EP0385474A2
Expired / Lapsed
EP
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Method of and apparatus for inspecting printed circuit boards
Assignee: Omron Corp
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Filing: 1990-03-01
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Granted: —
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Expires: 2010-03-01
Abstract
Abstract Disclosed is a method of and apparatus for inspecting a printed circuit board (PCB) for the nature of its soldered parts comprising three ring-shaped light sources which project light of different hues, the highest light source being any hue other than red, to a part mounted on a PCB at different angles and heights from above, a camera to record the reflected images, and a procedure used to check the recorded patterns to determine if the soldering is acceptable.
Inventors
- 👤 Shigeki C/O Omron Corporation Kobayashi
- 👤 Norihito C/O Omron Corporation Yamamoto
- 👤 Koichi C/O Omron Corporation Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 21:30
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/302; G01R31/308; G01R31/309; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/95; G01N21/956; G01N21/95684
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
122 words
A printed circuit board (PCB) inspecting apparatus for inspecting a part mounted on a PCB for the nature of its soldered portion, comprising: a light projecting means including a plurality of ring-shaped light sources for directing light of different hues to said part obliquely from above at different angles of incidence; the top light source comprising any hue other than red; an imaging means including a color camera located in the center of the ring-shaped light sources and directly over the part for imaging reflected light from the surface of said portion to be inspected; and a determining and processing means for detecting the nature of the soldered portion by an imaged pattern obtained by the imaging means to determine soldering acceptability.
Claim 2
Dependent Claim
122 words
A printed circuit board (PCB) inspecting apparatus for inspecting a part mounted on a PCB for the nature of its soldered portion, comprising: a light projecting means including a plurality of ring-shaped light sources for directing light of different hues to said part obliquely from above at different angles of incidence; the top light source comprising any hue other than red; an imaging means including a color camera located in the center of the ring-shaped light sources and directly over the part for imaging reflected light from the surface of said portion to be inspected; and a determining and processing means for detecting the nature of the soldered portion by an imaged pattern obtained by the imaging means to determine soldering acceptability.
Claim 3
Dependent Claim
16 words
The apparatus according to claim 1, wherein said light projecting means comprises three ring-shaped light sources.
Claim 4
Dependent Claim
19 words
The apparatus according to claim 2, wherein said ring-shaped light sources comprise the hues of green, red and blue.
Claim 5
Dependent Claim
22 words
The apparatus according to claim 3, wherein said ring-shaped light sources are comprised of different radii and different heights from the PCB.
Claim 6
Dependent Claim
27 words
The apparatus according to claim 4, wherein said radii are smallest at the greatest height from the PCB and largest at the least height from the PCB.
Claim 7
Dependent Claim
20 words
The apparatus according to claim 5, wherein said ring-shaped light source at the greatest height from the PCB is green.
Claim 8
Dependent Claim
20 words
The apparatus according to claim 5, wherein said ring-shaped light source at the greatest height from the PCB is blue.
Claim 9
Independent Claim
114 words
A method for inspecting a PCB for determining if lands are in the proper locations, surface mounted devices are mounted correctly to said lands, and if leads of said surface mounted devives are correctly soldered to said lands, wherein a light projecting means projects different hues of light at a PCB, the top light source comprising any hue other than red, the incident reflection of said light on an imaging means maintains its distinct hue when incident from a smooth surface such as solder and mixes to become white light when incident from a rough surface such as epoxy resin, and a determining and processing means that compares feature parameters of said incident reflections.
Claim 10
Independent Claim
114 words
A method for inspecting a PCB for determining if lands are in the proper locations, surface mounted devices are mounted correctly to said lands, and if leads of said surface mounted devives are correctly soldered to said lands, wherein a light projecting means projects different hues of light at a PCB, the top light source comprising any hue other than red, the incident reflection of said light on an imaging means maintains its distinct hue when incident from a smooth surface such as solder and mixes to become white light when incident from a rough surface such as epoxy resin, and a determining and processing means that compares feature parameters of said incident reflections.
References Cited (Backward Citations)
No citation records indexed.
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