EP0384036A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste
Assignee: Resonac Corp
•
Filing: 1989-12-22
•
Granted: —
•
Expires: 2009-12-22
Abstract
Abstract A heat-resistant resin paste consisting essentially of a first organic liquid (A₁), a second organic liquid (A₂), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid (A₁) and the second organic liquid (A₂), and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid (A₁) but insoluble in the second organic liquid (A₂), the first organic liquid (A₁), the second organic liquid (A₂), and the heat-resistant resin (B) being brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.
Inventors
- 👤 Hiroshi C/O Ibaraki Laboratory Nishizawa
- 👤 Kenji C/O Ibaraki Laboratory Suzuki
- 👤 Yoshiyuki C/O Ibaraki Laboratory Mukoyama
- 👤 Tohru C/O Ibaraki Laboratory Kikuchi
- 👤 Hidetaka C/O Yamazaki Laboratory Sato
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 07:18
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; C; C08; C08L; C08L79/00; C08L79/04; C08L79/08; C08L77/00; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; C08L2201/00; C08L2201/02; C08L2201/56; C08L2205/00; C08L2205/02; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4673; H05K3/4676; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
99 words
A heat-resistant resin paste consisting essentially of a first organic liquid (A₁), a second organic liquid (A₂), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid (A₁) and the second organic liquid (A₂), and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid (A₁) but insoluble in the second organic liquid (A₂), the first organic liquid (A₁), the second organic liquid (A₂), and the heat-resistant resin (B) being brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
Claim 2
Dependent Claim
99 words
A heat-resistant resin paste consisting essentially of a first organic liquid (A₁), a second organic liquid (A₂), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid (A₁) and the second organic liquid (A₂), and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid (A₁) but insoluble in the second organic liquid (A₂), the first organic liquid (A₁), the second organic liquid (A₂), and the heat-resistant resin (B) being brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
Claim 3
Dependent Claim
22 words
The heat-resistant resin paste as claimed in claim 1, wherein the heat-resistant resin paste has a thixotropy index of at least 1.5.
Claim 4
Dependent Claim
32 words
The heat-resistant resin paste as claimed in claim 2, wherein the second organic liquid (A₂) is easier to evaporate out from the heat-resistant resin paste than the first organic liquid (A₁) is.
Claim 5
Dependent Claim
56 words
The heat-resistant resin paste as claimed in claim 3, the heat-resistant resin (B) is selected from the group consisting of polyamide resins, polyamide-imide resins, and polyimide resins, and the fine particles of a heat-resistant resin (C) are fine particles of a heat-resistant resin selected from the group consisting of polyamide resins, polyamide-imide resins, and polyimide resins.
Claim 6
Dependent Claim
68 words
The heat-resistant resin paste as claimed in claim 4, wherein the fine particles of a heat-resistant resin (C) are fine particles of a heat-resistant resin selected from the group consisting of polyamide resins, polyamide-imide resins, and polyimide resins, which fine particles are prepared by employing a non-aqueous dispersion polymerization technique for preparation of the heat-resistant resin and have an average particle size of 40 µ m or less.
Claim 7
Dependent Claim
47 words
An integrated circuit device wherein layer insulation is attained by at least one insulator layer interposed between two adjacent conductor layers, the insulator layer being made of a heat-resistant resin obtainable by heating the heat-resistant resin paste as claimed in any one of claims 1 to 5.
Claim 8
Dependent Claim
52 words
An integrated circuit device wherein surface protection of semiconductor chip is attained by a surface protecting layer fixedly covering the surface of the semiconductor chip, the surface protecting layer being made of a heat-resistant resin obtainable by heating the heat-resistant resin paste as claimed in any one of claims 1 to 5.
Claim 9
Dependent Claim
75 words
An integrated circuit device wherein layer insulation is attained by at least one insulator layer interposed between two adjacent conductor layers, and surface protection of semiconductor chip is attained by a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating the heat-resistant resin paste as claimed in any one of claims 1 to 5.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.