EP0377932A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Package of semiconductor integrated circuits
Assignee: Mitsubishi Electric Corp
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Filing: 1989-04-11
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Granted: —
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Expires: 2009-04-11
Abstract
Abstract Disclosed is a semiconductor integrated circuit device of a multi-layer type having a plurality of semiconductor chips (1, 2). The device comprises a plurality of semiconductor chips each having a plurality of electrode pads (11, 21) and arranged in such a manner as to form a multi-layer structure, a plurality of wiring films (3, 4) which are arranged in correspondence with the semiconductor chips (1, 2) and on which the corresponding semiconductor chips are mounted, a plurality of first terminals (31, 41) provided in each of the wiring films and respectively connected to the plurality of electrode pads (11, 21) of the semiconductor chip (1, 2) corresponding to the wiring film (3, 4), and a plurality of second terminals (32, 42) provided outside the first terminals of each wiring film and electrically connected to the respective first terminals.
Inventors
- 👤 Satoru C/O Lsi Kenkyusho Kishida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 04:58
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W70/00; H10W70/60; H10W72/00; H10W72/701; H10W90/811; H10W46/00; H10W72/071; H10W72/077; H10W90/20; H10W90/22; H10W90/297; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
106 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor chips each having a plurality of electrode pads and arranged in such a manner as to form a multi-layer structure; a plurality of wiring films arranged in correspondence with the semiconductor chips and adapted to be used for mounting the corresponding semiconductor chips; a plurality of first terminals provided in each of said wiring films and respectively connected to the plurality of electrode pads of the semiconductor chip corresponding to the wiring film; and a plurality of second terminals provided outside said first terminals of each wiring film and electrically connected to the corresponding first terminals.
Claim 2
Dependent Claim
106 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor chips each having a plurality of electrode pads and arranged in such a manner as to form a multi-layer structure; a plurality of wiring films arranged in correspondence with the semiconductor chips and adapted to be used for mounting the corresponding semiconductor chips; a plurality of first terminals provided in each of said wiring films and respectively connected to the plurality of electrode pads of the semiconductor chip corresponding to the wiring film; and a plurality of second terminals provided outside said first terminals of each wiring film and electrically connected to the corresponding first terminals.
Claim 3
Dependent Claim
30 words
A device as claimed in claim 1, wherein second terminals which are provided in different wiring films and which deal with the same signal are electrically connected to each other.
Claim 4
Dependent Claim
19 words
A device as claimed in claim 2, wherein said second terminals are disposed in one and the same plane.
Claim 5
Dependent Claim
38 words
A device as claimed in claim 1, wherein an upper wiring film is provided, directly above a second terminal of a lower wiring film, with an opening for leading out said second terminal of said lower wiring film.
Claim 6
Dependent Claim
28 words
A device as claimed in claim 1, wherein a middle wiring film has an opening for connecting second terminals of upper and lower wiring films to each other.
Claim 7
Dependent Claim
27 words
A device as claimed in claim 1, further comprising connecting terminals extending through wiring films and adapted to lead out second terminals of lower wiring films upwardly.
Claim 8
Dependent Claim
33 words
A device as claimed in claim 1, further comprising radiation plates adhered to those sides of the semiconductor chips which are opposite to those with which they are mounted on the wiring films.
Claim 9
Dependent Claim
37 words
A device as claimed in claim 7, further comprising electrodes formed on those surfaces of the semiconductor chips with which they are adhered to said radiation plates, said radiation plates being made of an electrically conductive material.
Claim 10
Dependent Claim
27 words
A device as claimed in claim 1, further comprising a resin package for molding in place said plurality of semiconductor chips and said plurality of wiring films.
Claim 11
Dependent Claim
42 words
A device as claimed in claim 9, further comprising pins, one end of each of which is connected to one end of a second terminal to be led out, and the other ends of which are led out of said resin package.
Claim 12
Dependent Claim
20 words
A device as claimed in claim 1, wherein each of said wiring films includes a film body made of polyimide.
Claim 13
Dependent Claim
15 words
A device as claimed in claim 7, wherein said radiation plates are made of Cu.
Claim 14
Dependent Claim
15 words
A device as claimed in claim 7, wherein said radiation plates are made of Al.
Claim 15
Dependent Claim
40 words
A semiconductor integrated circuit device substantially as hereinbefore described with reference to Figures 1a, 1b and 2a, or Figures 1a, 1b and 2a as modified by Figure 2b, or any one of Figures 3 to 7 of the accompanying drawings.
Claim 16
Dependent Claim
40 words
A semiconductor integrated circuit device substantially as hereinbefore described with reference to Figures 1a, 1b and 2a, or Figures 1a, 1b and 2a as modified by Figure 2b, or any one of Figures 3 to 7 of the accompanying drawings.
References Cited (Backward Citations)
No citation records indexed.
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