EP0356300A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High-density integrated-circuit carrier, and method of manufacturing same
Assignee: Bull SAS
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Filing: 1989-08-09
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Granted: —
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Expires: 2009-08-09
Abstract
Abstract Translated from French Sur le support TAB 10 comprenant une araignée TAB 13 collée sur un substrat préformé 15 et pourvue de pattes 12 dont les extrémités ILB reposent sur un cadre isolant 20, ce cadre est un élément rapporté sur les pattes, indépendant du substrat et d'épaisseur sensiblement moindre que celle du substrat. On the TAB support 10 comprising a TAB spider 13 bonded to a preformed substrate 15 and provided with lugs 12 whose ILB ends rest on an insulating frame 20, this frame is an element attached to the lugs, independent of the substrate and substantially thick less than that of the substrate.
Inventors
- 👤 Gérard Dehaine
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 06:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/01; H10W70/04; H10W70/047; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
EP0080041A2
Cited
EP0094716A1
Cited
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