EP0384586A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High reliability plastic package for integrated circuits
Assignee: Texas Instruments Inc
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Filing: 1990-01-30
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Granted: —
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Expires: 2010-01-30
Abstract
Abstract A high reliability plastic package (30) which includes palladium plated and solder dipped leads (18) for electrical connection to electrical components as well as a support (10) for electrically contacting a seminconductor integrated circuit device is disclosed. A method for manufacturing such package is also disclosed.
Inventors
- 👤 Robert N. Mclelland
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 06:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/40; H10W70/456; H10W70/457; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
29 words
A high reliability plastic package comprising: (a) palladium plated and solder coated leads for electrical connection to electrical components; and (b) support for electrically contacting a semiconductor integrated circuit.
Claim 2
Dependent Claim
29 words
A high reliability plastic package comprising: (a) palladium plated and solder coated leads for electrical connection to electrical components; and (b) support for electrically contacting a semiconductor integrated circuit.
Claim 3
Dependent Claim
16 words
The package according to claim 1 wherein the solder coated leads are fabricated by solder dipping.
Claim 4
Dependent Claim
16 words
The package according to claim 1 wherein the solder coated leads are fabricated by solder plating.
Claim 5
Dependent Claim
21 words
The package according to claim 1 wherein the leads include solder coated palladium plated external leads for electrical connection electronic parts.
Claim 6
Dependent Claim
21 words
The package according to claim 1 wherein the leads are plated with a palladium alloy having a high surface free energy.
Claim 7
Dependent Claim
24 words
The package according to claim 1 wherein the leads are plated with a palladium and nickel alloy which is 80% palladium and 20% nickel.
Claim 8
Dependent Claim
20 words
The package according to claim 1 wherein-the leads include palladium plated leads for electrical connection to the semiconductor integrated circuit.
Claim 9
Dependent Claim
13 words
The package according to claim 1 wherein, the semiconductor support is palladium plated.
Claim 10
Dependent Claim
31 words
The package according to claim 1 wherein the leads include a plurality of wires for electrically connecting the plurality of leads to a plurality of points on the semiconductor integrated circuit.
Claim 11
Dependent Claim
60 words
An integrated circuit device comprising: (a) palladium plated and solder coated leads for electrical connection to electrical components; and (b) a semiconductor integrated circuit; (c) a support for electrically containing a semiconductor integrated circuit; and (d )a plurality of wires for electrically connecting the plurality of palladium plated leads to a plurality of points on the semiconductor integrated circuit means.
Claim 12
Dependent Claim
60 words
An integrated circuit device comprising: (a) palladium plated and solder coated leads for electrical connection to electrical components; and (b) a semiconductor integrated circuit; (c) a support for electrically containing a semiconductor integrated circuit; and (d )a plurality of wires for electrically connecting the plurality of palladium plated leads to a plurality of points on the semiconductor integrated circuit means.
Claim 13
Dependent Claim
21 words
The integrated circuit device of claim 10 wherein the plurality of wires are bonded to the plurality of palladium plated leads.
Claim 14
Dependent Claim
26 words
The integrated circuit device according to claim 10 further comprising electrically conductive adhesive for electrically and mechanically connecting the semiconductor integrated circuit to the semiconductor support.
Claim 15
Dependent Claim
24 words
The integrated circuit device according to claim 10 further comprising a packaging medium for supporting and protecting the lead frame and semiconductor integrated circuit.
Claim 16
Dependent Claim
19 words
The integrated circuit device according to claim 10 wherein the plurality of wires are a plurality of gold wires.
Claim 17
Dependent Claim
14 words
The integrated circuit device according to claim 10 wherein the packaging medium is plastic.
Claim 18
Dependent Claim
33 words
The integrated circuit device according to claim 10 wherein the palladium plated lead and the palladium plated semiconductor support include nickel plated layer for preparing the lead and semiconductor support for palladium plating.
Claim 19
Dependent Claim
30 words
The integrated circuit device according to claim 10 wherein the palladium plated leads are palladium-nickel alloy plated leads and the palladium plated semiconductor support means is a palladiuim-nickel alloy support.
Claim 20
Dependent Claim
18 words
The integrated circuit device according to claim 10 wherein the solder coated leads are fabricated by solder dipping.
Claim 21
Dependent Claim
18 words
The integrated circuit device according to claim 10 wherein the solder coated leads are fabricated by solder plating.
Claim 22
Independent Claim
85 words
A method for fabricating a high reliabilty plastic package for an integrated circuit device, comprising the steps of; (a) palladium plating a lead frame; (b) placing an integrated circuit device on said lead frame; (c) electrically connecting said integrated circuit device to said lead frame; (d) forming a plastic package around around the integrated circuit device and selected portions of said lead frame thereby forming exposed leads; and (e) coating selected portions of the exposed leads with a solder for electrical connection to electrical components.
Claim 23
Independent Claim
85 words
A method for fabricating a high reliabilty plastic package for an integrated circuit device, comprising the steps of; (a) palladium plating a lead frame; (b) placing an integrated circuit device on said lead frame; (c) electrically connecting said integrated circuit device to said lead frame; (d) forming a plastic package around around the integrated circuit device and selected portions of said lead frame thereby forming exposed leads; and (e) coating selected portions of the exposed leads with a solder for electrical connection to electrical components.
Claim 24
Dependent Claim
13 words
The method according to claim 20 wherein the coating step is solder dipping.
Claim 25
Dependent Claim
13 words
The method according to claim 20 wherein the coating step is solder plating.
References Cited (Backward Citations)
No citation records indexed.
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