Holding device for a disc and its use

Abstract

Abstract The holding device for semiconductor slices (wafers) orients and secures the slice during transportation to the processing position but exposes the surface to be processed and secures the position of the wafer with the aid of a ring, which remains in the processing position, shortly before the processing position is reached. Under these conditions, the slice surface can be processed completely or with minimum shadowing and at the same time the transportation mechanism can be effectively protected from the processing, for example coating or etching. All the parts continuously exposed to the processing can easily be replaced. If the slice remains stuck in the processing station, it is pulled off by the positive-acting transportation safety device.

Inventors

• 👤 Eberhard Dr. Moll
• 👤 Renzo Zanardo

Bibliographic Details