EP0358517A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Compositions including a phenolic resin and a sensitizer
Assignee: Enzymol International Inc
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Filing: 1989-09-08
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Granted: —
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Expires: 2009-09-08
Abstract
Abstract A composition is described which comprises a phenolic resin and a sensitizer effective, when exposed to actinic radiation, to provide alkali solubility to said composition. The resin is represented by the formula (I) or (II): wherein R is a hydrogen atom, a halogen atom, an alkyl group, an alkoxyl group, an alkaryl group or an aryl group, and R may be the same or different within the polymer; R′ is a silyl group; and n and n′+m are greater than 3. The composition may be used as a photoresist and exhibits high thermal and plasmal resistance and good dissolution characteristics.
Inventors
- 👤 Rong-Chang Liang
- 👤 Alexander R. Pokora
- 👤 William L. Cyrus
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 08:34
CPC Classifications
G; G03; G03C; G03C1/00; G03C1/72; G03F; G03F7/00; G03F7/004; G03F7/039; G03F7/075; G03F7/0757; G03F7/0758
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
83 words
A composition comprising a phenolic resin and a sensitizer, said sensitizer being effective when exposed to actinic radiation, to render said composition alkaline soluble, said phenolic resin being represented by the formula (I) or (II): wherein R is a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an alkaryl group, an aryl group or a silyl group, and may be the same or different within the polymer; R′ is a silyl group; and n and n′+m are greater than 2.
Claim 2
Dependent Claim
32 words
A composition according to Claim 1 wherein said resin is represented by the formula (IA) or (IIA) where R, R′, n, n′ and m are defined as in formulas (I) and (II).
Claim 3
Dependent Claim
27 words
A composition according to Claims 1 or 2, wherein the ratio of said resin to said sensitizer is generally in the range of from 60:40 to 90:10.
Claim 4
Dependent Claim
26 words
A composition according to any preceding claim, wherein R is selected from hydroxy substituted phenyl groups, p-hydroxy-α, α-dimethylbenzyl groups, trialkylsilylphenyl groups, trialkylsiloxyphenyl groups, and trialkylsilyl groups.
Claim 5
Dependent Claim
24 words
A composition according to any preceding claim, wherein the molecular weight of said resin is generally in the range of from 600 to 5,000.
Claim 6
Dependent Claim
19 words
A composition according to any preceding claim, wherein at least one of R and R′ is a silyl group.
Claim 7
Dependent Claim
18 words
A composition according to any preceding claim, wherein said sensitizer is a diazoquinone or a napthaquinone diazide sensitizer.
Claim 8
Dependent Claim
21 words
A composition according to any of Claims 1 to 6, wherein said sensitizer is a poly(butylene sulfone) or a polymethyl methacrylate.
Claim 9
Dependent Claim
47 words
A positive-working photoresist composition comprising a composition according to any preceding claim, wherein said resin is prepared by reacting a phenol with a peroxidase enzyme in the presence of a peroxide or with an oxidase enzyme in the presence of oxygen in an organic solvent containing medium.
Claim 10
Dependent Claim
23 words
A composition according to Claim 9, wherein said enzyme is selected from horseradish peroxidase, chloroperoxidase, lactoperoxidase, bacterial peroxidases, ligninases, fungal laccase and tyrosinase.
Claim 11
Dependent Claim
37 words
A composition according to Claim 9 of Claim 10, wherein said reacting step occurs in the presence of a peroxide and wherein said peroxide is selected from hydrogen peroxide, methyl peroxide, ethyl peroxide and higher alkyl peroxides.
Claim 12
Dependent Claim
34 words
A composition according to any of Claims 9, 10 or 11, wherein said organic solvent is selected from hexane, trichloroethane, methyl ethyl ketone, ethyl acetate, butanol, ethanol, methanol, dioxane, tetrahydrofuran, dimethyl foramide and acetone.
Claim 13
Dependent Claim
32 words
A material useful in producing a microelectronic component comprising: a substrate having front and back surfaces, a coating on said front surface, said coating comprising a composition according to any preceding claim.
Claim 14
Dependent Claim
38 words
A material according to Claim 13, wherein said substrate is made of a material selected from aluminium, copper, magnesium, zinc, GaAs, glass, metal coated glass, poly(alkyl methacrylates), polyesters, poly(vinyl acetals), polyamides, cellulose esters, silicon dioxide and silicon nitride.
Claim 15
Dependent Claim
13 words
A material according to Claim 13, wherein said substrate is a silicon wafer.
Claim 16
Dependent Claim
24 words
A material according to any of Claims 13, 14 or 15, wherein a planarizing layer is interposed between said substrate and said photoresist composition.
Claim 17
Dependent Claim
44 words
A material according to any of Claims 13 to 16, wherein said component is useful in preparing a semiconductor chip, the thickness of said coating being between about 0.1 and 20 microns, and preferably generally in the region of from 1 to 2 microns.
Claim 18
Dependent Claim
41 words
A process for forming a resist image which comprises image-wise exposing to actinic radiation a composition according to any of Claims 1 to 12, said composition forming a layer on a substrate, and developing said composition by image-wise removing said composition.
Claim 19
Dependent Claim
14 words
A process according to Claim 18, wherein said actinic radiation is electron beam radiation.
Claim 20
Dependent Claim
24 words
A process according to Claims 18 or 19, wherein the step of image-wise removing said composition includes treating said composition with an alkaline solution.
Claim 21
Dependent Claim
23 words
A process according to any of Claims 18, 19 or 20, wherein the said process includes the additional step of etching said substrate.
Claim 22
Dependent Claim
20 words
A process according to Claim 21, wherein said additional etching step includes subjecting said substrate to a plasma etching treatment.
Claim 23
Dependent Claim
16 words
A process for providing a printing plate, comprising a process according to Claims 21 or 22.
Claim 24
Dependent Claim
16 words
A process for providing a printed circuit, comprising a process according to Claims 21 or 22.
Claim 25
Dependent Claim
16 words
A process for providing a semiconductor chip, comprising a process according to Claims 21 or 22.
References Cited (Backward Citations)
No citation records indexed.
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