid has the repeating units represented by the following general formula (1): wherein R¹ is each R³, respectively, being hydrogen, a halogen or an alkyl group of from 1 to 4 carbon atoms and each X and Y, respectively, being each R⁴, respectively, being hydrogen, an alkyl group of from 1 to 4 carbon atoms or -CF³, R² is
Claim 4
Dependent Claim
62 words
The heat resistant adhesive composition as claimed in claim 2, wherein the polyamic acid has the repeating units represented by the following general formula (2): wherein each R³, respectively, is hydrogen, a halogen or an alkyl group of from 1 to 4 carbon atoms, and each R⁴, respectively, is hydrogen, an alkyl group of from 1 to 4 carbon atoms or -CF₃.
Claim 5
Dependent Claim
40 words
The heat resistant adhesive composition as claimed in any one of claims 1 to 3, wherein the polyamic acid has the repeating unit represented by the following formula: and the bis-maleimide compound has the structure represented by the following formula:
Claim 6
Dependent Claim
40 words
The heat resistant adhesive composition as claimed in any one of claims 1 to 3, wherein the polyamic acid has the repeating unit represented by the following formula: and the bis-maleimide compound has the structure represented by the following formula:
Claim 7
Independent Claim
210 words
A method of bonding two material bodies to each other comprising (a) coating a surface of at least one of the material bodies with a heat resistant adhesive composition, the heat resistant adhesive composition comprising (A) a polyamic acid solution comprising a polyamic acid and a solvent, the polyamic acid being able to be converted into a polyimide having a glass transition temperature not higher than 260 °C by heating the polyamic acid to dehydrate the polyamic acid and (B) a bis-maleimide compound in an amount of from 20 to 60 parts by weight per 100 parts by weight of the polyamic acid, (b) heating the heat resistant adhesive composition coating the surface of the at least one of the material bodies so that the solvent is removed from the heat resistant adhesive composition and conversion of the polyamic acid into the polyimide starts and proceeds, (c) bringing the coated surface of the at least one of the material bodies into contact with a surface of the other material body to form a composite, and (d) thermopressing the composite by simultaneously pressing the composite and heating the composite at a temperature not lower than the temperature for thermosetting of the bis-maleimide compound to convert the bis-maleimide compound into a poly-bis-maleimide.
Claim 8
Independent Claim
210 words
A method of bonding two material bodies to each other comprising (a) coating a surface of at least one of the material bodies with a heat resistant adhesive composition, the heat resistant adhesive composition comprising (A) a polyamic acid solution comprising a polyamic acid and a solvent, the polyamic acid being able to be converted into a polyimide having a glass transition temperature not higher than 260 °C by heating the polyamic acid to dehydrate the polyamic acid and (B) a bis-maleimide compound in an amount of from 20 to 60 parts by weight per 100 parts by weight of the polyamic acid, (b) heating the heat resistant adhesive composition coating the surface of the at least one of the material bodies so that the solvent is removed from the heat resistant adhesive composition and conversion of the polyamic acid into the polyimide starts and proceeds, (c) bringing the coated surface of the at least one of the material bodies into contact with a surface of the other material body to form a composite, and (d) thermopressing the composite by simultaneously pressing the composite and heating the composite at a temperature not lower than the temperature for thermosetting of the bis-maleimide compound to convert the bis-maleimide compound into a poly-bis-maleimide.
Claim 9
Dependent Claim
28 words
The method as claimed in claim 6, wherein one of the material body is a sheet of metal foil and the other material body is a polyimide film.
Claim 10
Dependent Claim
32 words
The method as claimed in claim 7, wherein the surface of the polyimide film which is to be bonded to the sheet of metal foil has been subjected to a plasma treatment.
Claim 11
Dependent Claim
53 words
The method as claimed in claim 6, wherein; the two material bodies are two two-layer flexible metal-clad laminates each of which is composed of a polyimide layer and a metal layer, the exposed surfaces of the polyimide layers having been subjected to a plasma treatment and being to be bonded to each other.
Claim 12
Dependent Claim
70 words
The method as claimed in claim 6, wherein; one of the two material bodies is a sheet of metal foil, and the other material body is a two-layer flexible metal-clad laminate which is composed of a polyimide layer and a metal layer, the exposed surface of the polyimide film having been subjected to a plasma treatment and being to be bonded to a surface of the sheet of metal foil.
Claim 13
Independent Claim
39 words
The method as claimed in any of the claims 6 to 10, wherein the thermopressing of the composite is carried out by passing the composite through a pair of rolls at least one of which is a heating roll.
Claim 14
Dependent Claim
75 words
The method as claimed in claim 6, wherein; one of the two material bodies is a sheet of polyimide film, and the other material body is a two-layer flexible printed board which is composed of a polyimide layer and a metal circuit layer, a surface of the polyimide film having been subjected to a plasma treatment and being to be bonded to the exposed surface of the metal circuit layer of the flexible printed board.
Claim 15
Dependent Claim
21 words
A double-sided flexible metal-clad laminate which is producible by the method as claimed in any of the claims 9 to 11.
Claim 16
Dependent Claim
18 words
A flexible printed board with coverlay film which is producible by the method as claimed in claim 12.
References Cited (Backward Citations)
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