EP0355602A2
Expired / Lapsed
EP
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Molding material for electroconductive IC parts
Assignee: Mitsui Toatsu Chemicals Inc
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Filing: 1989-08-10
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Granted: —
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Expires: 2009-08-10
Abstract
Abstract A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A-B-A′ type block copolymer elastomer.
Inventors
- 👤 Toru Ueki
- 👤 Masaji Yoshimura
- 👤 Kazuharu Kanezaki
- 👤 Takashi Satoh
- 👤 Ineo Iwata
- 👤 Susumu Kishi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 07:10
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/24; C; C08; C08K; C08K3/00; C08K3/02; C08K3/04; C08K5/00; C08K5/16; C08K5/34; C08L; C08L71/00; C08L71/08; C08L71/10; C08L71/12; C08L71/123
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
82 words
A molding material for electroconductive IC parts which has a heat distortion temperature of 130°C or more (under a bending stress of 18.5 kg/cm² in accordance with JIS-K7207) and a melt flow index of 3 g/10 minutes or more (under a load of 10 kg at 300°C in accordance with JIS-K7210) and which provides molded articles for IC parts having a surface specific resistance of 10⁷ Ω or less and which contains at least 50% by weight of a polyphenylene ether resin.
Claim 2
Dependent Claim
82 words
A molding material for electroconductive IC parts which has a heat distortion temperature of 130°C or more (under a bending stress of 18.5 kg/cm² in accordance with JIS-K7207) and a melt flow index of 3 g/10 minutes or more (under a load of 10 kg at 300°C in accordance with JIS-K7210) and which provides molded articles for IC parts having a surface specific resistance of 10⁷ Ω or less and which contains at least 50% by weight of a polyphenylene ether resin.
Claim 3
Dependent Claim
126 words
The molding material for electroconductive IC parts according to Claim 1 mainly comprising a resin composition which comprises 50 to 90% by weight of the polyphenylene ether resin in which an intrinsic viscosity measured in a chloroform solution at 25°C is from 0.45 to 0.5 dl/g, 1 to 20% y weight of an acid imide compound, 0 to 40% by weight of a high-impact polystyrene resin, 0 to 20% by weight of an A-B-A′ type block copolymer elastomer (where each of A and A′ is a polymerized vinyl aromatic hydrocarbon block, and B is a polymerized and conjugated diene block or a hydrogenated, polymerized and conjugated diene block), and 5 to 40% by weight of electroconductive carbon, the total of these components being 100% by weight.
Claim 4
Dependent Claim
86 words
The molding material for electroconductive IC parts according to Claim 1 mainly comprising a resin composition which comprises 50 to 90% by weight of the polyphenylene ether resin in which an intrinsic viscosity measured in a chloroform solution at 25°C is from 0.25 to 0.45 dl/g, 0 to 40% by weight of a high-impact polystyrene resin, 0 to 20% by weight of an A-B-A′ type block copolymer elastomer, and 5 to 40% by weight of electroconductive carbon, the total of these components being 100% by weight.
Claim 5
Dependent Claim
78 words
The molding material for electroconductive IC parts according to Claim 2 mainly comprising a resin composition which comprises 50 to 80% by weight of the polyphenylene ether resin, 3 to 20% by weight of an acid imide compound, 5 to 35% by weight of a high-impact polystyrene resin, 3 to 15% by weight of an A-B-A′ type block copolymer elastomer, and 5 to 15% by weight of electroconductive carbon, the total of these components being 100% by weight.
Claim 6
Dependent Claim
68 words
The molding material for electroconductive IC parts according to Claim 3 mainly comprising a resin composition which comprises 50 to 80% by weight of the polyphenylene ether resin, 5 to 35% by weight of a high-impact polystyrene resin, 3 to 15% by weight of an A-B-A′ type block copolymer elastomer, and 5 to 15% by weight of electroconductive carbon, the total of these components being 100% by weight.
Claim 7
Dependent Claim
82 words
The molding material for electroconductive IC parts according to Claim 1 wherein the polyphenylene ether resin is a homopolymer or a copolymer containing one or more kinds of units represented by the general formula wherein each of R₁, R₂, R₃ and R₄ is independently selected from the group consisting of hydrogen, a halogen, a hydrocarbon, a halohydrocarbon, a hydrocarbon oxy and a halohydrocarbon oxy, and n which indicates the total number of the monomer units is an integer of 20 or more.
Claim 8
Dependent Claim
19 words
The molding material for electroconductive IC parts according to Claim 6 wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene) ether.
Claim 9
Dependent Claim
34 words
The molding material for electroconductive IC parts according to Claim 1 wherein the acid imide compound is selected from the group consisting of succinimide, glutarimide, phthalimide, N-phenylphthalimide, N phenylmaleimide, N-cyclohexylmaleimide, N-(p-hydroxyphenyl)maleimide, N-(p-carboxyphenyl)maleimide and N-(p-chlorophenyl)maleimide.
Claim 10
Dependent Claim
50 words
The molding material for electroconductive IC parts according to Claim 1 wherein the A-B-A′ type block copolymer elastomer is a block copolymer of a vinyl aromatic hydrocarbon selected from the group consisting of styrene, α-methylstyrene, vinyltoluene, vinylxylene, ethylvinylxylene, vinylnaphthalene and mixtures thereof and a monomer selected from 1,3-butadiene and isoprene.
References Cited (Backward Citations)
No citation records indexed.
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