EP0359562A2
Expired / Lapsed
EP
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Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition
Assignee: Rohm and Haas Co
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Filing: 1989-09-14
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Granted: —
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Expires: 2009-09-14
Abstract
Abstract A modified latex polymer adhesive composition for use in the fabrication of flexible electronic circuitry is made by (a) preparing by emulsion polymerization an initial aqueous dispersion of an initial water-insoluble latex polymer of at least one ethylenically unsaturated monomer which comprises 0 to 2% by weight of multi-alpha, beta-ethylenically unsaturated monomer, the initial latex polymer containing essentially no other sites of ethylenic unsaturation, (b) dispersing in said initial aqueous dispersion of initial water-insoluble latex polymer additional ethylenically unsaturated monomer comprising at least one monomer having at least two sites of alpha, beta-ethylenic unsaturation, whereby said additional monomer swells said initial latex polymer, and (c) polymerizing said additional monomer within said monomer swollen initial latex polymer to form said modified water-insoluble latex polymer.
Inventors
- 👤 Yen-Yau Harrison Chao
- 👤 Reginald T. Smart
- 👤 Albert Steven Will
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 13:03
CPC Classifications
C; C09; C09J; C09J151/00; C09J151/04; C09J151/003; C08; C08F; C08F265/00; C08F265/04; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
161 words
A process for making flexible electronic circuitry, comprising the use as a laminating adhesive of an aqueous dispersion of a modified water-insoluble latex polymer, wherein said polymer is prepared by the process comprising: (a) preparing by emulsion polymerization an initial aqueous dispersion of an initial water-insoluble latex polymer of at least one ethylenically unsaturated monomer, wherein said ethylenically unsaturated monomer comprises 0 to two percent by weight, based on the total weight of said ethylenically unsaturated monomer, of multi- alpha , beta -ethylenically unsaturated monomer and wherein said initial water-insoluble latex polymer otherwise contains essentially no sites of ethylenic unsaturation, (b) dispersing in said initial aqueous dispersion of initial water-insoluble latex polymer additional ethylenically unsaturated monomer comprising at least one monomer having at least two sites of alpha , beta -ethylenic unsaturation, whereby said additional monomer swells said initial latex polymer, and (c) polymerizing said additional monomer within said monomer swollen initial latex polymer to form said modified water-insoluble latex polymer.
Claim 2
Dependent Claim
161 words
A process for making flexible electronic circuitry, comprising the use as a laminating adhesive of an aqueous dispersion of a modified water-insoluble latex polymer, wherein said polymer is prepared by the process comprising: (a) preparing by emulsion polymerization an initial aqueous dispersion of an initial water-insoluble latex polymer of at least one ethylenically unsaturated monomer, wherein said ethylenically unsaturated monomer comprises 0 to two percent by weight, based on the total weight of said ethylenically unsaturated monomer, of multi- alpha , beta -ethylenically unsaturated monomer and wherein said initial water-insoluble latex polymer otherwise contains essentially no sites of ethylenic unsaturation, (b) dispersing in said initial aqueous dispersion of initial water-insoluble latex polymer additional ethylenically unsaturated monomer comprising at least one monomer having at least two sites of alpha , beta -ethylenic unsaturation, whereby said additional monomer swells said initial latex polymer, and (c) polymerizing said additional monomer within said monomer swollen initial latex polymer to form said modified water-insoluble latex polymer.
Claim 3
Dependent Claim
26 words
Process according to claim 1 wherein step (c) is not begun until after said initial latex polymer is swollen substantially to equilibrium with said additional monomer.
Claim 4
Dependent Claim
26 words
Process according to claim 1 or 2 wherein said initial latex polymer comprises from 70 to 95% by solid weight of said modified water-insoluble latex polymer.
Claim 5
Dependent Claim
40 words
Process according to claim 1 or 2 wherein said initial latex polymer comprises from 60 to 84 parts by weight C₁-C₁₂ alkyl acrylates or methacrylates, 0.1 to 6 parts by weight carboxylic acid monomer(s), and 15 to 40 parts acrylonitrile.
Claim 6
Dependent Claim
15 words
Process according to claim 4 wherein said carboxylic acid monomer is an acryloxy carboxylic acid.
Claim 7
Dependent Claim
28 words
Process according to any preceing claim wherein said additional ethylenically-unsaturated monomer comprises 25 to 100% by weight of monomer having at least two sites of alpha, beta-ethylenic unsaturation.
Claim 8
Dependent Claim
17 words
Process according to claim 6 wherein said additional ethylenically-unsaturated monomer comprises about 100% by weight 1,3-butyleneglycol dimethacrylate.
Claim 9
Dependent Claim
26 words
Process according to claim 6 wherein said additonal ethylenically-unsaturated monomer comprises about 75% by weight methyl methacrylate or isobornylmethacrylate and about 25% by weight 1,3-butyleneglycol dimethacrylate.
Claim 10
Dependent Claim
28 words
Process according to any preceding claim wherein said aqueous dispersion contains up to 10% by weight, based on polymer solids, of epoxy resin, difunctional amines or mixtures thereof.
References Cited (Backward Citations)
No citation records indexed.
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