EP0355913B1
Expired / Lapsed
EP
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Method of manufacturing a device
Assignee: Koninklijke Philips NV
•
Filing: 1989-08-15
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Granted: 1993-12-22
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Expires: 2009-08-15
Abstract
No abstract record available.
Inventors
- 👤 Udo Klaus Paul Biermann
- 👤 Gijsbertus Adrianus Cornelus Maria Spierings
- 👤 Franciscus Josephus Henri Maria Van Der Kruis
- 👤 Jan Haisma
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 23:51
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; C; C03; C03C; C03C19/00; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; Y; Y10; Y10S; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
151 words
A method of manufacturing a device, in which a layer of a light-conducting material is applied to a plane surface of a disc-shaped carrier body, characterized in that a carrier body is obtained having completely smooth and plane main surfaces which are completely parallel to each other, after which a plane main surface of a disc-shaped body which is composed of the light-conducting material is brought into contact with a main surface of the carrier body to form a permanent bond, after which the light-conductor body is ground mechanically to a thickness which exceeds the desired ultimate layer thickness by at least 50 µm, said body subsequently being subjected to alternate tribochemical and mechanical polishing treatments until a layer thickness is obtained which exceeds the desired ultimate layer thickness by approximately 10 µm, after which the body is polished tribochemically until the desired layer thickness of said light-conductor body is obtained.
Claim 2
Dependent Claim
130 words
A method as claimed in Claim 1, characterized in that the carrier body is provided with smooth, plane and parallel main surfaces by temporarily connecting the carrier body to a support member having accurately plane and parallel main surfaces, and a thickness which is at least 1/8 of the largest dimension of the carrier body, after which the free main surface of the carrier body is polished mechanically to a planeness of at least 0.5 µm, subsequently the carrier body is detached from the support member and the polished main surface is temporarily connected to the support member, after which the other maim surface of the carrier body is polished to a planeness of at least 0.5 µm, and a parallelism between the main surfaces of at least 0.5 µm.
Claim 3
Dependent Claim
18 words
A method as claimed in Claim 2, characterized in that the support member is made of quartz glass.
Claim 4
Independent Claim
30 words
A method as claimed in any one of the Claims 1 up to and including 3, characterized in that the light conductor body is made of a transparent crystalline material.
Claim 5
Independent Claim
28 words
A method as claimed in any one of the Claims 1 up to and including 3, characterized in that the light conductor body is made of quartz glass.
Claim 6
Dependent Claim
40 words
A method as claimed in Claim 4 or 5, characterized in that prior to bonding, the light conductor body is provided with optical elements on the side of the main surface to be bonded, and the main surface is planarized.
Claim 7
Independent Claim
30 words
A method as claimed in any one of the Claims 1 up to and including 6, characterized in that the carrier body is made of a material having semiconducting properties.
Claim 8
Dependent Claim
38 words
A method as claimed in Claim 7, characterized in that prior to bonding, the carrier body is provided with active semiconductor elements on the side of the main surface to be bonded, and the main surface is planarized.
Claim 9
Dependent Claim
35 words
A method as claimed in Claim 7 or 8, characterized in that the carrier body is provided with a silicon oxide layer on the main surface which is to be bonded to the light-conductor body.
References Cited (Backward Citations)
No citation records indexed.
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