EP0352429A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High power, pluggable tape automated bonding package
Assignee: International Business Machines Corp
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Filing: 1989-05-24
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Granted: —
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Expires: 2009-05-24
Abstract
Abstract A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.
Inventors
- 👤 Harry R. Bickford
- 👤 Lawrence S. Mok
- 👤 Michael J. Palmer
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 08:19
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/68; H10W90/00; H10W90/401; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
215 words
A circuit package comprising: a flexible dielectric film (30) having an outer edge, back and front faces and an aperture (32) therein, said front face provided with a plurality of beam leads (31) affixed thereto, said beam leads extending into said aperture; a semiconductor chip (34) positioned in said aperture (32) and having back and front faces, said front face having electrical contacts connected to said beam leads, said chip oriented such that its back face and said back face of said dielectric film are similarly oriented; thermally conductive body means (10) having a well (18) therein, said well substantially circumscribed by an outer rim (20), the back face of said semiconductor chip thermally connected to said thermally conductive body means and said back face of said flexible dielectric film formed to conform to said well and said outer rim, whereby said beam leads also conform to said well and said outer rim and are thereby made available for electrical connection in the vicinity of said outer rim; and means for attaching said outer edge of said film (30) to said thermally conductive body means (10) outboard of said outer rim (20) to enable flexure of said beam leads (31) in the event of differential expansion or contraction at a point of electrical connection thereto.
Claim 2
Dependent Claim
215 words
A circuit package comprising: a flexible dielectric film (30) having an outer edge, back and front faces and an aperture (32) therein, said front face provided with a plurality of beam leads (31) affixed thereto, said beam leads extending into said aperture; a semiconductor chip (34) positioned in said aperture (32) and having back and front faces, said front face having electrical contacts connected to said beam leads, said chip oriented such that its back face and said back face of said dielectric film are similarly oriented; thermally conductive body means (10) having a well (18) therein, said well substantially circumscribed by an outer rim (20), the back face of said semiconductor chip thermally connected to said thermally conductive body means and said back face of said flexible dielectric film formed to conform to said well and said outer rim, whereby said beam leads also conform to said well and said outer rim and are thereby made available for electrical connection in the vicinity of said outer rim; and means for attaching said outer edge of said film (30) to said thermally conductive body means (10) outboard of said outer rim (20) to enable flexure of said beam leads (31) in the event of differential expansion or contraction at a point of electrical connection thereto.
Claim 3
Dependent Claim
29 words
The circuit package of claim 1 wherein the portion of said dielectric film which conforms with said outer rim is removed to allow said beam leads to conform thereto.
Claim 4
Dependent Claim
26 words
The circuit package of one of the preceding claims wherein said thermally conductive body. means (10) comprises a conductive, finned body thermally connected to said chip.
Claim 5
Dependent Claim
55 words
The circuit package of one of the preceding claims wherein said thermally conductive body means (10) comprises: a first insulating body portion (14) which includes said well (18); and a second conductive body portion (13) mating with said first body portion (14) and having an extension (16) therethrough which is thermally connected to said chip.
Claim 6
Dependent Claim
39 words
The circuit package of one of the preceding claims wherein said attachment means includes a grooved lip (22) arranged about an outer wall (21) of said well (18) for receiving the outer edge of said flexible dielectric film (30).
Claim 7
Dependent Claim
53 words
The circuit package of one of the preceding claims further comprising: an insulating material (55) covering said outer rim (20) and wherein the portion of said dielectric film (30) which conforms with said outer rim is removed to allow said beam leads (31) to conform to said outer rim over said insulating material.
Claim 8
Dependent Claim
24 words
The circuit package of claim 6 wherein a space (42) remains between said beam leads and said outer rim to enable relative movement therebetween.
Claim 9
Dependent Claim
32 words
The circuit package of one of the preceding claims wherein said attachment means further comprises adhesive (40) residing between said outer edge of said film and said outer wall of said well.
Claim 10
Dependent Claim
56 words
The circuit package of one of the preceding claims 1 to 3 wherein said thermally conductive body means (10) comprises a unitary heat sink (60) which includes said well (10) and comprises one single material and wherein an insulating material (55) encompasses said rim (20) to isolate said beam leads (31) from said heat sink (60).
Claim 11
Dependent Claim
35 words
The circuit package of one of the preceding claims wherein said beam leads (31) are direct connected to package means (52) by a female socket (61) which is provided with a plurality of contacts (62).
References Cited (Backward Citations)
No citation records indexed.
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