EP0373501A2
Expired / Lapsed
EP
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Fine polishing composition for wafers
Assignee: EIDP Inc
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Filing: 1989-12-07
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Granted: —
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Expires: 2009-12-07
Abstract
Abstract A fine polishing compound for polishing a silicon wafer used as a substrate crystal in electrical integrated circuits, which comprises water, colloidal silica particles, a water-soluble polymeric compound, and a water-soluble salt.
Inventors
- 👤 Shigeo Kanayama Jutaka-6-54 Sasaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 23:14
CPC Classifications
C; C09; C09G; C09G1/00; C09G1/02; C09G1/04; H; H10; H10P; H10P52/00; H10P52/40; H10P52/402; H10P90/00; H10P90/12; H10P90/129
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
21 words
A fine polishing compound for polishing a wafer comprising water, colloidal silica particles, a water-soluble polymeric compound, and a water-soluble salt.
Claim 2
Dependent Claim
21 words
A fine polishing compound for polishing a wafer comprising water, colloidal silica particles, a water-soluble polymeric compound, and a water-soluble salt.
Claim 3
Dependent Claim
46 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein said colloidal silica particles have an average particle diameter of 5 millimicrons to 500 millimicrons and on the surface thereof have silanol groups in a surface density of 1 to 10 groups/nm².
Claim 4
Dependent Claim
92 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein said water-soluble polymeric compound has a molecular weight of 100,000 or more and comprises one or more types selected from the group consisting of polyethylene oxide, polyacrylamide, polyvinylpyrrolidone, hydroxypropylcellulose, polyacrylic acid, polymethacrylic acid, polyitaconic acid, polymaleic acid, a copolymer of maleic acid and a vinyl monomer, guar gum, a graft copolymer of guar gum with a vinyl monomer, a graft copolymer of xanthane gum with a vinyl monomer, chondroitin sulfuric acid, hyaluronic acid, schizophyllan, mannan, and geran gum.
Claim 5
Dependent Claim
43 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein said water-soluble polymeric compound is selected from the group consisting of polyacrylamide, a copolymer of acrylamide and acrylic acid, a graft copolymer of guar gum with acrylamide, and schizophyllan.
Claim 6
Dependent Claim
59 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein said water-soluble salt comprises one or more combinations of a cation selected from the group consisting of lithium, sodium, potassium, cesium, and ammonium, and an anion selected from the group consisting of fluoride, chloride, bromide, iodide, sulfate, nitrate, perchlorate, carbonate, formate, acetate, acrylate, and oxalate.
Claim 7
Dependent Claim
29 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein said water-soluble salt is selected from the group consisting of potassium chloride and potassium perchlorate.
Claim 8
Dependent Claim
48 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 containing said colloidal silica in an amount of 0.1 weight %, said water-soluble polymeric compound in an amount of 1 ppm or more, and said water-soluble salt in an amount of 20 ppm or more.
Claim 9
Dependent Claim
27 words
The fine polishing compound for polishing a wafer as claimed in Claim 1 wherein pH value of said fine polishing compound is adjusted to 8 to 12.
References Cited (Backward Citations)
No citation records indexed.
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