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EP0380326A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of manufacturing a semi-conductor device

Assignee: Seiko Epson Corp
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Filing: 1990-01-24
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Granted: —
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Expires: 2010-01-24
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Abstract

Abstract A semi-conductor device is manufactured by forming on a silicon substrate 101, source and drain diffusion layers 103 and 104, an insulation film 102, a gate film 105, a gate electrode 106 and an insulation film 107. A contact hole 108 is formed through the films 107 and 105 and a bottom electrode 109 for a ferro-electric film is formed on the film 107 and in the hole 108. A ferro-electric film 110 of PbTiO₃ or PZT or PLZT is sputtered onto the electrode 109 and film 107 and it is treated by ion implantation of Pb to correct the composition thereof to stoichiometric composition. Thereafter, annealing takes place at above 500°C to improve the crystalline characteristics of the film. A top electrode 111 is formed on the shaped film 110 and the whole protected by a passivation layer 112.

Inventors

  • 👤 Kazuhiro Takenaka

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-28 17:39
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/06; C23C14/08; C23C14/088; H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6938; H10P14/69398; H01; H01G; H01G4/00; H01G4/002; H01G4/018; H01G4/06; H01G4/08; H01G4/12; H01G4/1272; H10B; H10B53/00; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6329; H10P14/65; H10P14/6516; H10P14/6529; H10P14/66; H10P14/668; H10P30/00; H10P30/40

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 30 words
A method of manufacturing a semi-conductor device, comprising the steps of forming a ferro-electric film (110) in the device, and treating the film (110) to improve the stoichiometric composition thereof.
Claim 2
Independent Claim 30 words
A method of manufacturing a semi-conductor device, comprising the steps of forming a ferro-electric film (110) in the device, and treating the film (110) to improve the stoichiometric composition thereof.
Claim 3
Dependent Claim 24 words
A method as claimed in claim 1, wherein the treatment comprises doping the film (110) by ion implantation after formation of the film (110).
Claim 4
Dependent Claim 15 words
A method as claimed in claim 2, wherein the doped film (110) is thereafter annealed.
Claim 5
Dependent Claim 14 words
A method as claimed in claim 3, wherein the anneal temperature is above 500°C.
Claim 6
Dependent Claim 15 words
A method as claimed in claim 3, wherein annealing is performed by rapid thermal anneal.
Claim 7
Dependent Claim 18 words
A method as claimed in claim 4 or 5, wherein annealing is performed in an atmosphere containing ozone.
Claim 8
Dependent Claim 34 words
A method as claimed in claim 1 wherein the film (110) is formed by sputtering, and the treatment comprises using a sputtering atmosphere containing an element for improving the stoichiometric composition of the film.
Claim 9
Dependent Claim 25 words
A method as claimed in claim 1, wherein the film (110) is formed by sputtering, and the treatment comprises using a sputtering atmosphere containing ozone.
Claim 10
Dependent Claim 29 words
A method as claimed in claim 1, wherein the film (110) is formed by sputtering, and the treatment comprises using a sputtering atmosphere containing lead or a lead compound.
Claim 11
Dependent Claim 20 words
A method as claimed in claim 9 wherein the sputtering atmosphere contains at least one of PbCl₄, Pb(C₂H₅)₄ and Pb₂O(OH)₂.
Claim 12
Dependent Claim 25 words
A method as claimed in claim 1, wherein the film (110) is formed by sputtering, and the treatment comprises annealing in an atmosphere containing ozone.
Claim 13
Independent Claim 25 words
A method as claimed in any preceding claim, wherein the main component of the ferro-electric film is at least one of PbTiO₃, PZT(PbTiO₃/PbZrO₃) and PLZT(La/PbTiO₃/PbZrO₃).

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